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Heat Sinks cool Freescale MPC8641D dual-core processors.
Heat Sinks cool Freescale MPC8641D dual-core processors.

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Heat Sinks cool Freescale MPC8641D dual-core processors.


August 31, 2006 - Featuring integral fan that blows air through linear field of flat aluminum fins, Juneau ATS-405 Active Heat Sink delivers thermal resistance of 0.51°C/W with thermal grease. Developed to cool Freescale processors in restricted height enclosures, Anchorage ATS-474 Passive Heat Sink features maxiFLOW(TM) angled fin technology with thermal resistance of 1.05°C/W in air velocity of 100 lfm and 0.49°C/W in air velocity of 400 lfm.

(Archive News Story - Products mentioned in this Archive News Story may or may not be available from the manufacturer.)

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New Active and Passive Heat Sinks From ATS Cool Freescale Dual-Core Processors


ORLANDO, Fla & NORWOOD, Mass, July 24, 2006 - Advanced Thermal Solutions, Inc. (ATS), a leading engineering and manu­facturing company focused on the thermal management of electronics, today announced it is introducing two new heat sink solutions for cooling Freescale Semiconductor's MPC8641D Dual-Core PowerPC® Processors, after more than a year of design and testing. ATS is demonstrating the two new cooling solutions as well as, it maxiGRIP(TM) technology, at the Freescale Technology Forum.

The ATS-405 "Juneau" active heat sink includes an integral fan for optimum cooling performance. The ATS-474 "Anchorage" pas­sive heat sink incorporates ATS' maxiFLOW(TM) angled fin technology and is specially designed to provide high levels of cooling in low airflow conditions.

Both heat sinks provide optimal cooling for Freescale MPC8641D processors in enclosures such as ATX cabinets, blade servers and 1U to 4U rack-mount chassis.

The ATS-405 "Juneau" active heat sink includes an integral fan to enhance cooling performance where minimum airflow is available. The fan blows air through a linear field of flat aluminum fins on the heat sink. The required thermal performance for the 8641D proc­essor is 0.7°C/W under given load and die area specifications. The ATS-405 sink delivers thermal resistance of just 0.51°C/W with thermal grease. This performance provides an 18% margin of safety over the specified thermal resistance. The 405 fan sink assem­bly screw mounts to the PCB and stands just 54.9 mm high.

The ATS-474 "Anchorage" passive heat sink was developed to cool Freescale MPC8641D processors in restricted height enclosures, such as 2U racks, where airflow is limited. The "Anchorage" heat sink features 26 various sized, spaced, and angled fins to maximize exposure to available air. Testing of these sinks shows thermal resistance of only 1.05C°/W in air velocity of 100 LFM, and just 0.49°C/W in air velocity of 400 LFM. The 474 heat sink is just 30.6 mm high and screw mounts directly to the PCB.

These two heat sinks are part of Advanced Thermal Solutions' "Alaska" line of heat sink solutions for Freescale applications. More information on the ATS-405 "Juneau'" and ATS-474 '"Anchorage" heat sinks for Freescale MPC8641D processors is available on the Advanced Thermal Solutions website, www.qats.com, or by calling 1-781-769-2800.

About Advanced Thermal Solutions, Inc.
Advanced Thermal Solutions is a leading engineering and manufacturing company supplying complete thermal and mechanical packaging solutions from analysis and testing to final production. ATS provides a wide range of heat sinks and laboratory-quality thermal instrumentation, along with thermal design consulting services and training. For more information about Advanced Thermal Solutions, Inc., please visit www.qats.com or call 781-769-2800.

CONTACT:
Raymond Santos
781-769-2800 or 617-429-2774
rsantos@qats.com


Contacts:

General Information:
Raymond Santos
USA
Phone: 781-769-2800
Send email  E-mail this person

Company Information:
Name: Advanced Thermal Solutions Inc.
Address: 89 Access Rd., Suite 127
City: Norwood
State: MA
ZIP: 02062
Country: USA
Phone: 781-769-2800
FAX: 781-769-9979
http://www.qats.com


More New Product News from this company:
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Heat Sinks help cool linear LED lighting products.
Heat Sink cools communications processors.
Heat Sink cools BGA components in low airflow conditions.
Temperature and Velocity Scanner controls up to 32 sensors.
Heat Sinks cool condensed electronic packages.
Candlestick Sensor measures temperature and air velocity.
Board provides air flow and temperature measurement.

Other News from this company:
Advanced Thermal Solution's Dr. Kaveh Azar to Keynote the 8th Annual International Business & Technology Summit for Thermal Management of Electronics
New Thermal Management Webinar Series for 2008
New Catalog Features 380+ Heat Sinks Available in 24 Hours
ATS- Digi-Key Partnership Provides Full-Range of BGA Cooling Solutions
Digi-Key and Advanced Thermal Solutions, Inc. Sign Worldwide Distribution Agreement
ATS to Present Thermal Management Tutorial Series
ATS' maxiGRIP(TM) Heat Sink Attachment System Passes Tough Military Shock Testing
ATS and NTS Partnership Provides Combined Design, Validation and Compliance Testing



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