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Probe System tests wafers up to 300 mm.


December 20, 2006 - Designed for high-temperature, multi-site testing, Model PM300WLR features large programmable microscope movement and cable handling solutions that facilitate use. Contact stability is guaranteed at temperatures up to 400°C and test times are minimized using multi-site probe cards. Design of probe system minimizes gas consumption, which is important for devices that must be tested in inert gas environments.

(Archive News Story - Products mentioned in this Archive News Story may or may not be available from the manufacturer.)

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 See more related product stories:
Probe suits BGA, LGA, QFN, and QFP packages.


SUSS MicroTec Introduces the PM300WLR


The World's First Dedicated 300mm Wafer-Level Reliability Probe System

TOKYO, Japan, December 6, 2006 - SUSS MicroTec AG has announced the latest innovation in wafer-level reliability (WLR) testing. The PM300WLR is the first dedicated probe system for wafers up to 300mm that enables semiconductor manufacturers to quickly obtain critical results about the reliability of the device under test (DUT). These results are a vital piece of feedback for design and process improvement.

In order to test the reliability of the DUT, it must be subjected to temperature and electrical stress over long periods of time. This was traditionally done after the device had been packaged - an expensive and time-consuming process. By doing reliability test at wafer level, the costs of packaging are saved and the test results can be delivered much sooner.

The PM300WLR is specifically designed for ergonomic, high-temperature, multi-site testing. Contact stability is guaranteed at temperatures up to 400°C and test times are significantly reduced using multi-site probe cards. A large programmable microscope movement and clever cable handling solutions heighten ease of use. The advanced design of the PM300WLR also delivers additional savings by reducing gas consumption, which is especially important for devices that must be tested in inert gas environments.

"We are seeing increasing demand for WLR testing at 300mm," said Dr. Stojan Kanev, International Product Manager, Test Systems Division, SUSS MicroTec. "Semiconductor manufacturers want a solution that provides reliability information for their devices without waiting for weeks. The PM300WLR delivers that solution and provides extra value by reducing the cost of test."

For more information, please contact:
Joshua M. Preston
Marketing and Communications Manager
SUSS MicroTec Test Systems
Tel: +49 (0) 35240 73-0
E-Mail: info@suss.com

For further correspondence send to:
SUSS MicroTec, Inc.
228 Suss Drive
Waterbury Center, VT 05677 U.S.A.
Attn: Electronic Marketing Dept.

Louise Jones
SUSS MicroTec Inc.
Sales & Marketing Specialist
ljones@suss.com
800-685-7877, Ext. 218

Visit us on the web at www.suss.com


Contacts:

Sales:
Louise Jones Sales & Marketing Specialist
USA
Phone: 800-685-7877 ext 218
Send email  E-mail this person

Marketing:
Joshua M. Preston Marketing and Communications Manager
INTL
Phone: +49 (0) 35240 73-0
Send email  E-mail this person

Company Information:
Name: SUSS MicroTec Inc.
Address: GITC 1-18-2, Hakusan
City: Yokohama
Country: Japan
Phone: +81-45-931-5600
http://www.suss.jp/


More New Product News from this company:
Mask Aligners are offered with customized illumination.
Production Mask Aligner suits 3D packaging applications.
Test System offers wafer-level device characterization.
Wafer Bonding System offers single station bonding.
Placement and Bonding System covers range of processes.

Other News from this company:
3M and SUSS Announce Agreement on Temporary Wafer Bonding Technology to Enable 3-D Semiconductors
SUSS MicroTec Introduces New |Z| ProbeŽ Technology for Wafer-Level RF Testing
SUSS MicroTec Test Systems Named Exclusive Supplier of 300 mm Characterization and Reliability Test Solutions
SUSS MicroTec Receives Multiple Orders from Nemotek Technologie for Wafer-Level Camera Production to Use in Portable Applications



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