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Beam Switching Module facilitates UV laser processing.
Beam Switching Module facilitates UV laser processing.

Beam Switching Module facilitates UV laser processing.


January 24, 2006 - With no grease or oil in beam delivery design and no organic materials, laser beam switching module enables user to switch entire beam from one path to another. Its 50 x 50 mm clear aperture allows passage of larger-diameter homogenized beam without beam corner clipping. Used with short-wavelength UV excimer beams, including 157, 193, and 248 nm, vacuum UV product offers opportunity to deflect beam out of production to perform beam diagnostics and check characteristics.

(Archive News Story - Products mentioned in this Archive News Story may or may not be available from the manufacturer.)

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JPSA Introduces Large Format Beam Switching Module for UV Laser Processing


Hollis, New Hampshire, USA -- J P Sercel Associates (JPSA) announces the introduction of a new large format laser beam switching module that gives the user the ability to quickly and accurately switch the entire beam from one path to another, for example, between two different experiments, or between two separate processes. JPSA's switching module features a large-format design with a 50mm x 50mm clear aperture which allows passage of a larger-diameter homogenized beam without beam corner clipping. Additionally, it is a vacuum UV (VUV) product; thus, it can be used with short-wavelength UV excimer beams including 157nm, 193nm, and 248nm. There is no grease or oil in any of JPSA's VUV beam delivery designs, and all organic materials have been removed to prevent degradation of those materials by UV radiation and consequent contamination of the optics and interior chamber. This switching module can be purged with high-purity gases such as nitrogen.

JPSA's new large format laser beam switching module is an industrial-grade product designed for 24/7 industrial service. It is designed for integration into a laser beam delivery system and offers the user the opportunity to deflect the beam out of production when desired to perform beam diagnostics, check beam homogeneity, pulse width, or other beam characteristics, since an excimer laser beam changes characteristics over time and usage. The new switching module features remote control that allows the user to insert or remove a beam splitter and is magnetically pre-mounted so that the beam splitter will be accurately located. It has a true gimbal design and allows either a 90-degree turn or straight-through beam path. Switching is mechanical and the unit holds a very accurate tolerance swing when switching from one path to the next, allowing the user to hold micron precision with two different beam lines. Changing beam direction is thus as simple as flipping a toggle switch.

JPSA products and services include UV excimer and DPSS laser micro machining systems, UV and VUV laser beam delivery systems, UV laser materials processing development, optical damage testing, and excimer laser refurbishment services. JPSA Laser operates a high-performance UV laser job shop as well as a systems engineering and manufacturing business. For more information, visit www.jpsalaser.com, or contact the company at 17D Clinton Drive, Hollis, NH 03049 USA, Tel. 603.595.7048, fax 603.598.3835.


Contacts:

General Information:
Michael L. Martel
USA
Phone: 603-595-7048
FAX: 603-598-3835
Send email  E-mail this person

Company Information:
Name: JP Sercel Associates, Inc.
Address: 220 Hackett Hill Rd.
City: Manchester
State: NH
ZIP: 03102
Country: USA
Phone: 603-518-3200
FAX: 603-518-3298
http://www.jpsalaser.com


More New Product News from this company:
Laser Wafer Scribers offer frontside/backside capabilities.
Laser Scribers isolate, interconnect thin film solar cells.
Dicing System handles 100 mm sapphire wafers.
System Control Software facilitates micromachining setup.
Materials Processing Unit suits micromachining applications.
Motorized Rotary Stage suits wafer processing.
UV Laser Systems perform 12 in. silicon wafer singulation.
Laser Workstation features micron-scale imaging cameras.
UV Laser Systems perform wafer dicing and micromachining.
Wafer Dicing System processes wafers up to 6 in. dia.

Other News from this company:
JPSA Announces Partnership with BlueON in Korea
JPSA Supplies State-of-the-Art UV Laser Micromachining Workstation to Los Alamos National Laboratory
Cristian Porneala Joins JPSA as Applications Engineer
JPSA Completes Move to New Manchester, NH Facility
JPSA Offers Select Optics for UV Laser Systems
JPSA Announces Expansion in Europe; Appoints New International Sales and Marketing Manager
JPSA Begins Move to New Manchester, NH Facility
JPSA Announces Distribution Agreement for NCLR 'Super Laser' Sirius 1000
JPSA Announces Shipments of Automated Cassette-to-Cassette Wafer Processing Systems
JPSA Announces China Distribution and Service Agreement with BOET



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