Archive News Story
(Products mentioned in this Archive News Story may or may not be available from the manufacturer.)
Physical Layer Chip complies with PCI Express 1.1.
July 26, 2005 - PCI Express PHY offers both 8-bit and 16-bit interface, which is based on PHY Interface for PCI Express Architecture v1.0 from Intel. Chip is designed to interface with ASICS as well as FPGAs in PC add-in cards, communications, test equipment, servers, and other embedded system applications.
Archive Press Release
(Products mentioned in this Archive Press Release may or may not be available from the manufacturer.)
Release date: July 18, 2005
Texas Instruments Announces Next Generation PCI Express Physical Layer (PHY)
New Device Saves Board Space, Tested for PCI Express 1.1 Compliance
DALLAS (July 18, 2005) --- Expanding its broad portfolio of PCI Express* products, Texas Instruments Inc. (TI) (NYSE: TXN) announces the third generation of its discrete PCI Express physical layer (PHY) chip. The new device, designed for flexibility and space savings, is targeted at interfacing with ASICs as well as low cost FPGAs in PC add-in cards, communications, test equipment, servers and other embedded system applications. (See www.ti.com/pciexpress for more information on TI’s overall PCI Express portfolio.)
TI has designed the new PHY to be compliant to PCI Express 1.1 specifications, which is critical for interoperability with other PCI Express applications. The new device is based on TI’s proven test chip that has been demonstrated at numerous trade shows and is also used in TI’s PCI Express 1394a and PCI Express bridge technologies that are available today.
The TI PCI Express PHY gives board designers flexibility by offering both an 8 bit and 16 bit interface. The interface also is based on the PHY Interface for the PCI Express (PIPE) Architecture version 1.0 from Intel, with minor enhancements that allow for lower power consumption and a simplified interface for easy integration.
”The PCI Express PHY is the foundation of all PCI Express applications, and we see a strong transition to PCI-Express across multiple market segments," said Brian Whitaker, marketing segment manager, computer connectivity solutions, TI.
Samples of the PCI Express PHY will be available in the second half of 2005 and TI will price the device to enable low cost PCI Express ASIC and FPGA solutions in the market.
TI´s Commitment to PCI Express
TI's roadmap includes a complete portfolio of products built for the PCI Express architecture, enabling chip-to-chip interconnect, I/O interconnect for adapter cards and an I/O attach point to other interconnects such as PCI, 1394 (FireWire) and USB.
About PCI Express
PCI Express is a point-to-point serial differential low-voltage interconnect that consolidates application requirements for use by multiple market segments. PCI Express architecture is a high-performance, highly flexible, scalable, reliable, stable and cost-effective general-purpose I/P architecture that seamlessly complements existing PCI buses and will transition the market over the next several years, allowing system and communication designers to use new topologies.
Texas Instruments Incorporated provides innovative DSP and analog technologies to meet our customers' real world signal processing requirements. In addition to Semiconductor, the company's businesses include Sensors & Controls, and Educational & Productivity Solutions. TI is headquartered in Dallas, Texas, and has manufacturing, design or sales operations in more than 25 countries.
Texas Instruments is traded on the New York Stock Exchange under the symbol TXN. More information is located on the World Wide Web at www.ti.com.
Trademarks
All trademarks and registered trademarks are property of their respective owners.Company Information: Name: Texas Instruments, Inc. (TI) Address: 12500 TI Blvd. City: Dallas State: TX ZIP: 75243-4136 Country: USA Phone: 800-336-5236 FAX: 972-995-4360 http://www.ti.com/
News provided by ThomasNet Industrial Newsroom® (TIN). TIN is a comprehensive source
of new and timely product information in the industrial marketplace. TIN supplies new product
information to the web sites, e-marketplaces and print publications that serve the
industrial marketplace. For press release submissions please go to
http://www.productnews.com/SubmitPRPage.html.
BY ACCESSING, BROWSING AND/OR USING THIS WEB SITE AND/OR ANY WEB SITES PROVIDED BY
ProductNews.com, YOU AGREE TO BE BOUND BY THE TERMS OF USE
AGREEMENT.
![[Get Copyright Permissions]](http://license.icopyright.net/images/icopy-w.gif){kind=small}
