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Tempco Electric Heater Corporation
Designs and Manufactures Heating Elements, Temperature Sensors and Controls, and Turnkey Process Heating Systems. Thousands of products including accessory items are available from stock. Request our 864 page Visionary Solution catalog for product and engineering information.
Heat Sinks cool condensed electronic packages.
Heat Sinks cool condensed electronic packages.

Heat Sinks cool condensed electronic packages.


January 24, 2006 - Fabricated from lightweight extruded aluminum, maxiFLOW(TM) heat sinks are utilized for cooling BGAs and hot components inside electronic systems. Featuring low profile spread fin arrays to enable convectional air cooling within restricted/low air flow conditions, they are available in lengths and widths ranging from 10 x 10 mm to 60 x 60 mm, and heights starting at 2 mm.

(Archive News Story - Products mentioned in this Archive News Story may or may not be available from the manufacturer.)

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Heat Sinks cool 17 x 17 mm BGA packages.
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 See more related product stories:
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Heat Sinks Deliver High Performance in Low Airflow Conditions


Heat Sinks Deliver High Performance in Low Airflow Conditions

Norwood, Massachusetts, January 19, 2006 - Advanced Thermal Solutions has introduced maxiFLOW(TM) heat sinks for cooling BGAs and other hot components in the restricted air flow conditions typical of today's condensed electronic packages. MaxiFLOW heat sinks feature a low profile, spread fin array that maximizes surface area for more effective convection (air) cooling. The heat sinks are fabricated from extruded aluminum which minimizes thermal resistance from the base to the fins, reduces weight, and keeps costs low. Tests on maxiFLOW heat sinks using an air flow rate of just 100 lfm (linear feet per minute) show that device junction temperatures (Tj) can be reduced by more than 40 percent below the temperatures achieved using other heat sinks.

The expected life span of an electronic component is exponentially dependent on temperature. Cooler parts have longer lives. Higher performance maxiFLOW heat sinks can help ensure reliable product life at a lower cost than custom designed solutions and other extruded sinks. MaxiFLOW heat sinks are available in lengths and widths ranging from 10 x 10 mm to 60 x 60 mm, and heights starting at just 2 mm.

Unit pricing for maxiFLOW heat sinks begins at $2.50 in production quantities. For more information, contact Advanced Thermal Solutions at 1-781-769-2800, or visit www.qats.com.

Advanced Thermal Solutions is a leading engineering and manufacturing company supplying complete thermal and mechanical packaging solutions from analysis and testing to final production. ATS provides a wide range of heat sinks and laboratory-quality thermal instrumentation, along with thermal design consulting services and training.

For information, please contact:
Sales
Advanced Thermal Solutions, Inc.®
89-27 Access Road
Norwood, MA 02062 USA
Tel: 781-769-2800
Email: sales@qats.com

Norman Quesnel,
Marketing Communications Specialist
Advanced Thermal Solutions, Inc
89-27 Access Road
Norwood, MA 02062 USA
Tel: 781-769-2800
E-mail: nquesnel@qats.com


Contacts:

Marketing:
Norman Quesnel Marketing Communications Specialist
USA
Phone: 781-769-2800
Send email  E-mail this person

Company Information:
Name: Advanced Thermal Solutions Inc.
Address: 89 Access Rd., Suite 127
City: Norwood
State: MA
ZIP: 02062
Country: USA
Phone: 781-769-2800
FAX: 781-769-9979
http://www.qats.com


More New Product News from this company:
Heat Sinks cool 17 x 17 mm BGA packages.
Benchtop Wind Tunnel enables thermal and airflow testing.
Heat Sinks help cool linear LED lighting products.
Heat Sink cools communications processors.
Heat Sinks cool Freescale MPC8641D dual-core processors.
Heat Sink cools BGA components in low airflow conditions.
Temperature and Velocity Scanner controls up to 32 sensors.
Candlestick Sensor measures temperature and air velocity.
Board provides air flow and temperature measurement.

Other News from this company:
Advanced Thermal Solution's Dr. Kaveh Azar to Keynote the 8th Annual International Business & Technology Summit for Thermal Management of Electronics
New Thermal Management Webinar Series for 2008
New Catalog Features 380+ Heat Sinks Available in 24 Hours
ATS- Digi-Key Partnership Provides Full-Range of BGA Cooling Solutions
Digi-Key and Advanced Thermal Solutions, Inc. Sign Worldwide Distribution Agreement
ATS to Present Thermal Management Tutorial Series
ATS' maxiGRIP(TM) Heat Sink Attachment System Passes Tough Military Shock Testing
ATS and NTS Partnership Provides Combined Design, Validation and Compliance Testing



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