July 29, 2004 -
AlSiC (Aluminum Silicon Carbide) enables tailored coefficient of thermal expansion (CTE), offering compatibility with various electronic devices and assemblies; isotropic CTE value is adjusted by modifying Al-metal/SiC-particulate ratio. Thermal conductivity of material prevents bowing and flexing of packaging and substrate material. Product is suited for housing, interconnection, and thermal management of microelectronic, optoelectronic, and power electronic devices.
(Archive News Story - Products mentioned in this Archive News Story may or may not be available from the manufacturer.)
CPS Introduces Revolutionary Metal Matrix Composite
High reliability and low cost for electronic thermal management and packaging solutions
CPS Corporation, the worldwide leader in the design and production of metal matrix composites, offers AlSiC (Aluminum Silicon Carbide), a metal matrix composite that provides highly reliable and cost-effective solutions for the housing, interconnection and thermal management of microelectronic, optoelectronic and power electronic devices.
Unlike traditional packaging materials, AlSiC enables a tailored coefficient of thermal expansion (CTE), offering compatibility with various electronic devices and assemblies. The isotropic CTE value of AlSiC can be adjusted for specific applications by modifying the Al-metal/SiC-particulate ratio. AlSiC's CTE matching capabilities eliminate the need for thermal interface stacking, increasing reliability in the field.
AlSiC also exhibits a high thermal conductivity that results in extremely efficient thermal dissipation. Coupled with its superior CTE matching, AlSiC's high thermal conductivity prevents the bowing and flexing of packaging and substrate material that can lead to failure. Traditional packaging materials with lower thermal dissipation can cause delamination, leading to air gaps and poor reliability.
The CPS AlSiC near and net-shape fabrication process both produces the composite material and fabricates the product geometry, resulting in a cost-effective product and allowing rapid prototyping for high volume advanced thermal management solutions. The unique casting process enables integration of very high thermal conductivity inserts (>1000 W/mK) or cooling tubes for more advanced thermal management solutions.
About CPS Corporation
CPS Corporation is the worldwide leader in the design and high-volume production of metal matrix composites. With over 30 years combined experience, CPS engineers and scientists use a net-shape fabrication process, including patented QuickSet(TM) injection molding and QuickCast(TM) infiltration. AlSiC components are utilized in applications in the wireless communications infrastructure, high-performance microprocessor, motor controller, and other microelectronic markets. CPS' customers include TI, Motorola, HP, Agilent and Amkor. For more information on CPS' AlSiC components, contact CPS at 1 (508) 222-0614 x42; e-mail marko@alsic.com, or visit www.alsic.com.
Contacts:
Public Relations:
Gray & Rice Public Relations
Jennifer Tsolas
USA
Phone: 617-367-0100 ext 103 E-mail this person Company Information: Name: CPS Technologies Corp. Address: 111 South Worcester Street City: Norton State: MA ZIP: 02766 Country: USA Phone: 508-222-0614 FAX: 508-222-0220 http://www.alsic.com
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