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Socket Adapters offer signal attenuation up to 3.5 GHz.
Socket Adapters offer signal attenuation up to 3.5 GHz.

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Socket Adapters offer signal attenuation up to 3.5 GHz.


January 26, 2007 - Available in 0.65 mm pitch BGA and LGA footprints, hybrid socket adapters utilize both male and female pins in interstitial pattern, and feature screw-machined terminals with multi-finger contacts in compact SMT socket. Units feature standard eutectic tin/lead solder balls or lead-free tin/silver/copper solder ball terminals for RoHS compliant applications. Alignment pins protect pin field and aid in hand placement, with optional stand-offs available.

(Archive News Story - Products mentioned in this Archive News Story may or may not be available from the manufacturer.)

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 See more related product stories:
QFN Socket accommodates 0.5 mm pitch devices.
ZIF Sockets are suited for 1.0 mm pitch BGA.
ZIF Socket is suited for 0.4 mm pitch BGA.
SOIC and SOJ Adapters comply with RoHS standards.
Sockets accommodate 84- and 92-pin BCC packages.
PLCC to DIP Adapters feature RoHS compliance.
SOWIC-to-DIP Adapter is RoHS and WEEE compliant.
Adapter allows probing of 48-pin QFNs.
Adapters convert ratcheting wrench into thin ratchet.
DIP to SOIC Adapter features RoHS-compliant construction.
Micro Card Interfaces require minimal board area.
IC Sockets support dense pitch QFP devices.
PLCC-to-DIP Adapter is RoHS-compliant.
Processor Socket enables PCI Express® signaling.
Socket is available for 0.50-0.80 mm pitch packages.
Socket Adapter System features hybrid design.
IC Socket tests high-speed devices.
MicroBGA to DIP Adapter preserves existing PCB layouts.
Adapters allow SOIC interchange.
PCB Adapter suits space-restricted applications.


Compact Socket Adapter System Now Available for 0.65mm Pitch BGA and LGA Device Validation


West Warwick, RI, January 23, 2007 - Advanced Interconnections Corp. is now offering its new hybrid socket adapter design, which utilizes both male and female pins in an interstitial pattern, in 0.65mm pitch BGA and LGA footprints.

The patented design features the reliability of screw-machined terminals with multi-finger contacts in a compact SMT socket. At only 2.00mm larger than the device package, with no external hold-downs required, this innovative system is designed for development and validation of BGA and LGA devices, production level socketing, and SMT board-to-board connector applications.

The new hybrid socket adapter design offers very low signal attenuation up to 3.5 GHz, and features standard eutectic tin/lead solder balls or new lead-free tin/silver/copper solder ball terminals for RoHS compliant applications. Unique alignment pins protect the pin field and aid in hand placement with optional stand-offs available. A data sheet and signal integrity simulation data and models are available online at www.bgasockets.com. Consult factory for pricing and lead time which vary based on number of positions and options selected.

Advanced Interconnections Corporation is an ISO 9001:2000 Certified designer and manufacturer of electronic interconnect solutions, with world headquarters located in Rhode Island (USA). For more information, contact Advanced Interconnections' customer service department at 5 Energy Way, West Warwick, RI 02893 USA. Tel: (800) 424-9850 or (401) 823-5200 or Fax: (401) 823-8723. E-mail: info@advanced.com. Product information available online at: www.bgasockets.com.

Ann Cibelli
Marketing Manager

Advanced Interconnections Corp.
5 Energy Way, West Warwick, RI 02893 USA
401.823.5200 or 800.424.9850 ext. 164
Fax: 401.823.8723
www.advanced.com


Contacts:

Marketing:
Ann Cibelli Marketing Manager
USA
Phone: 800-424-9850 ext 164
FAX: 401-823-8723

Company Information:
Name: Advanced Interconnections Corp.
Address: 5 Energy Way
City: West Warwick
State: RI
ZIP: 02893
Country: USA
Phone: 800-424-9850
FAX: 401-823-8723
http://www.advanced.com


More New Product News from this company:
SMT Connectors suit mezzanine boards with low z-axis.
Terminal Carriers are available in nonlinear patterns.
SMT Connectors withstand demands of blind mating.
BGA Socket suits 1.00 mm pitch devices.
Socket Adapter System features hybrid design.
Sockets protect image sensors during board processing.
Sockets accommodate BGA, LGA, and CSP devices to 27 mm².
Test Fixture Boards utilize surface mount technology.
BGA Socket takes up less space.

Other News from this company:
Advanced Interconnections Honors Bisco Industries at EDS 2007
500 Position B2B® SMT Connectors Now Available for High I/O Board Stacking
Advanced Interconnect Technologies Announces That AMI Semiconductor is Now in Volume Production with Stacked DIE QFN Package
Peel-A-Way® Removable Terminal Carriers Meet RoHS Compliant Requirements



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