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KLA-Tencor Corp.
160 Rio Robles
San Jose, CA, 95134

Detailed Contact Information:
Reticle Inspection System monitors sub-20 nm design nodes.   Return to story
Company Information:
KLA-Tencor Corp.
160 Rio Robles
San Jose , CA  95134   USA
Phone: 408-875-3000
FAX: 408-875-4266
http://www.kla-tencor.com
Marketing:
Meggan Powers Sr. Director, Corporate Communications
USA
Phone: 408-875-8733
Send email  E-mail this person
 
 
Latest New Product News from KLA-Tencor Corp.
Products or services this company supplies:
 
Click links to find other companies which supply the same products or services.
Reticle Inspection System monitors sub-20 nm design nodes.

Reticle Inspection System monitors sub-20 nm design nodes.

KLA-Tencor Corp.    San Jose, CA 95134
Jun 02, 2014 With 193 nm illumination, Teron™ SL650 assesses incoming reticle quality, monitors degradation, and detects yield-critical reticle defects, such as haze growth or contamination. System supports mix of reticle types by using STARlightSD™ and STARlightMD™ to produce defect capture and comprehensive inspection coverage on single- and multi-die reticles, respectively. Chipmakers can also use STARlightMaps™ technology to identify CD, film thickness, anti-reflective coating, and other variations.

Defect Inspection System monitors defects at optical speed.

KLA-Tencor Corp.    San Jose, CA 95134
May 07, 2013 Available for 2900 Series of defect inspection systems, NanoPoint™ focuses resources of optical inspection system on critical patterns, as identified by circuit designers or by known defect sites. During chip development, NanoPoint can reveal need for mask re-design within hours, potentially accelerating identification and resolution of design issues from months to days. During volume production, NanoPoint can selectively track defectivity within critical patterns.

Wafer Inspection Tool targets LED and adjacent markets.

KLA-Tencor Corp.    San Jose, CA 95134
Dec 11, 2012 Designed for defect inspection and 2D metrology for LED applications, ICOS WI-2280 supports MEMS and semiconductor wafers spanning 2–8 in. in size. System features rule-based binning defect classification and recipe qualification engine, enabling manufacturers to optimize process control and process tool monitoring strategies. To accommodate multiple media with minimal changeover time, ICOS WI-2280 supports handling of whole wafers in carriers and diced wafers in hoop ring or film frame carriers.
Reticle Inspection Systems cover nodes to 20 nm and beyond.

Reticle Inspection Systems cover nodes to 20 nm and beyond.

KLA-Tencor Corp.    San Jose, CA 95134
Sep 10, 2012 IC fab-based inspection systems X5.2(TM) and Teron(TM) 611 comprise Total ReQual(TM) solution for monitoring defectivity and pattern degradation resulting from cleaning or exposure. While sensitivity of Teron 611 is optimized for 20 nm node and beyond, X5.2 works on full mask sets at 28 nm and larger design nodes as well as 20 nm node. Both systems offer fifth-generation STARlight® inspection mode for full area coverage on multi- and single-die reticles.
Overlay Metrology System supports multi-patterning techniques.

Overlay Metrology System supports multi-patterning techniques.

KLA-Tencor Corp.    San Jose, CA 95134
Sep 10, 2012 Designed to address complex overlay challenges associated with single- and multi-patterning lithography techniques at advanced sub-28 nm design nodes, Archer(TM) 500 accurately measures and characterizes overlay error. Measurement speed and precision enable thorough overlay characterization on wafers after patterning to help verify that pattern features have been correctly aligned to previously-patterned features, located on either same layer or prior process layer.
Wafer Inspection System detects defects on all surfaces.

Wafer Inspection System detects defects on all surfaces.

KLA-Tencor Corp.    San Jose, CA 95134
May 02, 2012 Designed for operation in lithography and outgoing quality control, modular CIRCL(TM) Suite monitors front side, back side, and edge of wafer for defects and, in parallel, measures wafer edge profile, edge bead concentricity, and macro overlay error. Data collection is governed by DirectedSampling(TM), which uses results from one measurement to trigger other types of measurements within cluster as needed. Automated optical defect review and classification helps engineers quickly identify defect source.

