Adhesive is formulated for strength and flexibility.

Tra-Con, Inc.    Bedford, MA 01730
Sep 01, 2006 Epoxy-casting compound, TRA-CAST 316C01, is low-viscosity material that exhibits minimal residual stress and near-zero shrinkage. Able to bond to ceramics, glass, plastics, and metals, product offers self-sealing properties that make it useful for electronics and aerospace applications. Electrical insulator is resistant to water, weather, gases and vapors, petroleum products, mild acids and alkalis, salt solutions, and other organic and inorganic compounds.

Adhesive is suited for bonding semiporous materials.

Tra-Con, Inc.    Bedford, MA 01730
Sep 01, 2006 Available in pre-mixed and frozen syringes, TRA-BOND 342-14T single-component, alumina-filled epoxy adhesive has low-viscosity formulation that exhibits thermal shock resistance. Material may be cured overnight at ambient conditions or at elevated temperatures for accelerated cure time. It adheres to various substrates and is suited for bonding materials such as ferrite, which require physical, rather than chemical, bond.

Low Viscosity Adhesive offers Tg of 90°C.

Tra-Con, Inc.    Bedford, MA 01730
Mar 29, 2006 TRA-BOND F110 is optically clear, low viscosity adhesive. Two-part epoxy can be room temperature or heat cured, and provides thin bond line on applications involving prisms, lenses, and other optical components. Adhesive exhibits wicking and wetting characteristics, offers high strength structural bond, and bonds to glass, ceramics, metals, and most rigid plastics.

Epoxy Adhesive features low viscosity.

Tra-Con, Inc.    Bedford, MA 01730
Mar 29, 2006 TRA-BOND F113SC epoxy adhesive is formulated for fiber optics, LED displays, lenses and other optical components. It provides high bond strength and low stress connections with no pistoning. Featuring Tg of 95°C, 2-part rigid epoxy system is curable at room temperature or can be heat cured in 15 min. It exhibits low water absorption percentage.

Epoxy Compound offers electrical potting and encapsulation.

Tra-Con, Inc.    Bedford, MA 01730
Feb 21, 2006 Providing optimized wetting characteristics, 2-part TRA-CAST 3103 adheres to glass, ceramics, and most metals and plastics. When fully cured, product offers electrical insulator with impact and thermal shock resistance. Material can be room temperature or heat cured and exhibits ultimate Tg of 80°C. TRA-CAST 3103 is NASA outgassing approved and has passed cytotoxicity testing.

Transparent Compound is suited for optical applications.

Tra-Con, Inc.    Bedford, MA 01730
Feb 01, 2006 TRA-BOND 546S01 is low-viscosity, UV-curable material that exhibits minimal shrinkage during cure to minimize stress. Rigid material also has secondary heat curing system to achieve its optimal Tg of 88°C. Transparent compound adheres to glass as well as other substrates.

Flexible Epoxy Adhesive is electrically conductive.

Tra-Con, Inc.    Bedford, MA 01730
Nov 09, 2005 Suited for electronic bonding, coating, and sealing applications that require flexibility, silver, 2-part Tra-Duct 926K01 offers working time that enables it to be used for high-speed component attachment. It creates electrically and thermally conducting bonds and coatings between materials such as metals, ceramics, glass, and plastic insulates. Suited for auto-dispense, product has medium viscosity and can be cured in 1 hr at 100°C.

Epoxy Adhesive meets casting application requirements.

Tra-Con, Inc.    Bedford, MA 01730
Nov 09, 2005 With 90 Shore D hardness and 60 min working life, TRA-CAST 3145 is thermally conductive and electrically insulating. Black, medium-viscosity casting system can be cured in 24 hr at ambient temperatures or more quickly at elevated temperatures. NASA outgassing-approved, product has 100% reactive solids content and coefficient of expansion that allows it to bond to various materials. It is useful for staking heat-sensitive components in PCB applications and as potting compound.

Epoxy Staking Compound provides electrical insulation.

Tra-Con, Inc.    Bedford, MA 01730
Nov 03, 2005 Two-part, medium-viscosity TRA-BOND 2112 offers room temperature or heat cure, and once cured, provides resistance to weather, galvanic action, petroleum products, alcohol, salts, and other organic and inorganic compounds. Solvent-free thixotropic adhesive features glass transition temperature of 93°C, and hardens to enamel-like coating with chemical resistance. Product is suited for electronic, aerospace, and industrial bonding, laminating, and reinforcing applications.

Epoxy Compound passes NASA outgassing specifications.

Tra-Con, Inc.    Bedford, MA 01730
Nov 03, 2005 Two-part, thixotropic TRA-BOND 2151 is heat conductive, electrically insulating, and can be room temperature or heat cured. Coefficient of thermal expansion allows bonds to surfaces including metals, silica, alumina, ceramics, glass, and plastics. Product is suited for staking transistors, diodes, resistors, integrated circuits, and other heat-sensitive applications.

Flame Retardant Epoxy Adhesive suits staking applications.

