June 15, 2006 -
Designed for semiconductor and standard surface mount assembly, AdVantis XS(TM) delivers accuracies of ±9 microns at ±3 sigma. Class 1000 clean room compatible system offers capability and functionality required for high-end assembly including high magnification cameras, flip chip algorithms, low force capability, heated spindles, fluxing, dispensing, and variety of feeder types.
(Archive News Story - Products mentioned in this Archive News Story may or may not be available from the manufacturer.)
Universal Launches Linear Motor Driven AdVantis XS(TM)
See us at Semicon West, Booth #7039
Universal Instruments will be using Semicon West to demonstrate its latest Platform placement system, the AdVantis XS. Designed specifically for the convergence of
semiconductor and standard surface mount assembly, the new system deploys Universal's innovative VRM linear motors for exceptional accuracy and repeatability.
AdVantis XS is the natural evolution of the company's acclaimed GSMxs, delivering similar accuracies of ±9 microns at ±3 sigma, but with a 25% increase in feeder capacity for greater on-machine inventory and a 15% speed improvement. At the same time, the advanced materials engineering and optimized design of the AdVantis platform offers customers a highly competitive price some 25% lower than its predecessor, while Universal's platform philosophy ensures high levels of backward compatibility, shared resources and common interfaces - even extending to Universal Instruments' GSM Genesis platform range.
"Overall, our studies demonstrate that AdVantis XS can cut cost of ownership by 40% which, in turn, reduces cost-per-placement in the competitive flip chip market segment," claims Richard Boulanger, Vice President of the Advanced Semiconductor Assembly division at Universal Instruments. "It provides a lower-cost alternative sought by those in low-margin assembly applications who still require high accuracy placement of flip chip and other advanced packages without sacrificing Universal's time-honored platform strengths - robustness, modularity and scalability - all backed by superior expertise and support."
The new linear-motor-driven AdVantis XS delivers all the capability and functionality demanded by high-end assembly including high magnification cameras, flip chip algorithms, low force capability, heated spindles, fluxing, dispensing, and a variety of feeder types. It is also Class 1000 clean room compatible.
"Leveraging Universal's credentials as a pioneer of leading-edge placement platforms, the high accuracy AdVantis XS extends equipment capabilities into System-In-Package (SiP) assembly," Boulanger said. "The state of the art handling, vision, and placement technology of the AdVantis XS allows manufacturers to perform challenging flip chip processes, process bare dies, and assemble complex optoelectronic components."
About Universal
Universal Instruments is a global electronics productivity specialist, providing innovative circuit, semiconductor and back-end assembly technologies and equipment, integrated system solutions, and process expertise to manufacturers in every sector of the electronics industry.
Universal contact
Karen Moore Watts
UIC
PO Box 825
Binghamton
NY 13902-0825 USA
Tel: +1 607 779 4079
Email: moorek@uic.com www.uic.com
Contacts:
Public Relations:
Protean Marketing Communications, Ltd.
Helena Osborn
Communications House, Station Rd.
Maidenhead SL6 9BU
INTL
Phone: +44 (0)1628 648530 E-mail this person
General Information:
Karen Moore Watts
USA
Phone: 607-779-4079 E-mail this person Company Information: Name: Universal Instruments Corp. Address: P.O. Box 825 City: Binghamton State: NY ZIP: 13902 0825 Country: USA Phone: 607-779-7522 FAX: 607-772-1878 http://www.uic.com
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