Defect Inspection System monitors defects at optical speed.

KLA-Tencor Corp.    San Jose, CA 95134
May 07, 2013 Available for 2900 Series of defect inspection systems, NanoPoint™ focuses resources of optical inspection system on critical patterns, as identified by circuit designers or by known defect sites. During chip development, NanoPoint can reveal need for mask re-design within hours, potentially accelerating identification and resolution of design issues from months to days. During volume production, NanoPoint can selectively track defectivity within critical patterns.

Wafer Inspection Tool targets LED and adjacent markets.

KLA-Tencor Corp.    San Jose, CA 95134
Dec 11, 2012 Designed for defect inspection and 2D metrology for LED applications, ICOS WI-2280 supports MEMS and semiconductor wafers spanning 2–8 in. in size. System features rule-based binning defect classification and recipe qualification engine, enabling manufacturers to optimize process control and process tool monitoring strategies. To accommodate multiple media with minimal changeover time, ICOS WI-2280 supports handling of whole wafers in carriers and diced wafers in hoop ring or film frame carriers.

Reticle Inspection Systems cover nodes to 20 nm and beyond.

KLA-Tencor Corp.    San Jose, CA 95134
Sep 10, 2012 IC fab-based inspection systems X5.2(TM) and Teron(TM) 611 comprise Total ReQual(TM) solution for monitoring defectivity and pattern degradation resulting from cleaning or exposure. While sensitivity of Teron 611 is optimized for 20 nm node and beyond, X5.2 works on full mask sets at 28 nm and larger design nodes as well as 20 nm node. Both systems offer fifth-generation STARlight® inspection mode for full area coverage on multi- and single-die reticles.

Overlay Metrology System supports multi-patterning techniques.

KLA-Tencor Corp.    San Jose, CA 95134
Sep 10, 2012 Designed to address complex overlay challenges associated with single- and multi-patterning lithography techniques at advanced sub-28 nm design nodes, Archer(TM) 500 accurately measures and characterizes overlay error. Measurement speed and precision enable thorough overlay characterization on wafers after patterning to help verify that pattern features have been correctly aligned to previously-patterned features, located on either same layer or prior process layer.

Wafer Inspection System detects defects on all surfaces.

KLA-Tencor Corp.    San Jose, CA 95134
May 02, 2012 Designed for operation in lithography and outgoing quality control, modular CIRCL(TM) Suite monitors front side, back side, and edge of wafer for defects and, in parallel, measures wafer edge profile, edge bead concentricity, and macro overlay error. Data collection is governed by DirectedSampling(TM), which uses results from one measurement to trigger other types of measurements within cluster as needed. Automated optical defect review and classification helps engineers quickly identify defect source.

Wafer Defect Review System is designed for 20 nm node.

KLA-Tencor Corp.    San Jose, CA 95134
Aug 19, 2011 Suitable for chip manufacturing at 20 nm device nodes and below, eDR(TM)-7000 electron-beam (e-beam) wafer defect review system addresses defect imaging and classification challenges at leading edge or located at bottom of deep trench/hole. System can drive directly to site of defect at high resolution, enabling review of multiple defects per second. Features include stage and vibration-isolation system as well as reticle defect review and voltage-contrast imaging modes.

Wafer Inspection System incorporates deep UV illumination.

KLA-Tencor Corp.    San Jose, CA 95134
Jul 19, 2011 Leveraging DUV wavelength, special apertures, and multiple illumination and collection channels, Surfscan SP3 addresses stringent 28 nm node requirements for defect detection and classification on blanket films at production speeds. System helps manufacture substrates for 28 nm devices and below that are nearly atomically smooth and free from polish marks, crystalline pits, terracing, voids, or other defects that disrupt electrical integrity of transistor.

Defect Analysis System is suited for PV cell manufacturers.

KLA-Tencor Corp.    San Jose, CA 95134
Jun 13, 2011 FabVision(TM) Solar utilizes ICOS® PVI-6 data through range of analysis and monitoring features, captures wafer/cell images and data from PVI-6, and allows navigation that simplifies image review. Users can review in-line data at any point, and reports are generated automatically with optical inspection measurement results from multiple inspection modules across multiple manufacturing lines. Rules can be configured and set by proximity, defect type, and frequency of occurrence.

Packaged IC Component Inspector features dual taper output.

KLA-Tencor Corp.    San Jose, CA 95134
Mar 22, 2011 ICOS® CI-T620 is automated optical inspector of IC packages that enables 3D measurements and is compatible with tape and reel packing. Offering 3D metrology inspection down to 5 µm, unit can also capture surface defects down to 40 µm and allows for package changeover in less than 5 min. Product is compatible with package sizes from 3 x 3 mm to 42.5 x 42.5 mm.

Wafer Inspection System aids high brightness LED manufacturing.

KLA-Tencor Corp.    San Jose, CA 95134
Jan 26, 2011 Providing automated sub-micron defect inspection for LED materials such as gallium nitride, sapphire, and silicon carbide, Candela® 8620 enables optimized quality control of both opaque and transparent substrates as well as maximum MOCVD reactor uptime and yield. Imaging and detection system optimizes signal from relevant defects-of-interest while suppressing background noise. Aided by multi-channel detection optics, system additionally allows high-purity classification of defects.