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System Control Software facilitates micromachining setup.
System Control Software facilitates micromachining setup.

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System Control Software facilitates micromachining setup.


February 9, 2007 - To meet control and programmability challenges faced during micromachining and wafer processing with lasers at sub-micron precision level, JPSAControls32 System Control Software provides engineer-level user interface that offers complete control of all system devices and software components. Windows-based software offers system configuration editor, CAD file translation, and Wafer Scribing Macro Builder. Program provides setup and control of all stages of motion.

(Archive News Story - Products mentioned in this Archive News Story may or may not be available from the manufacturer.)

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JPSA Launches Controls32 System Control Software


Manchester, New Hampshire, USA - Micromachining and wafer processing with lasers has reached the sub-micron precision level; to meet these ever-increasing control and programmability challenges, J P Sercel Associates (JPSA) announces the introduction of its new more powerful, more user-friendly JPSAControls32 System Control Software, an engineer-level user interface that provides complete control of all system devices and software components for system setup and programming. JPSAControls32 is Windows-based software offering a number of special features such as a System configuration editor for convenient editing of system software settings and CAD file translation capability (of .dxf files, for easy automated programming of complex designs).

In making the announcement, Jeffrey P. Sercel, President, said "Our overall goal in developing JPSAControls32 has been to integrate all motion devices, including the laser-fire commands, in an English-language, easy-to-use, yet powerful user interface. JPSAControls32 integrates our unique dual camera system, consisting of a process camera and high-resolution inspection camera, for fast, high-precision part alignment."

JPSAControls32 provides advanced project management utilities that permit system software to 'remember' settings for an unlimited number of different production tasks; JPSATools32 Module, which provides user access control for three levels: Operator, Maintenance, and Setup. The program provides setup and control of all stages of motion including linear stages, rotary stages, motorized beam delivery system components (mask changers, rectangular variable apertures, variable attenuators, beam stops, etc.) and laser fire mechanisms. It also provides high-level programming language that permits users to program complex automation sequences that integrate motion control, digital I/O, and laser functions and then save them in files. There are many more powerful features and associated tools. JPSAControls32 also features a unique Wafer Scribing Macro Builder, an easy-to-use interface that allows the user to input wafer diameter, die pitch in X and Y, etc. to automatically create a desired run list; it can be used for an unlimited number of wafer/die configurations.

JPSA is the world's leading designer, supplier, and systems integrator of UV laser materials processing workstations. JPSA products and services include UV excimer, DPSS and ultra-fast laser micromachining systems, UV and VUV laser beam delivery systems, laser materials processing development, optical damage testing, and excimer laser refurbishment services. JPSA operates a high-performance UV laser job shop as well as a systems engineering and manufacturing business. For more information, visit www.jpsalaser.com, or contact the company at 220 Hackett Hill Road, Manchester, NH, 03102 USA; Tel. 603.518.3200, fax 603.518.3298.

Company Information:
Name: JP Sercel Associates, Inc.
Address: 220 Hackett Hill Rd.
City: Manchester
State: NH
ZIP: 03102
Country: USA
Phone: 603-518-3200
FAX: 603-518-3298
http://www.jpsalaser.com


More New Product News from this company:
Laser Wafer Scribers offer frontside/backside capabilities.
Laser Scribers isolate, interconnect thin film solar cells.
Dicing System handles 100 mm sapphire wafers.
Materials Processing Unit suits micromachining applications.
Motorized Rotary Stage suits wafer processing.
UV Laser Systems perform 12 in. silicon wafer singulation.
Laser Workstation features micron-scale imaging cameras.
UV Laser Systems perform wafer dicing and micromachining.
Wafer Dicing System processes wafers up to 6 in. dia.

Other News from this company:
JPSA Announces Partnership with BlueON in Korea
JPSA Supplies State-of-the-Art UV Laser Micromachining Workstation to Los Alamos National Laboratory
Cristian Porneala Joins JPSA as Applications Engineer
JPSA Completes Move to New Manchester, NH Facility
JPSA Offers Select Optics for UV Laser Systems
JPSA Announces Expansion in Europe; Appoints New International Sales and Marketing Manager
JPSA Begins Move to New Manchester, NH Facility
JPSA Announces Distribution Agreement for NCLR 'Super Laser' Sirius 1000
JPSA Announces Shipments of Automated Cassette-to-Cassette Wafer Processing Systems
JPSA Announces China Distribution and Service Agreement with BOET



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