January 13, 2006 -
Ultrasonic Lab Calender utilizes ultrasonic bonding, embossing, slitting, or cutting and sealing technology at speeds up to 1,000 fpm and bonding widths up to 8 ft. Non-contact/non-wear technology with Micro Gap control allows bonding at high speeds while virtually eliminating wear between sonotrode and anvil drum. Ultrasonic bonding technology combined with web tension control capabilities enables range of trial possibilities.
Archive Press Release
(Products mentioned in this Archive Press Release may or may not be available from the manufacturer.)
Release date: December 6, 2005
Herrmann Ultrasonics Introduces New Nonwovens Lab Calender for High Speed Continuous Ultrasonic Bonding Application Trials at North American Headquarters
The new ultrasonic lab calender at Herrmann Ultrasonics' North American headquarters in Schaumburg, IL is now available for application development. This system utilizes ultrasonic bonding, embossing, slitting, or cutting and sealing technology at speeds of up to 1000 feet/min (300 m/min.) and bonding widths of up to 8 feet (200 mm). The
ultrasonic calender features Herrmann Ultrasonics' patented NON-CONTACT / NON-WEAR technology with MICROGAP control, which allows bonding at high speeds while virtually
eliminating wear between the sonotrode and the anvil drum. The state-of-the-art ultrasonic bonding technology combined with web tension control capabilities
enables a wide range of trial possibilities from basic feasibility studies to in-depth
application development and simulation of the ultrasonic bonding process of the future production line.
A wide variety of anvil drums allows bonding patterns meeting the requirements of each individual application. Herrmann Ultrasonics also offers support in designing custom bond patterns to optimize bond performance for special application requirements. New bond pattern performance can be tested and optimized on the ultrasonic lab calender before upscaling the system to a full size production line.
To learn more about how Herrmann Ultrasonics can help you reduce costs by using ultrasonic bonding technology or to schedule trials, please contact Torsten Brieger, Product Manager NONWOVENS via e-mail to Torsten.Brieger@HerrmannUltrasonics.com or call Herrmann Ultrasonics at 847-985-7344.
Contacts:
General Information:
Torsten Brieger Product Manager
USA E-mail this person Company Information: Name: Herrmann Ultrasonics, Inc. Address: 1261 Hardt Circle City: Bartlett State: IL ZIP: 60103 Country: USA Phone: 630-626-1626 FAX: 630-626-1627 http://www.herrmannultrasonics.com
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