February 22, 2006 -
Building on micro SMD, micro SMDxt integrated circuit package enables design of products with bump counts of 42-100 bumps at 0.5 mm pitch without any underfill. Package height of 0.65 mm enables integration into thin-profile consumer products. Epoxy back coating protects against silicon damage during manufacturing, while self-aligning solder bumps facilitate surface mount assembly and rework.
(Archive News Story - Products mentioned in this Archive News Story may or may not be available from the manufacturer.)
National Semiconductor Launches New Generation of Ultra-Miniature, High Pin-Count Integrated Circuit Packages
SANTA CLARA, Calif., Jan. 9 -- Continuing decades of packaging innovation, National Semiconductor (NYSE:NSM) announced the release of the micro SMDxt (micro Surface Mount Device extended technology) chip package, the company's newest generation of wafer-level package technologies. In separate announcements, National launched two new Boomer(R) audio amplifiers -- the first products that use micro SMDxt packages to reduce board space by as much as 70 percent.
The new package, which builds on National's highly successful micro SMD, uses a unique structure that enables high-reliability products with bump counts of 42 to 100 bumps at a 0.5 mm pitch without any underfill. Higher bump-count packages enable designers to create more complex products with advanced features and pack them into a smaller space. (Pitch is the distance between bumps. First-generation micro SMD products featured packages with bump counts up to 36 and pitch of 0.5 mm.)
"National leads the industry in package miniaturization for applications such as cell phones, notebook computers and other portable devices," said Sadanand Patil, vice president of National's Package Technology Group. "The new micro SMDxt package offers the industry's smallest footprint and improved performance while using standard surface mount assembly and rework processes."
The superior electrical noise performance of this package (compared to standard wire-bonded devices) makes it well-suited for high-performance mobile applications. Thermal performance of micro SMDxt packages is comparable to other thermally enhanced packages such as QFN or Leadless Lead Frame (LLP(R)) packages with similar pin count. Reliability standards such as thermal cycling, thermal shock, and drop test, and flex test can be met without the use of an underfill.
The first product that uses the innovative package is the LM4934 Boomer(R) stereo audio subsystem in the 42-bump micro SMDxt. National also introduced the LM4935, a new complete Boomer(R) audio subsystem with a mono Class D speaker driver. Packaged in a 49-bump micro SMDxt, the new LM4935 requires 70 percent less board space than existing solutions.
Micro SMDxt Package: Small and Thin, with Patented Technology
-- The die is the package--smallest possible size for a given I/O count at 0.5 mm pitch
-- 0.65 mm package height--enables integration into thin-profile consumer products
-- Patented epoxy back-coating--protects against silicon damage during manufacturing
-- Self-aligning solder bumps simplify surface mount assembly and rework
Ease of Manufacturing
-- Uses standard surface mount equipment and flow
-- Available in standard 8 mm and 12 mm EIA tape-and-reel format
-- Moisture sensitivity level-1 (MSL-1) compliant
Enhanced Reliability
-- Passes all standard reliability tests: OPL, Temperature Humidity Bias Test (THBT), Temp Cycle, Autoclave and ESD
-- Passes all board-level reliability tests: drop, thermal cycling and flex
National: The Industry's #1 Provider of Products in micro SMD Packages
National produces billions of chips per year and packages them in more than 70 different package types. The company has more than 290 patents in package technology, and has introduced several packaging innovations to the industry, including both the micro SMD and LLP technologies.
National introduced the first product packaged in micro SMD in 1999. Today, with a family of more than 200 devices, National is the world's number-one supplier of Wafer Level Chip Scale Package (WLCSP) products. The company offers the broadest micro SMD product portfolio in the industry: op amps, temperature sensors, audio amplifiers, comparators, power management, references, supervisory circuits and timers.
For information on National's other advanced packaging technologies, please visit http://www.national.com/packaging/
About National Semiconductor
National Semiconductor, the industry's premier analog company, creates high-value analog devices and subsystems. National's leading-edge products include power management circuits, display drivers, audio and operational amplifiers, communication interface products and data conversion solutions. National's key analog markets include wireless handsets, displays and a variety of broad electronics markets, including medical, automotive, industrial, and test and measurement applications. Headquartered in Santa Clara, California, National reported sales of $1.91 billion for fiscal 2005, which ended May 29, 2005. Additional company and product information is available at www.national.com.
NOTE: National Semiconductor, Boomer and LLP are registered trademarks of National Semiconductor Corporation. All other brands or product names are trademarks or registered trademarks of their respective holders.
CONTACT: Mike Brozda of National Semiconductor, +1-408-721-3628, or mike.brozda@nsc.com; or Reader Information, Design Support, 1-800-272-9959, or www.national.com
General Information:
Mike Brozda
USA
Phone: 408-721-3628 E-mail this person Company Information: Name: National Semiconductor Corp. Address: 2900 Semiconductor Dr. City: Santa Clara State: CA ZIP: 95051-0695 Country: USA Phone: 800-272-9959 FAX: 408-739-9803 http://www.national.com
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