October 2, 2006 -
Fine-grained Dipax(TM) D4 PCD Cutting Tool Grade is recommended for milling and rough cutting of aluminum alloys where high chip resistance is required, as well as for machining of medium-high silicon-aluminum alloys where tools need to display abrasion resistance. D4 material can also be processed with EDM and mechanical grinding.
(Archive News Story - Products mentioned in this Archive News Story may or may not be available from the manufacturer.)
New Versatile, Fine-Grain PCD Cutting Grade from Citco at IMTS 2006
Chicago, IL, September 6, 2006 - CITCO Diamond and cBN Products Operation of Cinetic Landis Grinding Corp. presentd its new Dipax(TM) D4 polycrystalline diamond cutting tool grade, as well as a variety of application-formulated cutting tools at IMTS 2006 in booth E-2114. The exhibit highlights CITCO's focus on supplying advanced cutting tools that are designed for each customer's unique application as opposed to one-size-fits-all commodity solutions.
CITCO's new Dipax(TM) D4 PCD cutting tool material has a unique combination of high fracture toughness and hardness, making it an ideal grade for many metalworking applications. The exceptionally fine-grained D4 grade is recommended for milling and rough cutting of aluminum alloys where a high chip resistance is required, as well as for the machining of medium-high silicon-aluminum alloys where tools need to display high abrasion resistance. The ability of the D4 material to be easily processed with EDM and mechanical grinding compared to existing PCD grades is an additional advantage.
In a separate exhibit in booth B-7533, CITCO also presents a variety of specialty diamond and cBN grinding wheels that offer the ability to grind at low rpm and achieve lapping tolerances and finishes; a broad line of monocrystal diamond dressing tools that yield consistent dressing results and longer life that can result in a significant reduction in cost per part; and a line of rotary dressers manufactured with cvd diamond that are custom-designed to meet individual customer requirements.
Complete information on the new Dipax D4 cutting grade, diamond and CBN grinding wheels, and single-point and rotary diamond dressing products can be found on the company's web site at www.citcodiamond.com or by calling CITCO toll free at 1-800-242-7366 or by e-mail to: citcoinfo@cinetic-industries.com
The CITCO Diamond & cBN Products Operation of Cinetic Landis Grinding Corp. is part of Cinetic Industries, a leading global provider of best-in-class solutions for manufacturing dedicated to helping customers meet the challenges of global competition. Company Information: Name: CITCO Operations, Landis Gardner, A UNOVA Co. Address: 357 Washington St. City: Chardon State: OH ZIP: 44024 Country: USA Phone: 800-242-7366 FAX: 440-285-3678 http://www.landisgardner.com
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