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Current Feedback Amplifier operates to 37 V.
Current Feedback Amplifier operates to 37 V.

Click Here to Enlarge Picture

Current Feedback Amplifier operates to 37 V.


June 29, 2005 - High-voltage Model THS3001HV features slew rate of 6,500 V/µs, 40 ns settling time, 420 MHz bandwidth, and 1.6 nV/rtHz input referred voltage noise. Housed in 8-pin, mini small-outline package with PowerPad®, unit is available in commercial temperature grade from 0–70°C and industrial temperature grade from -40 to 85°C. Applications include test and measurements, communications, and imaging.

(Archive News Story - Products mentioned in this Archive News Story may or may not be available from the manufacturer.)

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High Voltage Amplifiers measure 100 x 50 x 26 mm.
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Power Amplifier provides up to 80 kV peak-to-peak.
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TI Introduces High-Voltage Version of Industry-Leading Current-Feedback Amplifier

DALLAS (June 8, 2005) – Texas Instruments (TI) (NYSE: TXN) announced today that it has extended the operating voltage of its popular high-speed, current-feedback amplifier with a new high voltage version. The new version matches the original device’s fast slew rate and settling time, high bandwidth and low input referred voltage noise while extending the operating voltage to 37V. The THS3001HV is ideal for large-signal applications requiring excellent transient response, low noise and low distortion, such as in test and measurement, communications and imaging. (See www.ti.com/sc05130.)

The THS3001HV extends the performance of the THS3001, the industry’s fastest 33V high-speed, current feedback amplifier, to 37V (+/-18.5V) power supply systems to allow for increased output voltage swings up to 33V peak-to-peak and increased common-mode operating range. The THS3001 outperforms competing devices in bandwidth, slew rate and distortion performance. The THS3001HV features the same fast slew rate of 6500V/µs, 40 ns settling time, 420 MHz bandwidth and 1.6 nV/rtHz input referred voltage noise plus the extended voltage range.

The THS3001HV is available now in volume from TI and its authorized distributors in an eight-pin mini small-outline package (MSOP) with PowerPad®. The device will also be available mid-summer 2005 in an eight-pin small-outline integrated circuit (SOIC) package. Suggested resale pricing in quantities of 1,000 is $5.00 for the commercial temperature grade (0C to 70C) and $5.15 for the industrial temperature grade (-40C to 85C). Samples are available for 24-hour delivery.

Key Features

High Speed

420 MHz bandwidth (G = 1, -3 dB)

6500V/µs slew rate (Vcc = ±15V, 20V step)

40 ns settling time (0.1%, Vcc = ±15V, 10V step)

High output drive, Io = 100 mA

Excellent video performance

115 MHz bandwidth (0.1 dB, G = 2)

0.01 percent differential gain

0.02 degrees differential phase

Low 1 mV (typ) input offset voltage

Very low distortion (Vcc = ±15V, 2Vpp, RL=150 ohms)

THD = -96 dBc at f = 1 MHz

THD = -80 dBc at f = 10 MHz

Wide range of power supplies

Vcc = 9V (+/-4.5V) to 37V (+/-18.5V)

Low Quiescent Current

Icc = 6.9mA (typ at Vcc=37V)

For an overview of amplifiers and linear products available from TI, please see amplifier.ti.com.

Texas Instruments Incorporated provides innovative DSP and analog technologies to meet our customers' real world signal processing requirements. In addition to Semiconductor, the company's businesses include Sensors & Controls, and Educational & Productivity Solutions.

TI is headquartered in Dallas, Texas, and has manufacturing, design or sales operations in more than 25 countries.
Company Information:
Name: Texas Instruments, Inc. (TI)
Address: 12500 TI Blvd.
City: Dallas
State: TX
ZIP: 75243-4136
Country: USA
Phone: 800-336-5236
FAX: 972-995-4360
http://www.ti.com/


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Basestation Manufacturers Can Meet Carrier Requirements to Support Data-Intensive, Next-Generation Mobile Applications While Keeping an Eye on Costs with TI's New Powerful, Scalable LTE Platform
TI Eases Design for Energy-Efficient and Energy Harvesting Applications with Expanded 16- and 32-Bit MCU Tools Portfolio
TI's Single-Chip MSP430 MCU and Low Power RF Solution Advances Networking, Energy Harvesting, Security, Lighting and Metering
TI Smart Battery Technology Protects and Manages Multi-Cell Lithium Battery Systems
Energy Harvesting Becomes Reality With AdaptivEnergy's Wireless, Remote Sensing Solution Based On TI Ultra-Low Power Technology
Logic and Texas Instruments Offer Zoom(TM) Medical OMAP35x Development Kit and System on Modules (SOM) for Medical Innovations
TI's Five Modular 32-Bit TMS320F28x DSC Development Kits Jump-Start Digital Power and Embedded Control Applications
TI Provides Free Wireless MCU Development Kits, Helping Embedded Designers
TI CEO Rich Templeton to Speak at Morgan Stanley Investor Conference
TI Senior Vice President Greg Delagi to Speak at Goldman Sachs Investor Conference
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MIT and Texas Instruments Develop Energy-Efficient Microchip
TI Senior Vice President Gregg Lowe to Speak at Thomas Weisel Investor Conference
Incotex Automated Meter Management Systems Improve Energy Efficiency and Accuracy Using TI Controller Technology
TI Vice President Ron Slaymaker to Speak at Raymond James Investor Conference
TI Senior Vice President Gregg Lowe to Speak at Lehman Investor Conference
Texas Instruments Acquires POWERPRECISE Solutions to Expand Power Management Business
New TI Floating-Point F28335 eZdsp(TM) Starter Kit Speeds Development for Greener Industrial Applications



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