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Advertisement
High-Temperature Epoxy cures at room temperature.
High-Temperature Epoxy cures at room temperature.

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High-Temperature Epoxy cures at room temperature.


August 31, 2005 - Suited for potting, encapsulation, sealing, and bonding, Polymer System EP39MHT exhibits electrical insulation and chemical inertness for service up to 450°F. This 2-component system cures at ambient or elevated temperatures, is 100% reactive, and contains no VOCs. Able to bond similar and dissimilar substrates, cured product is thermoset solid featuring resistance to thermal and/or mechanical shocks and can be color-coded to facilitate processing.

(Archive News Story - Products mentioned in this Archive News Story may or may not be available from the manufacturer.)

 See related product stories
Potting Compound features 6 hr working life.
Ceramic Compound bonds high power lamps.
One-Part Silicones cure rapidly when exposed to UV/Vis light.
Epoxy Potting Compound has low viscosity formulation.
High-Purity Gels exhibit minimal moisture permeability.
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 See more related product stories:
Potting Compound withstands temperature extremes.
Ceramic Adhesive suits high temperature potting applications.
Ceramic Potting Compound withstands up to 2,500°F.
Condensation Cured Silicone withstands temperatures to 400°F.
Encapsulation and Delivery System suits skin care products.
Silicone Potting Compound assures complete fill-in.
Potting Compound has flexible, low-viscosity formulation.
Ceramic Compound is used to assemble heaters and igniters.
Silicone Compound has Shore A hardness of 45.
Adhesive and Potting Compound has UV-curable formula.
Epoxy Resin Compound features high thermal conductivity.
Silicone Elastomer features electrical insulation properties.
Potting/Encapsulating Compound has water-clear formula.
Ceramic Compound has compressive strength of 11,500 psi.
Polyurethane Potting Compounds range from Shore A 25-90.
Epoxy Compound offers electrical potting and encapsulation.
UV Curable Adhesive targets electronics manufacturing.
Ceramic Compound offers high-temperature thermal insulation.
Potting Compound suits high-temperature applications.
Potting Compound may be used in applications to 2,800°F.

New Room Temperature Curing, High Temperature Resistant Epoxy

Master Bond Polymer System EP39MHT is a unique high performance epoxy compound which combines easy processability with outstanding physical strength properties, superior electrical insulation and chemical inertness for service up to 450°F. It is a two component system which cures readily at ambient or more quickly at elevated temperatures. The cured epoxy is a tough strong thermoset solid featuring desirable physical, electrical and chemical characteristics together with outstanding resistance to thermal and/or mechanical shocks. It is 100% reactive and does not contain any volatiles. Master Bond Polymer System EP39MHT has proven especially attractive for potting, encapsulation, sealing and bonding applications. As it develops very little heat during the curing reaction, it has been found to be particularly useful for potting or encapsulation of thick sections with complicated configurations up to several inches as well as thin sections with the need for minimal shrinkage and stress development. It can be color coded to facilitate processing.

Master Bond Supreme EP39MHT is based on a novel polyfunctional epoxy resin and a newly developed hardener composition which makes possible both the attainment of ambient temperature cures and the development of outstanding thermal stability up to 450°F. Adhesion to both similar and dissimilar substrates such as metals, glass, ceramics, woods, vulcanized rubbers and many plastics is excellent. The volume resistivity of the cured epoxy exceeds 1012 ohm cm at 75°F. Service temperature range extends from -80°F to +450°F. Master Bond Polymer System EP39MHT has found wide acceptance in the electronic, electrical, computer, optoelectronic, aerospace, appliance, metalworking, automotive and chemical industries. It is available in pints, quarts, gallons, 5 gallon pails and drums.

For further information, please contact our Technical Support Department.

USA & Canada

Phone: 201-343-8983

Fax: 201-343-2132

E-mail: technical@masterbond.com

Asia, Central and South America Western U.S and Western Canada

Phone: 818-793-5605

Fax: 201-696-9031

Email: catech@masterbond.com

Eastern and Western Europe and Africa

Phone:+44-207-039-0034

Fax: +44-207-060-0628

E-mail: eutech@masterbond.com

Middle East

Phone: 972-2-652-8384

Fax: 972-2-652-8402

E-mail: meda@masterbond.com

Contacts:

Marketing:
James Brenner VP of Marketing
USA
Send email  E-mail this person

Company Information:
Name: Master Bond, Inc.
Address: 154 Hobart St.
City: Hackensack
State: NJ
ZIP: 07601
Country: USA
Phone: 201-343-8983
FAX: 201-343-2132
http://www.masterbond.com


More New Product News from this company:
Potting Compound features 6 hr working life.
Epoxy Adhesive has linear shrinkage of 0.0003 in./in.
Epoxy Adhesive suits temperatures up to 600°F.
Thermal Adhesive Film aids heat-transfer in electronic parts.
Thermal Adhesive Film provides electrical insulation.
PCB Conformal Coating cures tack free in less than 5 min.
Epoxy Adhesive features high thermal conductivity.
Epoxy Adhesive contains no volatiles or hazardous solvents.
Epoxy System is reinforced with nanosilica fillers.
Thermal Conductive Epoxy Adhesive cures at room temperature.

Other News from this company:
UV Curable Compound with Superior Gap Filling Properties
Low Exotherm Potting Compound Specially Designed for Heat Sensitive Components
Revolutionary Polyethylene Adhesive Requires No Pretreatment
Radio-Opaque Medical Adhesive in the Service of Radiographic Imaging
A Versatile Aerospace Epoxy Conquers Cryogenic Wind Tunnel
New Cost Effective, High Conductivity Epoxy
Cost Effective Anti-Static Electrically Conductive Latex Coating
Thermally Conductive Epoxy is Exceptionally Flexible



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