Archive News Story
(Products mentioned in this Archive News Story may or may not be available from the manufacturer.)
Solder Wire is comprised of high-purity materials.
July 23, 2004 - Die Attach Solder Wire is manufactured from minimum of 99.9% pure materials with controlled oxide levels to facilitate wetting. It can be made to specific process or piece of equipment using advanced processes to hold to crucial diameters and tolerances for proper volume deposits. Standard packaging is available in 30–40 m spools; however custom spooling is available.
Archive Press Release
(Products mentioned in this Archive Press Release may or may not be available from the manufacturer.)
Release date: July 21, 2004
Indium Corporation Introduces Die Attach Solder Wire
Indium Corporation’s Die Attach Solder Wire is manufactured from high purity (a minimum of 99.9% pure) materials with controlled oxide levels to enhance wetting performance. This superior product is backed up by Indium Corporation’s internationally-experienced engineers. They are knowledgeable in all facets of Material Science as it applies to the electronics and semiconductor sectors.
Indium’s Die Attach Solder Wire can be manufactured to a specific process or piece of equipment using advanced processes to hold to crucial diameters and tolerances for proper volume deposits. Standard packaging is available in 30-40 meter spools; however custom spooling is also available.
Indium Corporation is a three-time Frost & Sullivan Award-winning supplier of electronics assembly materials, including solder pastes, solder preforms, fluxes, Pb-Free solder alloys, underfill materials, die-attach materials, and more. The company is also the world’s premiere supplier of commercial grade and high-purity indium. Factories are located in North America, Europe, and Asia. Founded in 1934, the company is ISO 9001 registered.
For more information about Die Attach Solder Wire, visit Indium Corporation at www.indium.com or email AskUs@indium.com.
Contacts:
Marketing:
Indium Corporation
Rick Short Director Corporate Communications
34 Robinson Rd
Clinton NY 13323
USA
Phone: 315-381-7554 E-mail this person Company Information: Name: Indium Corporation of America Address: 1676 Lincoln Ave., P.O. Box 269 City: Utica State: NY ZIP: 13502 Country: USA Phone: 800-4-INDIUM FAX: 315-853-1000 http://www.ncsmq230.com
News provided by ThomasNet Industrial Newsroom® (TIN). TIN is a comprehensive source
of new and timely product information in the industrial marketplace. TIN supplies new product
information to the web sites, e-marketplaces and print publications that serve the
industrial marketplace. For press release submissions please go to
http://news.thomasnet.com/submitpr.html.
BY ACCESSING, BROWSING AND/OR USING THIS WEB SITE AND/OR ANY WEB SITES PROVIDED BY
ProductNews.com, YOU AGREE TO BE BOUND BY THE TERMS OF USE
AGREEMENT.
![[Get Copyright Permissions]](http://license.icopyright.net/images/icopy-w.gif){kind=small}
