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Backplanes and System Platform utilize ATCA standard.
Backplanes and System Platform utilize ATCA standard.

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Backplanes and System Platform utilize ATCA standard.


July 1, 2003 - Backplanes employ differential ERmet ZD connectors and AdvancedTCA (ATCA) standard, which specifies telecom architecture for various applications. Connection structure supports switched fabric architectures, while integrated redundancy of fabrics, IPMBs, and power supply ensures high availability. Designed with dual star fabric topology, products incorporate 2 dedicated fabric slots and additional dual star base interface.

(Archive News Story - Products mentioned in this Archive News Story may or may not be available from the manufacturer.)

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 See more related product stories:
Backplanes are available based on PSB PICMG 2.16.
Front Panels are designed to IEEE specifications.
Compact Backplane is compliant with PICMG 3.0 specification.
Enclosure/Display maintains drive-thru reliability.
Enclosures protect digital signage displays.
Storage Backplanes feature multiple removable drive trays.
Sloping-Front Enclosures allow face-to-face electronics.
MicroTCA System supports up to 12 AdvancedMC modules.
Vented Indoor Enclosure protects heat-sensitive controls.
Development System is available with 7-slot 6U VPX backplane.
Electronic Enclosure is for MicroTCA applications.
Ergonomic Electronic Enclosure accepts 2-4 AAA batteries.
Backplanes feature conduction-cooled design.
Polycarbonate Enclosures offer chemical resistance.
Wall-Mount Enclosures protect electrical equipment.
Conduction-Cooled VPX Enclosure has no-tool board changes.
Enclosure integrates EMC contacts.
VXS Backplane fits into 4U high horizontal mount enclosures.
PCIe Expansion Backplane has MicroATX form factor.
ATCA Backplane features standard MicroTCA connectors.


ERNI Introduces Advanced TCA Backplanes & Integrated System Platform


MORAGA, California - June 26, 2003 - ERNI has expanded its backplane portfolio with the introduction of backplanes for the new AdvancedTCA (ATCA) standard. High-performance differential ERmet ZD connectors are at the core of the new ATCA backplanes, allowing them to meet the ever-increasing demands of high broadband serial communication. A complete system platform based on the new backplanes was also unveiled. The AdvancedTCA standard specifies the new telecom architecture for such applications as mobile telephony base stations, telecom switches, crossbar distributors and platforms in data centres.

The backplanes' connection structure supports various state-of-the-art switched fabric architectures such as PCI Express, Infiniband and XAUI. The integrated redundancy of fabrics, IPMBs (intelligent platform management bus) and power supply ensures high availability. The backplanes are designed with dual star fabric topology, incorporating two dedicated fabric slots and an additional dual star base interface. In addition to the two fabric slots (hub slots), the available ATCA backplanes provide 12 and 14 node slots respectively. The dimensions are 426.42 mm (and 487.38 mm for the 16-slot version) x 205.95 mm x 4.3 mm.

The system platforms are supplied with two shelf management controllers (ShMCs). A version without shelf management controllers is available to accommodate ShMCs provided through slot cards. The platform is equipped with a fan rack, each one with three powerful diagonal fans that are controlled via the ShMCs. The power supply takes the form of four high-current terminal studs. The use of a 14 or 16-slot backplane governs the dimensions. The 14-slot shelf can be installed in a 19-inch rack, while the 16-slot shelf requires a 23-inch rack frame or an ETSI-600-mm rack. The height (12 U) and depth (383.14 mm) are identical in both cases.

Key Performance Features

- 18-layer PCB with dual-star topology

- Excellent current distribution

- Screwed connections for the power supply on copper rails

- Two optional RJ-45 connectors for controller-independent access to the base interface

- Updated channel interface and cost-effective production by using FR4 materials

About ERNI

ERNI is a global manufacturer of interconnects. ERNI was the first company to manufacture DIN connectors and today is the leading supplier of 2mm HM connectors and HM-ZD high-speed connectors. Recently introduced products include integrated Modular RJ-45 jacks for gigabit Ethernet, remote power and a new 10 Gb/s MicroSpeed(TM) family of SMT mezzanine connectors. ERNI offers world-class backplane assembly and optical backplane solutions. The ERNI group of interconnect companies is headquartered in Adelberg, Germany and has sales and manufacturing operations and subsidiaries throughout Europe, North America and Asia. For further information please visit http://www.erni.com.

Company Contact -- North America:

ERNI Electronics
Kevin Jones
12701 Kingston Avenue
Chester, VA 23836 USA
Phone +1 804-530-4454
Fax +1 804-530-5232
E-mail: KJones@erni.us

Agency Contact -- USA & Asia Pacific:

TechWire International
Leo Pot
Phone: +1 831-429-6288
Email: information@ezwire.com

Company Contact -- Europe:

ERNI Elektroapparate GmbH
Stefan Seiz
Seestrasse 9
73099 Adelberg
Germany
Tel.: +49 (0) 7166 50-329
Fax: +49 (0) 7166 50-55329
Email : info@erni.de

Agency Contact -- Europe:

MEXPERTS AG
Rolf Bach
Tel.: + 49-(0) 89 897361/14
Email : rolf.bach@mexperts.de

Company Contact -- Asia/Pacific:

ERNI Asia Holding Pte Ltd
Simon Cheng
Tel.: +65 6 555 5885
Fax +65 6 555 5995
Email : scheong@erni-asia.com


Contacts:

Public Relations:
TechWire International
Leo Pot
USA
Phone: 831-429-6288
Send email  E-mail this person

General Information:
Kevin Jones
USA
Phone: 804-530-4454
FAX: 804-530-5232
Send email  E-mail this person

Company Information:
Name: ERNI Electronics, Inc.
Address: 3005 E. Boundary Terrace
City: Midlothian
State: VA
ZIP: 23112
Country: USA
Phone: 800-228-4100
FAX: 804-228-4099
http://www.erni.com


More New Product News from this company:
I/O Modules support decentralized installations.
SMT PCB Connector enables data rates up to 10 Gbit/sec.
Right Angled D-Sub Connectors feature press-fit termination.
Subminiature Connectors come in antistatic versions.
Right-angled Card Edge Connectors meet PCIe requirements.
SMC Board-to-Board Adapter features 1.27 mm pitch.
Right Angle DIN Connectors require minimal press-in force.
Connectors deliver current carrying capacity to 18 A.
Connector permanently links PCB to IDC flat cable.
SMT Connectors enable board-to-board spacing of 3 mm.

Other News from this company:
ERNI Electronics Presents 'Connector Application Wizard'
ERNI Electronics Expands Family of M8/M12 Products
System Technology With A Focus On SMT Production
ERNI Electronics Now Offers Complete ERmet ZD Portfolio
ERNI Electronics Expands Family of M8/M12 Products
Latest Asia Pacific Bishop Survey Places ERNI Electronics in Top Position
ERNI Renamed ERNI Electronics
ERNI Presents "New Products 2007"
ERNI Achieves Top Position In Europe
ERNI Opens West Coast Office



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