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Epoxy Potting Compound has mixed viscosity of 6,700 cp.


August 25, 2005 - Targeted for electronic assembly manufacturers, 2-part 20-3063 epoxy potting and encapsulating compound has 1:1 mix ratio with resin pigmented black and catalyst white for visual indication that products have been properly mixed. It cures at room temperature to 75–80 Shore D hardness, has 45 min pot life, usable temperature range of -40 to 130°C, and dielectric strength of 450 V/mil.

(Archive News Story - Products mentioned in this Archive News Story may or may not be available from the manufacturer.)

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 See more related product stories:
Epoxy Potting Compound has low viscosity formulation.
High-Purity Gels exhibit minimal moisture permeability.
Potting Compound withstands temperature extremes.
Ceramic Adhesive suits high temperature potting applications.
Ceramic Potting Compound withstands up to 2,500°F.
Condensation Cured Silicone withstands temperatures to 400°F.
Encapsulation and Delivery System suits skin care products.
Silicone Potting Compound assures complete fill-in.
Potting Compound has flexible, low-viscosity formulation.
Ceramic Compound is used to assemble heaters and igniters.
Silicone Compound has Shore A hardness of 45.
Adhesive and Potting Compound has UV-curable formula.
Epoxy Resin Compound features high thermal conductivity.
Silicone Elastomer features electrical insulation properties.
Potting/Encapsulating Compound has water-clear formula.
Ceramic Compound has compressive strength of 11,500 psi.
Polyurethane Potting Compounds range from Shore A 25-90.
Epoxy Compound offers electrical potting and encapsulation.
Compounds blend epoxy and graphite for strong bonds.
UV Curable Adhesive targets electronics manufacturing.

Epoxies, Etc...Develops New Low Cost Potting & Encapsulating Compound

CRANSTON, RHODE ISLAND, USA

20-3063 is an electronic grade epoxy potting and encapsulating compound. This product provides several advantages to electronic assembly manufacturers.

The 20-3063 is low in viscosity allowing fast flow in and around electronic components. It has a non-critical one to one mix ratio ensuring a completely cured assembly even if slightly off ratio. The 20-3063 is formulated to be a low cost product capable of replacing many higher cost potting systems.

Samples and information about the 20-3063 can be obtained by visiting our website: www.epoxies.com.

DESCRIPTION:

20-3063 is an electronic grade potting and encapsulating compound. This is a low cost epoxy system designed for applications requiring a low viscosity. 20-3063 has an easy one to one mix ratio by weight or volume. The resin is pigmented black and the catalyst white for a visual indication that the products have been properly mixed together.

FEATURES:

• Low Viscosity

• Easy 1:1 Mix Ratio

• Low Cost

• Room Temperature Cure
Typical Specifications:
Mix Ratio, By Volume or Weight 1:1
Color
Resin Black
Catalyst White
Viscosity, 25°C, cps
Resin 5,500
Catalyst 8,000
Mixed Viscosity, 25°C, cps 6,700
Specific Gravity, 25°C, cps
Resin 1.54
Catalyst 1.53
Pot Life, 100 Gram Mass, 25°C 45 Minutes
Hardness, Shore D 75-80
Temperature Range of Use, °C -40 to 130
Dielectric Strength, volts/mil 450



Contacts:

General Information:
Paul C. Harrington Technical Director
USA

Company Information:
Name: Epoxies Etc.
Address: 21 Starline Way
City: Cranston
State: RI
ZIP: 02921-3407
Country: USA
Phone: 800-EPOXIES
FAX: 401-946-5526
http://www.epoxies.com


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Epoxy System is optically transparent.
Epoxy Adhesive offers max continuity of conductivity.
Epoxy Adhesive is suitable for aerospace applications.
Adhesive and Potting Compound has UV-curable formula.
Potting/Encapsulating Compound has water-clear formula.
Polyurethane Potting Compounds range from Shore A 25-90.
UV Curable Adhesive targets electronics manufacturing.

Other News from this company:
Epoxies, Etc Announces New IllumaBond(TM) Brand
Epoxies, Etc... Announces New IllumaBond(TM) Brand



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