Copper Electrofill System handles 45 and 32 nm nodes.
August 16, 2006 -
Copper electroplating system, SABRE Extreme(TM), utilizes Viaform Extreme electrofill chemistry to provide filling capability on narrow, high-aspect ratio features. Along with sealed contact design with 1 mm physical edge exclusion, product features edge bevel removal process with recipe-driven edge exclusion and Extreme-generation plating cell that enables recipe-driven edge profile control. It offers 80 wafers/hr throughput while delivering 90% availability in high-volume production.
(Archive News Story - Products mentioned in this Archive News Story may or may not be available from the manufacturer.)
First Copper Electrofill System Targeted Exclusively for 45nm and 32nm Nodes
SAN JOSE, Calif., July 10 -- Novellus Systems, Inc. (NASDAQ:NVLS), today introduced SABRE Extreme(TM), the latest generation of the company's market-leading SABRE Electrofill system. With proven flexibility to evolve for multiple-generation applications, the new platform offers enhanced chemistry, process refinements and new hardware features to tackle the complex transition to the 32nm technology node. The new system is currently being used in development for 45nm by a leading U.S. logic customer as well as a leading U.S. DRAM manufacturer.
SABRE Extreme marks another milestone for Novellus' SABRE Electrofill tool, the semiconductor industry's first production-worthy copper electroplating system. With a market share of 80% in 2005, SABRE is the process tool of record for nine of the top 10 copper IC producers. The installed base of more than 250 systems worldwide processes more than 55 million wafer passes annually, and with Novellus' backward compatibility strategy, manufacturers can continue to leverage their installed fleet as they transition to 45nm and 32nm. SABRE Extreme enables an industry leading throughput of 80 wafers per hour while continuing to deliver 90% availability in high volume production.
"When the first SABRE system was introduced in 1998, it drove the industry's transition from aluminum to copper interconnects, and it has since become the industry standard tool for copper electrochemical deposition," said David Smith, vice president and general manager of Novellus' Electrofill Business Unit. "In addition to widespread adoption for advanced logic technology, we are now seeing memory chip manufacturers increasingly adopting SABRE to achieve the performance benefits of copper. With its advanced technology, SABRE Extreme easily meets the aggressive technology requirements while offering productivity benefits via higher throughput and lower cost of ownership."
SABRE Extreme incorporates a number of enhancements for high volume manufacturing at 45nm and 32nm, targeted at providing value to customers through leading technology and enhanced productivity. These include:
Innovative Technology:
o Leading-edge electrofill chemistry, Viaform Extreme, which is key in providing an advanced filling capability on narrow, high aspect ratio features required in the 45nm and 32nm nodes. Viaform Extreme has been developed through an exclusive arrangement with ATMI/Enthone to create copper films of high reliability, and is only available to SABRE customers. Novellus has been receiving positive feedback from customers for leading in this area of development with the help of suppliers.
o An Extreme-generation plating cell incorporating the latest membrane technology to improve on-wafer performance and reduce the cost of consumables by 50%. This latest plating cell incorporates features that have been developed and proven on earlier-generation designs, and enables new recipe- driven edge profile control for optimum chemical mechanical planarization (CMP) compatibility.
Trusted Productivity:
o A sealed contact design with 1mm physical edge exclusion that increases the usable area on a wafer by more than 1%, resulting in additional yielding die per wafer.
o A fast edge bevel removal (EBR) process with recipe-driven edge exclusion. The faster process eliminates the EBR step from the critical path for an increase in throughput. Novellus' foundry customers in particular will benefit from the flexibility provided by the recipe-driven edge exclusion.
About Novellus:
Novellus Systems, Inc. is a leading provider of advanced process equipment for the global semiconductor industry. The company's products deliver value to customers by providing innovative technology backed by trusted productivity. An S&P 500 company, Novellus is headquartered in San Jose, Calif. with subsidiary offices across the globe. For more information please visit www.novellus.com.
NOTE: SABRE Extreme is a trademark of Novellus Systems, Inc.
CONTACT: Pushpita Prasad of Novellus Systems, Inc., +1-408-943-9700, or pushpita.prasad@novellus.com; or Jen Bernier of The Hoffman Agency, +1-408-975-3003, or jbernier@hoffman.com, for Novellus Systems, Inc.
Contacts:
Public Relations:
The Hoffman Agency
Jen Bernier
USA
Phone: 408-975-3003 E-mail this person
General Information:
Pushpita Prasad
USA
Phone: 408-943-9700 E-mail this person Company Information: Name: Novellus Systems, Inc. Address: 81 Vista Montana City: San Jose State: CA ZIP: 95134 Country: USA Phone: 408-943-9700 FAX: 408-943-3401
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