October 25, 2004 - Suited for fine-pitch applications, Indium3.1 exhibits beneficial wetting under air and nitrogen reflow atmosphere. Low-voiding, low-foaming product exhibits slump resistance and results in shiny and smooth solder joints. Stencil life virtually eliminates solder paste waste, and any residue is cleaned with water. Product comes in 500 g jars and 700 g cartridges.

Related categories: Materials and Material Processing

Archive Press Release
(Products mentioned in this Archive Press Release may or may not be available from the manufacturer.)

Release date: October 19, 2004

Indium Corporation Introduces Water-Soluble Pb-Free Solder Paste

To meet the high demand of water-soluble solder paste users who need to comply with the Pb-Free requirements, Indium Corporation of America has developed the next generation of Pb-Free Solder Paste, Indium3.1. Indium3.1 is a water-soluble Pb-free solder paste with exceptional printing, ideal for fine-pitch applications. The unprecedented stencil life virtually eliminates solder paste waste.

In addition, Indium3.1 exhibits excellent wetting under both air and nitrogen reflow atmosphere. Any residue is easily cleaned with water. The resultant solder joints are shiny and smooth, including those of ultra fine-pitch components.

Indium3.1 also features a wide reflow window, outstanding slump resistance, low voiding and low foaming. Standard packaging for stencil printing applications is 500g jars and 700g cartridges. In addition, Indium3.1 is backed up by Indium Corporation’s internationally experienced engineers who provide in-depth technical assistance and expert advice in solder properties.

Indium Corporation is a three-time Frost & Sullivan Award-winning supplier of electronics assembly materials, including solder pastes, solder preforms, fluxes, Pb-Free solder alloys, underfill materials, die-attach materials, and more. The company is also the world’s premiere supplier of commercial grade and high-purity indium. Factories are located in North America, Europe, and Asia. Founded in 1934, the company is ISO 9001 registered.

For more information on Indium3.1, visit Indium Corporation of America at www.indium.com or email askus@indium.com.

Contacts:

Marketing:
Rick Short Director: Corporate Communications
USA
Phone: 315-381-7554

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Company Information:
Name: Indium Corporation
Address: 34 Robinson Road
City: Clinton
State: NY
ZIP: 13323
Country: USA
Phone: 315-381-7554
http://www.indium.com

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Jul 01, 2008	Indium Corporation Receives Quality Award
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Feb 21, 2008	Indium Corporation's Chicago Materials Division Earns ISO-9001:2000 Certification
Feb 19, 2008	Indium Corporation Presents Award to Zen Voce
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Oct 30, 2007	Indium Corporation's Corporate Communications Director Earns SMTA Award
Oct 11, 2007	Indium Corporation Announces New Sales Channel for Eastern North America
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