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Interconnect Flux is water-soluble.
Interconnect Flux is water-soluble.

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Archive News Story
(Products mentioned in this Archive News Story may or may not be available from the manufacturer.)


Interconnect Flux is water-soluble.


July 29, 2004 - Designed for use in BGA bumping and board level attachment, WS-364 water-soluble paste-flux can be applied by pin-transfer or stencil printing. It can be cleaned using room-temperature water and offers high yield in BGA bumping process. Available in syringes or cartridges, halide-free product is suitable for Sn/Pb and Pb-free applications.


Related categories:   Materials and Material Processing


Archive Press Release
(Products mentioned in this Archive Press Release may or may not be available from the manufacturer.)


Release date: July 27, 2004

Indium Corporation Introduces New Interconnect Flux

Indium Corporation has introduced a new high viscosity paste-flux, called WS-364, designed for use in BGA bumping and board level attachment. This new water-soluble flux has excellent cleanability using room temperature water.

With a wide process window, WS-364 can be applied by pin-transfer or stencil printing and offers exceptionally high yield in the BGA bumping process. Halide-free with excellent solderability, WS-364 is suitable for Sn/Pb and Pb-free applications and is available in syringes or cartridges.

Indium Corporation is a three-time Frost & Sullivan Award-winning supplier of electronics assembly materials, including solder pastes, solder preforms, fluxes, Pb-Free solder alloys, underfill materials, die-attach materials, and more. The company is also the world’s premiere supplier of commercial grade and high-purity indium. Factories are located in North America, Europe, and Asia. Founded in 1934, the company is ISO 9001 registered.

For more information on WS-364, visit Indium Corporation of America at www.indium.com or email askus@indium.com.

Contacts:

General Information:
Rick Short Director: Corporate Communications
34 Robinson Road
Clinton NY 13323
USA
Phone: 315-381-7554
Send email  E-mail this person

Company Information:
Name: Indium Corporation of America
Address: 1676 Lincoln Ave., P.O. Box 269
City: Utica
State: NY
ZIP: 13502
Country: USA
Phone: 800-4-INDIUM
FAX: 315-853-1000
http://www.ncsmq230.com



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