Electronic Packaging Material is thermally conductive.

NuSil Technology    Carpinteria, CA 93013
Aug 23, 2012 With nominal thermal conductivity of 1 W/mk, EPM1-2493 silicone thermal interface material offers bond lines as thin as 5 microns and is suited for use in electronic applications. This pourable, conformal liquid, with 1:1 mix ratio, can be used to adhere materials with differing coefficients of thermal expansion (CTE), reducing stress during thermal cycling. Adhesive strength can be improved via use of primer, achieving average lap shear values of 120 psi.

High-Purity Gels exhibit minimal moisture permeability.

NuSil Technology    Carpinteria, CA 93013
Jun 10, 2009 Available with refractive index of 1.54 and viscosities from 3,500-8,000 cP, LS-3354, LS2-3354, and LS3-3354 are designed for potting, encapsulating, backfilling, and dampening applications requiring soft gel with optical clarity. Cure can be achieved at ambient temperatures with humidity or accelerated with heat, and gels can be removed for rework if needed. Available in 1:1 mix ratio, products are suited for protecting electronic components from dust, debris, and moisture.

Silicone Gel offers refractive index of 1.40.

NuSil Technology    Carpinteria, CA 93013
Jun 04, 2009 Providing protection from mechanical shock, optically clear LS-3140 is suited for use as encapsulating, embedding, or potting compound for environmental protection of electronic assemblies. Low outgassing gel handles stress during thermal cycling without cracking or delamination. To meet multitude of processing requirements, LS-3140 cures at room temperature, or cure can be accelerated with heat. It is best suited for applications requiring operating temperature of -94 to 392°F.

Aerospace Material suits solvent-resistant applications.

NuSil Technology    Carpinteria, CA 93013
Sep 30, 2008 Fluorosilicone high consistency rubber (HCR), FS-3780, is designed to endure harsh environments where finished parts are exposed to fuels and extreme temperature conditions. Delivered as uncatalyzed HCR, it requires addition of platinum- or peroxide-base catalyst to cure with heat. It can be used for transfer or compression molded parts - gaskets, stoppers, seals - and can also be extruded or calendared depending on processing requirements.

Dielectric Gels suit electronic packaging applications.

NuSil Technology    Carpinteria, CA 93013
Feb 27, 2007 Low-outgassing EPM-2480, EPM-2481, and EPM-2482 are designed for encapsulation of chip packages in devices where outgassing-related contamination would be problematic. Able to cure into soft, compliant silicone, products help reduce stress on electronic assemblies during temperature cycling while protecting against environmental factors and shock. Types EPM-2480 and EPM-2481 are based on dimethyl silicone systems, while EPM-2482 is based on diphenyl dimethyl silicone system.

Silicone Material suits electronic packaging applications.

NuSil Technology    Carpinteria, CA 93013
Nov 14, 2006 Low outgassing, one-part material EPM-2411-2 glop-top is designed for encapsulation of chip packages in devices where outgassing-related contamination poses problem. Product exhibits low stress and wide operating temperature ranges characteristically associated with silicone-based materials. It is stored and shipped frozen in 3 and 30 cc syringes as well as 3 and 6 oz tubes.

Thermal Interface Material has low-viscosity formulation.

NuSil Technology    Carpinteria, CA 93013
Aug 02, 2006 Developed to address contamination issues in dense electronic systems, EPM-2493 electronic packaging material (EPM) meets requirements of high-temperature and high-stress operating conditions in electronic packaging. This low-outgassing material is designed to work in environments with drastic temperature cycling that would otherwise result in encapsulant embrittling or outgassing.

Two-Part Silicone Compound suits electronic applications.

NuSil Technology    Carpinteria, CA 93013
Mar 12, 2003 Able to maintain electrical conductivity from -178 to +445°F, R-2634 electrically conductive, room-temperature vulcanized (RTV) paste achieves full cure at 77°F in 7 days. With heat-accelerated cure time of 30 min, R-2940 thermally conductive, RTV paste performs over -85 to +465°F temperature range. Operating over -178 to +465°F temperature range, CFI-6755 optically clear, RTV liquid elastomer achieves full cure (heat-accelerated) in 10 min.