Hub Dicing Blades suit chip scale package applications.

Kulicke & Soffa Industries, Inc.    Willow Grove, PA 19090
Sep 17, 2008 UniPlus blades are optimized for cut quality, blade life longevity, and productivity in various chip scale package (CSP) applications. Each blade is designed for specific package singulation application, including ceramic, BGA substrates, and QFN leadframes. Hard nickel bond permits optimized feed rates, and flexibility lets users tailor approach based on individual process and project requirements.

Wire Bonders include programmable power supply system.

Kulicke & Soffa Industries, Inc.    Willow Grove, PA 19090
Mar 25, 2008 With ±2.0 µm accuracy for sub 35 µm ultra fine pitch requirements, IConnPS High Performance Wire Bonder features Auto BITS, programmable focus optics for complex stacked die packages, and advanced looping processes. Featuring ±3.0 µm accuracy, ConnXPS High Speed Wire Bonder offers look ahead vision algorithms to align/bond simultaneously and programmable red/blue illumination. Available with 80 mm bondable area, both have motion control system and dual frequency transducer.

Copper Wire exhibits properties that facilitate IC bonding.

Kulicke & Soffa Industries, Inc.    Willow Grove, PA 19090
May 21, 2007 MaxSoft(TM) copper bonding wire, engineered for various discrete and IC applications, offers physical properties that help reduce IC bond pad stress and promote second bond strengths - even in fine-pitch applications. Available in diameters from 0.8-1.3 mil, wire has 6 month shelf life when stored in recommended conditions inside original packaging.

Gold Wire suits high-density packaging applications.

Kulicke & Soffa Industries, Inc.    Willow Grove, PA 19090
May 21, 2007 Designed for stacked-die and multi-tier applications, Formax(TM) bonding wire offers consistent loop profiles and promotes linearity and stability. It is capable of loop heights of less than 3 mil to over 16 mil, with wire span up to 320 mil using 1 mil dia wire. Intermetallic stability is based on proprietary 3N gold composition.

Capillary is suited for fine pitch wire bonding.

Kulicke & Soffa Industries, Inc.    Willow Grove, PA 19090
Dec 22, 2006 Available in range of wire diameters to address different wire bonding challenges, CuPRAplus(TM) Copper Capillary can handle copper wire from 0.8 mil to 3.0 thicknesses. Product works together with iCu copper wire and bonder kit, and ensures both 1st and 2nd bond quality for stable mass production.

Capillary suits demanding packaging applications.

Kulicke & Soffa Industries, Inc.    Willow Grove, PA 19090
Jul 18, 2005 Arcus(TM) capillary provides accurate looping in stacked die, quad-tier, and other complex, tight tolerance devices. It also minimizes defects in wire bonding process, such as wire kinks, wire sag, wire sweep, and wire leaning.

Stud Bumper targets flip chip market.

Kulicke & Soffa Industries, Inc.    Willow Grove, PA 19090
Mar 31, 2005 Using hardware and software technology, ATPremier Stud Bumping Machine bonds 36 standard bumps/sec at 60 µm pitch. Since stud bumping does not require under bump metallurgy, bonding can be performed in single step. Wafer-Mapping interface bonds only known good die.

Stud Bumper handles 12 in. wafers in one pass.

Kulicke & Soffa Industries, Inc.    Willow Grove, PA 19090
May 07, 2004 WaferPRO plus single-pass stud bumper bonds 22 bumps/sec, depending on bump type, size, and pitch. It offers +5 µm positional accuracy at 3 sigma and can bump down to 65 µm. Various manual chucks and fully automatic wafer handling options are available. WaferPRO plus kit, which includes hardware, specialized servo code, and motion profiles, provides upgrade path for existing WaferPRO users.

Capillary suits copper wire bonding applications.

Kulicke & Soffa Industries, Inc.    Willow Grove, PA 19090
Apr 22, 2004 CuPRA™ handles copper wire from 0.8–3.0 mil thick. It offers bonding performance comparable to gold bonds on various pad materials. Unit is suited for wide range of applications from fine pitch wire bonding of over 500 I/Os to low pin count devices found in power and automotive applications.

IC Ball Bonder offers 35 µm fine pitch capability.

Kulicke & Soffa Industries, Inc.    Willow Grove, PA 19090
Jan 13, 2004 MaxµmplusT Ultra High Speed Ball Bonder incorporates 2.20 x 2.60 in. bonding area, S-Scan imaging technology, µT-Sonicsâ„¢ transducer, and Precision-Arcâ„¢ EFO system. Servo control system for X-Y Table reduces wire cycle times to 63.0 msecs, and Precision-touchT bondhead technology delivers optimum bond force control. Teaching and calibration software delivers bond placement accuracy to 2.5 µm, and wire feed path handles wire diameters down to 15 µm.