Interchangeable Stencil offers consistent tension over time.

DEK    Rolling Meadows, IL 60006
May 06, 2013 In addition to optimized solder paste deposition and definition, VectorGuard™ High Tension features foil tension of 33 N/cm², transferred evenly on all 4 sides. Product has no glue bonds to fail and offers frame flatness for process control and repeatability of position from foil to foil of same product, minimizing time to switch stencil. Long-term integrity of stencil ensures no tension degradation over time.

Closed Loop Process Control proactively prevents PCB defects.

DEK    Rolling Meadows, IL 60006
Feb 22, 2012 Enabling real-time continuous alignment adjustments and cleaning frequency adaptation, ProDEK optimizes throughput and yield while limiting operator intervention. From paste offset data feeds delivered to printer by SPI system, ProDEK monitors configurable quantity of PCBs, sending corrected forward/reverse offset to printer, which then adjusts paste on pad alignment in real-time. ProDEK also monitors high area warning counts, which may indicate excessive or insufficient understencil cleaning.

PV Metallization Platform delivers print speeds to 600 mm/sec.

DEK    Rolling Meadows, IL 60006
Jan 19, 2011 Incorporating six-sigma repeatability and parallel print head processing options that maximize uptime, Eclipse photovoltaic (PV) metallization platform offers integrated vision inspection and master controls. Retrofittable modules enable manufacturers to scale production to 1,200, 2,400, or 3,600 wafers per hour (wph). Performance can be upgraded in field; spacer process modules can be deployed at initial installation then exchanged for additional print capacity.

3D Stencil targets multi-level printing applications.

DEK    Rolling Meadows, IL 60006
Dec 07, 2010 Facilitating printing on different levels with upward or downward steps, VectorGuard 3D enables uniform stencil thickness to be achieved for quality print results. Electroformed nickel stencil not only prints 2 levels simultaneously, but can also accommodate levels that differ by up to 3 mm. In addition to providing coverage for dedicated areas on board, VectorGuard 3D is suitable for printing of heatsink pockets for power components or printing of 3D mounting PCBs.

Stencil Coating Wipe renders stencil surface fluxophobic.

DEK    Rolling Meadows, IL 60006
Nov 17, 2010 Forming chemical bond with stencil surface, DEK Nano-ProTek minimizes ability of flux to stick to aperture and bottom side of stencil, enabling stainless steel or nickel stencils to be easily cleaned for optimal results. Wipe optimizes both capacity of understencil cleaner and gasketing of stencil to PCB. It can be applied to new and existing stencils at room temperature and may be re-applied as required.

Stencil Printing System optimizes paste transfer efficiency.

DEK    Rolling Meadows, IL 60006
Oct 06, 2010 ProActiv enables printing of standard and next generation components using conventional printing process with single thickness stencil. System includes control subsystem and set of squeegees with embedded electronics. When activated, unit energizes paste that is in contact with or in proximity to squeegee blade, optimizing packing density of solder particles into apertures and enhancing bond between particles. Cleaning frequency and need to change stencil and squeegee blades are minimized.

Screen Print Platform optimizes changeover time, performance.

DEK    Rolling Meadows, IL 60006
Sep 17, 2010 Offering accelerated changeover, 6-Sigma performance, and alignment capability of 2.0 Cpk @ ±12.5 microns, Horizon 03iX comes with cover package that enhances usability and operator management by enabling quick access from front and rear of system. Variety of productivity tools are included: HawkEye 1700 post-print verification, Cyclone understencil cleaning, and Stinger printer adaptable dispensing. All are controlled via Instinctiv V9 software.

PV Metallization System operates up to 600 mm/sec.

DEK    Rolling Meadows, IL 60006
Sep 09, 2010 Featuring multiple print heads operating in parallel, Eclipse offers modular design that enables manufacturers to scale production up or down to 1,200, 2,400, or 3,600 wph. If manufacturers foresee production ramp, line can be designed accordingly by inserting blank process modules equipped with conveyor belts where future production volumes will be added. Primary process modules incorporate master controls, so that subsequent, field-retrofittable modules operate as secondary slaves.

Enclosed Head Print System uses performance-optimized technology.

DEK    Rolling Meadows, IL 60006
May 04, 2010 Able to accommodate all solder pastes to meet flexibility requirements of demanding production environments, ProFlow® ATx combines low-volume print chamber with paste loading mechanism to promote consistent process control and performance. Within print chamber, conditioning grid actively conditions solder paste materials, and system subsequently delivers paste roll for precise aperture filling. Direct, automatic loading from industry-standard packaging minimizes manual intervention.

Double Layer Stencil combines filling, inner-layer stages.

DEK    Rolling Meadows, IL 60006
Jan 14, 2010 Suited for semiconductor applications and component manufacture, VectorGuard® Double Layer Platinum stencil is fabricated through 2-step lithography and Nickel electroforming process before mounted on VectorGuard tensioning technology. Mesh layer holds stencil intact while controlling flow of paste to second layer, and circuit layer determines thickness and shape of print deposits to deliver high-tolerance, fine-dimension printing with accuracy better than 0.1 µm/mm.