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UV Curable Epoxy Resin exhibits 2-3% shrinkage upon cure.
UV Curable Epoxy Resin exhibits 2-3% shrinkage upon cure.

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Archive News Story
(Products mentioned in this Archive News Story may or may not be available from the manufacturer.)


UV Curable Epoxy Resin exhibits 2-3% shrinkage upon cure.


November 24, 2004 - Suited for bonding, sealing, and coating, UV16 single-component, epoxy resin based polymer system bonds to plastics, glass, ceramics, and metals. Product is 100% reactive and does not contain any solvents or other volatiles. With operating temperature range of -60 to +300°F, resin has glass transition temperature over 125°C after post curing at 90 to 125°C for 30 min. It cures in thicknesses up to .125 in. and has viscosity of 120–150 cps.


Related categories:   Adhesives and Sealants  |  Chemical Processing and Waste Management


Archive Press Release
(Products mentioned in this Archive Press Release may or may not be available from the manufacturer.)


Release date: November 22, 2004

New UV Curable Epoxy Resin Has Superior Physical Strength and Low Shrinkage

A new one component, high strength, low viscosity UV curable epoxy resin based polymer system for bonding, sealing and coating has been introduced by Master Bond Inc., Hackensack, N.J. This compound is called UV16 and exhibits a desirably fast cure rate at ambient temperatures upon exposure to UV light even in the presence of air. UV16 is tough, strong and durable. It has excellent bond strength to a wide variety of substrates including plastics, glass, ceramics and most metals. Impact strength is high - Gardner impact measurements exceed 320 inch #.

Master Bond UV16 is 100% reactive and does not contain any solvents or other volatiles. Shrinkage upon cure is 2-3%, substantially lower than that exhibited by most free radical types of UV curable compositions. UV16 has a service operating temperature range of -60°F to 300°F. Post curing the UV16 at 90°C to 125°C for 30 minutes will give it a glass transition temperature over 125°C, far higher than conventional type UV systems. The post curing is also effective in enhancing chemical resistance, particularly to acids and solvents.

Master Bond UV16 will cure in thicknesses up to .125 of an inch. It has a viscosity of 120-150 cps and is easy to apply. It is available for use in pint, quart, gallon and 5 gallon containers. It is also available in syringe applicators. Storage stability of UV16 is 6 months at room temperature in unopened containers.

For further information, please contact:

James Brenner, Marketing Manager
154 HOBART STREET • HACKENSACK, NEW JERSEY 07601-3922 • TEL: 201-343-8983 • FAX: 201-343-2132

Visit our WEBSITE at http:/www.masterbond.com Or E-Mail us at Main@Masterbond.com

Contacts:

James Brenner Marketing Manager
USA
Phone: 201-343-8983
FAX: 201-343-2132
Send email  E-mail this person

Company Information:
Name: Master Bond, Inc.
Address: 154 Hobart St.
City: Hackensack
State: NJ
ZIP: 07601
Country: USA
Phone: 201-343-8983
FAX: 201-343-2132
http://www.masterbond.net/mysql/createdfiles/page010.php

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Related keywords:   SINGLE COMPONENT  |  UV CURE  |  RESIN  |  POLYMER  |  EPOXY


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Related Stories:
Oct 16, 2007Waterborne Epoxy Resin offers fast-dry properties.
Jun 20, 2002Encapsulating Resin can cure with several agents.
Dec 11, 2001Epoxy Resin bonds to most materials.
More New Product News from this company:
Jun 26, 2008Adhesive gels within 45 sec and is cured within 5 minutes.
Jun 25, 2008Condensation Cured Silicone withstands temperatures to 400°F.
Jun 19, 2008Instant-Cure Cyanoacrylate Adhesive forms strong bonds.
Jun 6, 2008UV Adhesive is USP Class VI approved for medical devices.
May 30, 2008UV Curable Adhesive targets medical device manufacturing.
May 6, 2008Epoxy Adhesive is suited for cryogenic applications.
May 6, 2008Epoxy Resin System passes NASA's low outgassing test.
Apr 8, 2008Epoxy Resin offers dimensional stability.
Mar 31, 2008Epoxy Resin resists temperatures up to 500°F.
Mar 19, 2008Polymer System cures by UV light and/or heat.
Feb 28, 2008Silicone Potting Compound assures complete fill-in.
Feb 7, 2008Potting Compound has flexible, low-viscosity formulation.
Feb 6, 2008Conductive Adhesive withstands severe conditions.
Feb 5, 2008Two-Component Epoxy Adhesive gels in 3 minutes.
Jan 11, 2008Polymer System suits high temperature bonding applications.
Nov 30, 2007Epoxy suits coating, sealing, and encapsulation applications.
Nov 8, 2007Adhesive is heat, thermal cycling, and chemicals resistant.
Oct 30, 2007Silver Conductive Epoxy Adhesive exhibits high flexibility.
Sep 7, 2007Silicone Compound has Shore A hardness of 45.
Aug 6, 2007Epoxy Resin cures at low temperature.
Other News from this company:
Dec 26, 2007 Cost Effective Anti-Static Electrically Conductive Latex Coating
Dec 25, 2006 Thermally Conductive Epoxy is Exceptionally Flexible
 
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