Archive News Story
(Products mentioned in this Archive News Story may or may not be available from the manufacturer.)
Strip System can be configured with 2 dual-wafer modules.
February 6, 2006 -
Suited for high-volume manufacturing at 90 nm node and below, Suprema 300 mm Strip System is based on modular design that makes it suited for development and production environments. Vacuum and atmospheric robots deliver throughput greater than 300 wafers/hr, and vacuum robot is capable of transferring 4 wafers simultaneously. Inductively coupled plasma source provides strip rates over 9 microns/min.
Archive Press Release
(Products mentioned in this Archive Press Release may or may not be available from the manufacturer.)
Release date: January 30, 2006
Mattson Technology Revolutionizes Strip Productivity with New Suprema (TM) Strip System
FREMONT, Calif., Jan. 30 -- Mattson Technology, Inc. (NASDAQ:MTSN), a leading supplier of advanced process equipment used to manufacture semiconductors, has once again redefined productivity with its new 300 mm Suprema strip system that delivers the highest throughput in the industry. The latest addition to Mattson's complete family of front-end-of- line (FEOL) and back-end-of-line (BEOL) strip products, Suprema is designed to provide chipmakers the most efficient and cost-effective strip solution for high-volume manufacturing at the 90 nm node and below. The Suprema is already in production at a leading Korean memory manufacturer and is being qualified by a major Japanese logic chipmaker for 90 nm and below production.
Suprema's innovative proprietary platform is based on a flexible, modular design that makes it ideal for both development and production environments. The system features reliable, high-speed vacuum and atmospheric robotics that deliver increased throughput of greater than 300 wafers per hour and over 40% improvement compared to competitive systems for bulk strip applications. Suprema's proprietary inductively coupled plasma (ICP) source provides increased strip rates of over 9 microns/minute. Its vacuum robot utilizes an innovative transfer mechanism, capable of transferring four wafers simultaneously, to minimize overhead time. With a compact footprint for highest space efficiency, Suprema can be configured with two dual-wafer modules.
"Our customers demand semiconductor equipment that can help them boost productivity, increase yields and reduce costs," said Jay Chun, senior marketing director of Mattson Technology's Films Etch Product Group. "Based on a completely new architecture, our next-generation strip system, Suprema, leverages the production-proven performance of our proprietary ICP technology to provide chipmakers superior process results and the highest throughput and lowest total cost of ownership in the industry. We have received excellent response and multiple orders from key customers for the Suprema, and we expect that Mattson's latest 300 mm prime tool will help our customers meet their critical strip process requirements for high-volume manufacturing at current and future technology nodes."
Mattson is the leading dry strip supplier in the industry, with the number one market share in 2004, according to a report published by Gartner Dataquest, an independent market research firm. The dry strip market size for 2006 is estimated to be $301 million. The addition of the Suprema to Mattson Technology's full line of FEOL and BEOL strip product offerings is expected to further strengthen Mattson's leadership position in the dry strip market.
About Suprema
Suprema utilizes a new and revolutionary platform design to deliver superior productivity and reliability with exceptionally low cost of ownership for manufacturing at the 90 nm node and below. The system's enhanced RF plasma source, based on Mattson's field-proven, proprietary inductively coupled plasma (ICP) technology, enables very high strip rates and its innovative wafer transfer mechanism provides the highest throughput in the industry. Suprema provides excellent within-chamber and chamber-to-chamber process repeatability and offers a wide process window for both FEOL and BEOL applications, including bulk photoresist strip, high-dose implant strip (HDIS), descum and resist recess.
About Mattson Technology, Inc.
Mattson Technology, Inc. is the leading supplier of dry strip equipment and the second largest supplier of rapid thermal processing equipment in the global semiconductor industry. The company's strip and RTP equipment utilize innovative technology to deliver advanced processing performance and productivity gains to semiconductor manufacturers worldwide for the fabrication of current- and next-generation devices. For more information, please contact Mattson Technology, Inc., 47131 Bayside Parkway, Fremont, Calif. 94538. Telephone: (800) MATTSON/(510) 657-5900. Fax: (510) 492-5911. Internet: http://www.mattson.com/.
CONTACT: Lauren Vu of Mattson Technology, Inc., +1-510-492-6518, or fax:
+1-510-492-2800, lauren.vu@mattson.com
Contacts:
General Information:
Lauren Vu
USA
Phone: 510-492-6518
FAX: 510-492-2800 E-mail this person Company Information: Name: Mattson Technology, Inc. Address: 2800 Bayview Dr. City: Fremont State: CA ZIP: 94538 Country: USA Phone: 510-657-5900 FAX: 510-226-8241 http://www.mattson.com/
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