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Universal Mobile TV Chip addresses multiple standards.


February 20, 2007 - Designed for handset manufacturers, Universal Broadcast Modem (UBM) chip delivers support for FLO(TM) technology, Digital Video Broadcasting - Handheld (DVB-H), and one-segment Integrated Services Digital Broadcasting - Terrestrial (ISDB-T). Single-chip solution supports entire UHF bandwidth, from 470-862 MHz, as well as single- and multi-frequency networks. Solution also offers tunable modes: 5, 6, 7, and 8 MHz channel bandwidths.

(Archive News Story - Products mentioned in this Archive News Story may or may not be available from the manufacturer.)

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QUALCOMM Announces Early Delivery of World's First Universal Mobile TV Chip


SAN DIEGO, Feb. 12 -- QUALCOMM Incorporated (NASDAQ:QCOM), a leading developer and innovator of Code Division Multiple Access (CDMA) and other advanced wireless technologies, today announced the Company's Universal Broadcast Modem (UBM) chip is sampling ahead of schedule. The UBM product delivers support for FLO(TM) technology, Digital Video Broadcasting -- Handheld (DVB-H) and one-segment Integrated Services Digital Broadcasting -- Terrestrial (ISDB-T) in a single chip, allowing handset manufacturers to address three of the world's leading standards with one solution. The early sampling accelerates the delivery of mobile TV capabilities to mass-market handsets around the world.

"QUALCOMM believes the adoption rate of mobile TV on handsets is poised to grow at an exponential rate, and we remain committed to supporting other standards that network operators may choose to deploy," said Mike Concannon, vice president of strategic products for QUALCOMM CDMA Technologies. "Our UBM product is designed to make handsets supporting mobile TV content into mass- market tiers and, once again, the engineering team at QUALCOMM is able to deliver ahead of schedule to meet our customers' requirements."

The UBM is designed as a companion to QUALCOMM's CDMA2000(R) and WCDMA/UMTS Mobile Station Modem(TM) (MSM(TM)) baseband chipsets. Specific performance features of the UBM solution include:

o Support for the entire UHF bandwidth -- 470 to 862 MHz

o Tunable modes 5, 6, 7 and 8 MHz channel bandwidths

o Support for single- and multi-frequency networks

Support for additional features, such as European L-band, is planned for future products. For more information, please visit www.cdmatech.com/ubm. QUALCOMM is planning to demonstrate UBM at 3GSM World Congress in Barcelona.

QUALCOMM Incorporated (www.qualcomm.com) is a leader in developing and delivering innovative digital wireless communications products and services based on CDMA and other advanced technologies. Headquartered in San Diego, Calif., QUALCOMM is included in the S&P 500 Index and is a 2006 FORTUNE 500(R) company traded on The Nasdaq Stock Market(R) under the ticker symbol QCOM.

QUALCOMM is a registered trademark of QUALCOMM Incorporated. Mobile Station Modem, MSM and FLO are trademarks of QUALCOMM Incorporated. CDMA2000 is a registered trademark of the Telecommunications Industry Association (TIA USA). All other trademarks are the property of their respective owners.

QUALCOMM Contacts:

Kira Lee, QUALCOMM CDMA Technologies
Phone: 1-858-845-7571
Email: qctpublicrelations@qualcomm.com

Tina Asmar, Corporate Communications
Phone: 1-858-845-5959
Email: corpcomm@qualcomm.com


Contacts:

Marketing:
Tina Asmar
USA
Phone: 858-845-5959
Send email  E-mail this person

General Information:
Kira Lee
USA
Phone: 858-845-7571
Send email  E-mail this person

Company Information:
Name: QUALCOMM, Inc.
Address: 5775 Morehouse Dr.
City: San Diego
State: CA
ZIP: 92121
Country: USA
Phone: 858-587-1121
FAX: 858-658-2100
http://www.qualcomm.com


More New Product News from this company:
WLAN IC improves handset, mobile device performance.
WLAN Chip enables multiple HD stream distribution.
Femtocell Chipsets deliver 3G broadband to homes/offices.
Chipset targets mass-market smartphones.
Software aids Web content development for mobile devices.
End-to-End Widget Framework helps drive mobile Internet use.
Compact SoC promotes handset Bluetooth performance.
Chipsets promote mobile consumer device functionality.
Software collects network performance data from handsets.
Chipsets provide multi-mode broadband features.

Other News from this company:
Qualcomm Expands HSPA+ Product Portfolio, Continuing its Leadership for Immersive Mobile Multimedia Experiences
Qualcomm Releases Software Development Kit for Brew Mobile Platform
Qualcomm Acquires Xiam Technologies Limited, Leading Provider of Wireless Content Discovery and Recommendations Technology
Qualcomm Makes Next-Generation Mobile Internet Accessible with New Single-Chip Solution
Qualcomm's Wireless Reach Teams with the GSMA Development Fund
Qualcomm, Telefonica Espana and Huawei Technologies Complete UMTS/HSDPA 900 MHz Field Trial
Hisense Reveals Design of First Mobile Phone to Incorporate mirasol Displays
HP and Qualcomm to Deliver Options for Worldwide Internet Access
Qualcomm Announces Multiple HSPA+ Trials to Take Place in 2008
Qualcomm to Ship Industry's First Multi-Mode LTE Chipsets in 2009
Mio and Qualcomm Announce Collaboration to Develop Connected Personal Navigation Devices
Qualcomm to Supply Low-Power Display Technology to KTF
Qualcomm's mirasol Displays Selected by Foxlink for Future Portable Devices
Qualcomm Announces New UMTS Products Available to Customers for the United States Market
Qualcomm Announces Acquisition of SoftMax
Qualcomm Announces Support for Wireless Services in 700 MHz
Qualcomm to Acquire Mobile Banking Leader Firethorn
Qualcomm Introduces World's First Single-Chip 45 nm Multi-Mode Solutions for Mass-Market Smartphones
Qualcomm Introduces Gobi Global Mobile Internet & GPS Solution for Notebook Computers
Qualcomm and conVISUAL Unveil Live, Interactive Mobile Broadcast Demonstration at IBC 2007



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