3D Stencil targets multi-level printing applications.
December 7, 2010 -
Facilitating printing on different levels with upward or downward steps, VectorGuard 3D enables uniform stencil thickness to be achieved for quality print results. Electroformed nickel stencil not only prints 2 levels simultaneously, but can also accommodate levels that differ by up to 3 mm. In addition to providing coverage for dedicated areas on board, VectorGuard 3D is suitable for printing of heatsink pockets for power components or printing of 3D mounting PCBs.
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|Original Press release |
1785 Winnetka Circle
Rolling Meadows, IL, 60006
DEK Launches VectorGuard® 3D Stencils for Multi-level Printing Applications
DEK has launched a brand new addition to its popular range of VectorGuard® stencils. Known as VectorGuard 3D, the new stencil is designed for specialist applications requiring multiple level printing. Facilitating printing on different levels with upward or downward steps, VectorGuard 3D enables a uniform stencil thickness to be achieved for quality print results and a considerable process time saving.
Targeted at applications consisting of different levels on the PCB or substrate, the electroformed nickel VectorGuard 3D Stencil not only prints two levels at the same time, but can also accommodate levels that differ by up to 3mm. Previously, devices such as power transistors requiring support on multiple levels, necessitated a dispensing operation following stencil print. VectorGuard 3D eliminates the dispenser requirement, streamlining the print process to boost productivity. Ideal for a wide range of specialist applications, VectorGuard 3D meets the challenges of providing coverage for dedicated areas on the board, such as Chip On Board. Equally, the process can be used to protect bonding areas from contact with the stencil. Other applications particularly suited to VectorGuard 3D include printing of heatsink pockets for power components or printing of 3D mounting PCBs.
Commenting on DEK's newest product launch, Global Franchise & Product Manager, Michael Zahn, explains: "Previous to the launch of VectorGuard 3D, there was no stencil available for multi-level printing where the thickness was equal across the total stencil area. Other manufacturers will make thick stencils and mill down areas where they want to print, increasing stencil stress and compromising the reliability of the process. With VectorGuard 3D, we can accommodate a wide range of specialist, multi-level printing applications, while also eliminating unnecessary process steps to save manufacturers time, cost and complexity. Plus, since we are able to achieve fine-pitch printing at different levels, this process is even available for high precision applications including 0201s and µBGAs. Fast becoming industry standard, the VectorGuard range has long served diverse manufacturing requirements. And now, our customers can expect even more from VectorGuard!"
VectorGuard 3D stencils will be individually engineered to meet the specific application requirements of each customer, drawing on DEK's extensive process expertise to take account of all components to be populated in addition to other print process variables. The new DEK stencil also incorporates all the operational advantages of the reusable, recyclable VectorGuard system, including ease-of-use, system rigidity and operator safety. The system also delivers numerous space-saving storage advantages and is complemented by the VectorGuard Cabinet and VectorGuard Workstation.
DEK is a global provider of advanced materials deposition technologies and support solutions including printing equipment platforms, stencils, precision screens and mass imaging processes used across a wide range of applications in electronics pre-placement subassembly, semiconductor wafer manufacture, and alternative energy component production. For more information, visit DEK at www.dek.com.
Tel: +44 1305 760760