March 27, 2006 -
Designed to meet multimedia applications needs in 3G and CDMA mobile phones and other portable devices, MCP (Multi-Chip Package) memories offer densities up to 1 Gbit of NAND Flash with up to 512 Mbit of LPSDRAM in one package. Bus width, memory density, clock frequency, and data rate can be configured to meet specific requirements. NAND Flash and LPSDRAM components have separate power supplies and ground lines as well as separate control, address, and I/O signals.
(Archive News Story - Products mentioned in this Archive News Story may or may not be available from the manufacturer.)
STMicroelectronics Launches Multi-Chip NAND Flash Solution for Latest Mobile Phones
Multi-chip package memory products combine NAND www.st.com/nand> Flash and LPSDRAM to satisfy demands for more memory in less space from manufacturers of portable multimedia devices
Geneva, February 23, 2006 - STMicroelectronics (NYSE: STM) today announced a new MCP (Multi-Chip Package) memory portfolio designed to meet the needs of multimedia applications in 3G and CDMA mobile phones, and in other portable devices, where memory requirements are high and space and power are limited. The series offers memory densities up to 1-Gbit of NAND www.st.com/nand> Flash with up to 512-Mbit of LPSDRAM (Low-Power Synchronous Dynamic RAM) in a single package, and has been developed in close cooperation with chipset enablers and operating system (OS) vendors to ensure that it matches the requirements of phone manufacturers and is compliant with the major mobile platforms.
Demand for multimedia applications on 3G phones is increasing rapidly, and today's models are capable of taking pictures, playing and capturing video, and web surfing. The requirements of advanced image and audio processing capability, faster throughput and greater storage is changing the phone's structure from a simple voice signal receiver and transmitter to a PC-like architecture that is more general-purpose and is able to recognize and properly use data for images, video and audio.
Multi-chip packages mount two (or more) chips in a single package to minimize the space required in critical applications, while increasing the memory density and offering the necessary different memory types. ST is a leader in MCP design and manufacturing technology, and has designed the new series to offer the widest range of NAND Flash and LPSDRAM combinations in one package, providing fast time-to-market and high design flexibility, and satisfying customers' differing handset memory requirements.
The new MCPs can be configured in many different ways to match a variety of specific applications: bus width, memory density, clock frequency and data rate can be configured to meet specific requirements. The NAND Flash and LPSDRAM components have separate power supplies and ground lines, as well as separate control, address and I/O signals, to allow simultaneous access to both chips.
ST's MCP options allow mobile phone makers to reduce the space requirement of their products - following the miniaturization trend of the market - and benefit from fast processing speed with low power consumption. The devices offer high memory density for storage of multimedia objects and have high data throughput. Other handheld applications include PDAs (Personal Digital Assistants) and GPS (Global Positioning System) units. All combinations are available now and offered in a range of BGA packages fully compatible with other devices available on the market.
Memory combinations available, initially, in the new MCP portfolio are:
NAND LPSDRAM Package Size Ball Out
NAND-01Gbit SDR 512 Mbit(2x256) 10.5 x 13 x 1.4mm LFBGA 137
NAND-256Mb SDR/DDR 256Mbit 10 x 13.5 x 1.2mm TFBGA 149
NAND-01Gbit DDR 512 Mbit 10 x 13.5 x 1.2mm TFBGA 149
NAND-01Gbit SDR 512 Mbit 10.5 x 13 x 1.2mm TFBGA 107
NAND-512MB DDR 256 Mbit 10 x 13.5 x 1.2mm TFBGA 149
NAND-512MB SDR 256 Mbit 10.5 x 13 x 1.2mm TFBGA 107
Prices for the NAND Flash MCP devices range from $11 to $17 in large volumes from 1000k onwards.
More information on ST's NAND Flash products is available at www.st.com/nand
About ST's Memory Product Group (MPG)
STMicroelectronics offers the industry's widest range of semiconductor storage solutions for leading applications. The Company is a major supplier of non-volatile memories, including NOR and NAND Flash, EPROM/EEPROM, and Serial Flash. ST's memory product portfolio also features a wide array of RFID ICs, as well as the most complete range of secure microcontrollers and System-on-Chip solutions for all major smart card application segments.
About STMicroelectronics
STMicroelectronics is a global leader in developing and delivering semiconductor solutions across the spectrum of microelectronics applications. An unrivalled combination of silicon and system expertise, manufacturing strength, Intellectual Property (IP) portfolio and strategic partners positions the Company at the forefront of System-on-Chip (SoC) technology and its products play a key role in enabling today's convergence markets. The Company's shares are traded on the New York Stock Exchange, on Euronext Paris and on the Milan Stock Exchange. In 2005, the Company's net revenues were $8.88 billion and net earnings were $266 million. Further information on ST can be found at www.st.com.
STMicroelectronics, Inc.
Lexington Corporate Center
10 Maguire Road
Bldg. 1, 3rd Floor
Lexington, MA 02421
(781) 861 2650 www.st.com Company Information: Name: STMicroelectronics Address: 39, Chemin du Champ des Filles, C. P. 21 City: GENEVA Country: Switzerland Phone: +41 22 929 29 29 FAX: +41 22 929 29 00 http://www.st.com
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