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Compound suits thin and ultra-thin SMD applications.
August 25, 2006 -
Hysol® QMI529LS die attach material combined with Hysol® GR828A mold compound delivers properties necessary to provide material set for packages used in low-profile products such as cell phones and portable music players. Formulation of Hysol QMI529LS provides hydrophobic properties, while delivering stability at extremely high temperatures. Tested to JEDEC Level 1, 260°C, material combination performs in demanding lead-free manufacturing conditions.
(Archive News Story - Products mentioned in this Archive News Story may or may not be available from the manufacturer.)
Henkel Develops Die Attach - Mold Compound Pb-free Compatible Material Set Solution for Ultra-Thin Surface Mount Devices
As low-profile consumer electronics products continue to grow in popularity, compatible, reliable material set solutions for these devices become even more important to ensure long-term reliability. Anticipating this market dynamic, the electronics group of Henkel has developed and made commercially available a die attach and mold compound material set that is lead-free compatible and specifically designed for thin and ultra-thin surface mount device (SMD) applications.
Combined, the Hysol® QMI529LS die attach material and Hysol® GR828A mold compound deliver the thin, yet highly reliable, materials properties necessary to provide a robust material set solution for packages used in today's low-profile products such as cell phones, PDAs, portable music players and entertainment devices .
When manufacturing TSOP, TSSOP and TQFP packages with Au-plated and Ag-plated lead frames, use of Hysol QMI529LS die attach adhesive with the "Green" mold compound, Hysol GR828A, produces superior material set reliability and performance. Hysol QMI529LS' unique formulation provides hydrophobic properties, while delivering incredible stability at extremely high temperatures. Joining these benefits are the advantageous materials properties of Hysol GR828A, a low stress molding compound that exhibits excellent gate leakage performance. Extensive testing of this materials combination to JEDEC Level 1, 260° C has confirmed its robust performance even in the most demanding lead-free manufacturing conditions.
"Packaging specialists are looking for materials partners who can provide a solution - not just a product," comments Dr. Michael Todd, Henkel Director of Research, Development and Engineering for Material Sets. "This is precisely what our multi-level material set approach delivers - designed, tested and guaranteed compatible complete material sets for a wide variety of applications and package types. The Hysol QMI529LS/GR828A combination is only one of many Henkel material sets optimized for today's challenging manufacturing conditions."
The demands of end-users of mobile devices for thinner, smaller, higher functioning products dictate that new, innovative packaging solutions be developed, as consumers expect superior performance even when these products are manufactured within the constraints of lead-free processes. Henkel's material set methodology delivers these benefits while also reducing costs and accelerating product development cycles.
For more information on the Hysol QMI529LS-Hysol GR828A material set or any of Henkel's advanced packaging material set solutions, log onto www.henkelelectronics.com or call 949-789-2500.
About the electronics group of Henkel
Henkel is one of the world's leading and most progressive providers of qualified, compatible material sets for semiconductor packaging, board level assembly and advanced soldering solutions. Through its Hysol, Loctite and Multicore brands, and its global customer support infrastructure, the electronics group of Henkel delivers world-class materials products, process expertise and total solutions across the board to enable tomorrow's electronic industry.
Henkel, a Fortune Global 500 company, operates in three strategic business areas: Home Care; Personal care; and Adhesives, Sealants and Surface Treatments, which serves the transportation, electronics, aerospace, metal, durable goods, consumer goods, maintenance and repair and packaging industries, and offers a broad range of products for the craftsman and consumer. With brands and technologies, Henkel makes people's lives easier, better, and more beautiful. 50,000 employees work for Henkel worldwide. People in 125 countries around the world trust in brands and technologies from Henkel - "A Brand like a Friend".
General Information:
Doug Dixon
USA
Phone: 949-789-2500
FAX: 949-785-2595 E-mail this person Company Information: Name: Henkel Corp. Address: 32100 Stephenson Hwy. City: Madison Heights State: MI ZIP: 48071 Country: USA Phone: 800-953-5858 FAX: 248-589-4804 http://www.hstna.com
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