September 2, 2005 - Available for Electrovert® Electra®, Vectra™, and Econopak® Gold wave soldering systems, Quick-Change Solder Pot facilitates changeover between tin/lead and lead-free alloys. Cast iron solder pot and components are resistant to corrosive nature of lead-free solders and withstand temperatures of 600şF. UltraFill™ Lead-Free Nozzles are placed close together to minimize temperature drop between nozzles, minimizing bridge defects and dross production.
(Archive News Story - Products mentioned in this Archive News Story may or may not be available from the manufacturer.)
FRANKLIN, MASSACHUSETTS, USA, August 23, 2005 – Speedline Technologies will exhibit its Quick-Change Solder Module equipped with the new UltraFill™ Nozzle at the company’s booth #5710 at ATExpo 2005 in Rosemont, IL.
With the increasing use of lead-free alloys new challenges arise for electronic manufacturers. To simplify the transition and enhance product quality Speedline offers two options for its Electrovert® Electra®, Vectra™ and Econopak® Gold wave soldering systems which have been handling lead-free applications for many years.
The Quick-Change Solder Pot’s design allows for easy changeover between tin/lead and lead-free alloys. It is inserted in a cart on rollers making it simple to move the pot to and from a storage location.
The Quick-Change Solder Module’s cast iron solder pot and its components are resistant to the corrosive nature of lead-free solders and are capable of withstanding temperatures of 315şC (600şF). All stainless steel components that come into contact with the solder are composed of ElectroCoat corrosion-resistive surface conversion as a standard feature, or titanium as an option.
Speedline’s new UltraFill™ Lead-Free Nozzles feature an innovative technology and design to overcome a variety of process challenges inherent in lead-free wave soldering.
The nozzles are 40% wider than traditional tin/lead nozzles to increase contact length and dwell time. The nozzles are also placed closer together to reduce the temperature drop between the nozzles – so that less heat is needed to reflow solder joints in the second wave. As a result, UltraFill nozzles deliver better hole fill without requiring a slowing of the conveyor, while reducing bridge defects and dross production.
A Nitrogen shroud is available as an option – and allows for either air or nitrogen operation, as determined by the desired recipe, without the need to change nozzles. The shroud both encompasses the nozzles in the pot and contains the dross in the solder pot. The shroud lifts for easy maintenance and dedrossing – without nozzle removal.
Recent applications have shown UltraFill nozzles enhance both product quality and process performance – ranging from vast improvements in hole fill to dramatic reductions in bridges/solder shorts.
About Speedline Technologies
Speedline Technologies is the global leader in process knowledge and expertise for the PCB assembly and semiconductor industries. Based in Franklin, Massachusetts, U.S.A., the company markets five best-in-class brands — Accel microelectronics cleaning equipment; Camalot dispensing systems; Electrovert wave soldering, reflow soldering, and cleaning equipment; MPM stencil and screen printing systems; and Protect global services, support, and training solutions. Speedline Technologies is Frost & Sullivan’s “2005 Surface Mount Technology Company of the Year.” For more information, visit: http://www.speedlinetech.com or contact Speedline at:
• USA: Speedline Technologies, 16 Forge Park, Franklin, MA 02038 USA, Tel: 1-508-520-0083, Fax: 1-508-520-2288, E-mail: info@speedlinetech.com;
• Asia: Speedline Technologies Asia Pte Ltd, 150 Kampong Ampat, #05-08 KA Centre, Singapore 368324, Tel: 65-6286-6635, Fax: 65-6289-9411, E-mail: asiamarketing@speedlinetech.com.Company Information: Name: Speedline Technologies Inc. Address: 16 Forge Park City: Franklin State: MA ZIP: 02038 Country: USA Phone: 508-520-0083 FAX: 508-520-2288 http://www.speedlinetechnologies.com
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