Wafer Defect Review System is designed for 20 nm node.

KLA-Tencor Corp.    San Jose, CA 95134
Aug 19, 2011 Suitable for chip manufacturing at 20 nm device nodes and below, eDR(TM)-7000 electron-beam (e-beam) wafer defect review system addresses defect imaging and classification challenges at leading edge or located at bottom of deep trench/hole. System can drive directly to site of defect at high resolution, enabling review of multiple defects per second. Features include stage and vibration-isolation system as well as reticle defect review and voltage-contrast imaging modes.
Wafer Inspection System incorporates deep UV illumination.

Wafer Inspection System incorporates deep UV illumination.

KLA-Tencor Corp.    San Jose, CA 95134
Jul 19, 2011 Leveraging DUV wavelength, special apertures, and multiple illumination and collection channels, Surfscan SP3 addresses stringent 28 nm node requirements for defect detection and classification on blanket films at production speeds. System helps manufacture substrates for 28 nm devices and below that are nearly atomically smooth and free from polish marks, crystalline pits, terracing, voids, or other defects that disrupt electrical integrity of transistor.

Defect Analysis System is suited for PV cell manufacturers.

KLA-Tencor Corp.    San Jose, CA 95134
Jun 13, 2011 FabVision(TM) Solar utilizes ICOS® PVI-6 data through range of analysis and monitoring features, captures wafer/cell images and data from PVI-6, and allows navigation that simplifies image review. Users can review in-line data at any point, and reports are generated automatically with optical inspection measurement results from multiple inspection modules across multiple manufacturing lines. Rules can be configured and set by proximity, defect type, and frequency of occurrence.

Packaged IC Component Inspector features dual taper output.

KLA-Tencor Corp.    San Jose, CA 95134
Mar 22, 2011 ICOS® CI-T620 is automated optical inspector of IC packages that enables 3D measurements and is compatible with tape and reel packing. Offering 3D metrology inspection down to 5 µm, unit can also capture surface defects down to 40 µm and allows for package changeover in less than 5 min. Product is compatible with package sizes from 3 x 3 mm to 42.5 x 42.5 mm.


Click below for more Product News from KLA-Tencor Corp.

Next News Stories



Other Company News From KLA-Tencor Corp.

Aug 26, 2014

KLA-Tencor Introduces Key Systems for 5D(TM) Patterning Control Solution


Jul 07, 2014

KLA-Tencor Introduces Inspection and Review Portfolio for Leading IC Technologies


Jul 08, 2013

KLA-Tencor Announces New Additions to Its Defect Inspection and Review Portfolio


Feb 25, 2013

KLA-Tencor Announces Two Additions to Litho/Etch Process Control Portfolio


Jul 09, 2012

KLA-Tencor Announces Installation of First 450mm-Capable Surfscan® SP3 Systems


Jan 19, 2012

KLA-Tencor Announces New Flagship Wafer Inspection Solution Suite to Support Advanced Design-Rule Chip Manufacturing: 2900 Series, Puma 9650 Series, eS800 Series


Jun 07, 2011

KLA-Tencor(TM) Announces First Shipment of LMS IPRO5 Next-Generation Reticle Metrology System


Mar 28, 2011

KLA-Tencor(TM) and TEL Announce New SpectraShape(TM) Dimensional Metrology Systems With AcuShape(TM)2 Next-Generation Modeling Capability


Feb 03, 2011

KLA-Tencor(TM) Announces Live Webcast Participation at Upcoming Investor Conferences


Dec 01, 2010

KLA-Tencor Announces Live Webcast of Investor Presentation at the Barclays Capital 2010 Global Technology Conference


Aug 30, 2010

KLA-Tencor Announces Live Webcast of Investor Presentation at the 2010 Citi Global Technology Conference


Nov 09, 2005

KLA-Tencor Enables Production Monitoring for High-Brightness LED Market with New Automated Wafer Inspection System






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