3D Orientation Sensor utilizes MEMS technology.
June 25, 2008 -
Surface-mount FC30 device embeds both 3D orientation functionality and click/double-click detection allowing developers to integrate mouse-button controls. Three external interrupt lines allow developers to build applications, such as automatic portrait/landscape recognition, for portable products. The 14-pin LGA ECOPACK® surface-mount package also aids compliance with green criteria, meeting EU RoHS specifications.
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|Original Press release |
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STMicroelectronics' New 3D Orientation Sensor Begins New Generation of Highly Integrated Functional Sensors Using Robust MEMS Technology
Surface-mount sensor combines 3D orientation with mouse-click detection, and provides ease of integration, saves power, boosts reliability and reduces system complexity
Geneva, June 11, 2008 - STMicroelectronics (NYSE: STM), a world leader in MEMS products, has announced a new 3D orientation sensor, the company's initial offering in a significant new family of MEMS functional sensors that consolidates multiple conventional sensor functions in an easy-to-use surface-mount package. The new FC30 device embeds both 3D orientation functionality and click/double-click detection allowing developers to integrate mouse-button controls.
"The FC30 is the first product in a new family of functional sensors, a turn-key solution that allows our customers to simplify system complexity and reduce the processing overhead on the system microcontroller," said Benedetto Vigna, General Manager of ST's MEMS And Healthcare, RF and Sensor Division.
The FC30 is a 14-pin LGA device measuring 3 x 5 x 0.9mm, imposing a small footprint and low integration effort with no extra programming required. The device's three external interrupt lines allow developers to quickly build applications, such as automatic portrait/landscape recognition for portable products.
With very low current draw in normal operation, as well as an external Power-down control, the FC30 can be used in systems such as battery-operated devices or consumer products. The 14-pin LGA ECOPACK® surface-mount package also aids compliance with green criteria, meeting the EU RoHS specifications.
Further advantages include freedom from mechanical friction, which reduces wear to enable long-lasting, error-free operation.
Samples are available immediately. High-volume production quantities will be available in Q3 2008 at prices in the $1.00 range.
STMicroelectronics is a global leader in developing and delivering semiconductor solutions across the spectrum of microelectronics applications. An unrivalled combination of silicon and system expertise, manufacturing strength, Intellectual Property (IP) portfolio and strategic partners positions the Company at the forefront of System-on-Chip (SoC) technology and its products play a key role in enabling today's convergence markets. The Company's shares are traded on the New York Stock Exchange, on Euronext Paris and on the Milan Stock Exchange. In 2007, the Company's net revenues were $10 billion. Further information on ST can be found at www.st.com.
Documentation: the datasheet is online at
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