3D AOI System provides measurement-based inspection.
September 22, 2010 -
Zenith 3D AOI System measures Z-axis profilometry of whole PCB assemblies, including components, leads, and solder joints, based on multi-frequency Moiré technology. Without any ambiguity, Automated Optical Inspection (AOI) system lets user confirm products meet IPC standards. Z-axis measurement and 8-way light projection provide true profilometry, eliminating false calls and escapes. Functionality also identifies and flags all defects, and PCB warpage compensation is included as well.
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Original Press release
Koh Young Technology
14F ACE Techno X, 470-5 Gasan-dong,
Seoul, ,
Korea (north)
Zenith 3D AOI System Provides Measurement-based Inspection
Seoul, Korea - Koh Young Technologies' revolutionary new Zenith 3D AOI System measures the Z-axis profilometry of whole PCB assemblies, including components, leads, and solder joints, based on the patented multi-frequency Moiré technology. Zenith is the only AOI system available that's measurement-based, and gives the user the ability to confirm - without any ambiguity - that their products meet IPC acceptability standards, i.e., IPC-A-610. Zenith's eight-way light projection and z-axis measurement provide true profilometry, eliminating false calls and escapes. Zenith identifies and flags all defects, and even features enhanced PCB warpage compensation.
Measurement-based inspection means that no 'golden board' is needed; results are compared directly to the IPC-A-610 Reference. Zenith's EasyUse Operator interface with Touch Screen, coupled with a short programming time (no fine tuning needed) enhance the system's user-friendliness and power.
"The inability to measure the height of objects makes detection of defects such as lifted leads and components difficult in traditional 2D AOI" Dr. Kwangill Koh, President and CEO, states.
"True 3D AOI provides the ability to measure the height and shape of components and even shiny solder joints, and allows a true comparison with the IPC-A-610 standard for inspection. Thus, there is no longer any ambiguity regarding the acceptability of the solder joint."
About Koh Young Technology
Koh Young Technology, a leading provider of Solder Paste Inspection (SPI) and Automated Optical Inspection (AOI) systems, specializes in the design and manufacturing of 3D measurement and inspection equipment for the global circuit board assembly and semiconductor markets. Direct sales and support centers are located in the United States, Europe, Japan, Singapore, China (Shenzhen) and Korea. For more information about the company, visit www.kohyoung.com, E-mail: info@kohyoung.com.
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