Tra-Con, Inc.    Bedford, MA 01730
Oct 25, 2005 Thermally conductive, electrically insulating Tra-Cast LX50019 is used for staking and setting transistors, diodes, resistors, integrated circuits, and other heat-sensitive components in printed circuit electronic applications. RoHS-compliant product develops high-impact bonds at room temperature, and has coefficient of thermal expansion that makes it compatible for bonding variety of substrates including silica, steatite, alumina, and sapphire.

Epoxy Adhesive is NASA outgassing approved.

Tra-Con, Inc.    Bedford, MA 01730
Sep 30, 2005 With working life of 60 min, black medium-viscosity TRA-CAST 3145 can be cured in 24 hr at ambient temperatures or more quickly at elevated temperatures. Product is thermally conductive, electrically insulating, and suitable for staking transistors, diodes, resistors, ICs, and other heat-sensitive components in PCB applications. TRA-CAST 3145 has 100% reactive solids content, offers Shore D hardness of 90, and is also useful as potting compound.

Adhesive offers lap shear values of 3,300 psi.

Tra-Con, Inc.    Bedford, MA 01730
Aug 23, 2005 Medium viscosity TRA-BOND 2101 bonds to most clean, dry material surfaces including metals, ceramics, glass, wood, leather, and rigid plastics. Resistant to many organic and inorganic materials including weather, salt solution, and many mild acids and alkalis, 2-part TRA-BOND 2101 has 30 min pot life and can be room temperature or heat cured.

Epoxy Compound offers set time of 5–7 minutes.

Tra-Con, Inc.    Bedford, MA 01730
Jul 26, 2005 High-viscosity TRA-BOND 216R01 exhibits lap shears of 3,600 psi with room temperature cure and 4,500 psi with 65°C heat cure. Product is tested and certified to requirements of UL94 V-O and is RoHS compliant.

Flexible Plastic Bonder has thixotropic formulation.

Tra-Con, Inc.    Bedford, MA 01730
Jul 26, 2005 With 1:1 mix ratio and Shore D hardness of 65, TRA-BOND 2170T suits applications that require chemical fastening to plastic parts. Amber epoxy adhesive bonds nylon, PVC, polyethylene, acrylic, lexan, polypropylene, kapton, and other thermoplastic substrates. Featuring working life of 2 hr, product and can be cured in 24 hr at room temperature or at accelerated rate in 65°C heat. Industries of use include medical, aerospace, photonic, and automotive.

Epoxy Compound bonds plastic and thermoplastic substrates.

Tra-Con, Inc.    Bedford, MA 01730
Jun 16, 2005 Manufactured as 2-part, low-viscosity epoxy, flexible TRA-BOND 2170T bonds all types of plastic, including nylon, PVC, polyethylene, acrylic, lexan, polypropylene, kapton, and thermoplastic substrates. Epoxy can be room temperature- or heat-cured and exhibits lap shear strength of 2,500 psi. Also available in thixotropic formulation, material suits applications in automotive, medical, aerospace, and photonics industries.

Epoxy Adhesive features color change properties.

Tra-Con, Inc.    Bedford, MA 01730
Jun 13, 2005 TRA-BOND 2230 low-viscosity, 2-part epoxy changes color during curing process to indicate cure. Offering beneficial wicking characteristics, it forms bonds with most metals, ceramics, glass, and plastics. Rigid material, with 1 hr pot life and ultimate Tg of 110°C, requires high-temperature heat cure. It exhibits minimal stress and offers impact and thermal shock resistance.

Fiber Optic Adhesive has low-viscosity formulation.

Tra-Con, Inc.    Bedford, MA 01730
Jun 13, 2005 Curable at room temperature or with heat, TRA-BOND 516H01 has ultimate Tg of 49°C, is dark blue in color to facilitate polishing, and provides low-stress connections. Formulated for terminating all types of fiber optic connectors, 2-part epoxy can also be used for bonding LED displays, lenses, and other optical components.

Epoxy Adhesive forms bonds with variety of materials.

Tra-Con, Inc.    Bedford, MA 01730
May 19, 2005 TRA-BOND 2143D medium viscosity polyamide epoxy adhesive is supplied in 2-part formulation that cures at room temperature or under heat. Able to bond with metals, plastics, glass, ceramics, leather, rubber, and wood, rigid compound exhibits Tg of 65°C, minimal moisture absorbance, and lap shear strength of 2,200 psi. It is suited for applications where impact resistance is required.

Epoxy Adhesive is color-keyed for convenience.

Tra-Con, Inc.    Bedford, MA 01730
Apr 21, 2005 Clear, low-viscosity TRA-BOND F230 offers Shore D hardness of 85, pot life of 1 hour, and can be cured in as little as 1 min at 150°C. Product is suited for termination of single and multi-mode connectors, and bonds to variety of optical materials. Featuring operating temperature of -60 to 175°C, adhesive offers impact and thermal shock resistance. Unmixed components are light yellow, while mixture is light green, and fully cured adhesive is reddish-amber.