Water-Soluble Solder Paste minimizes voids.

Indium Corporation    Clinton, NY 13323
May 03, 2013 Manufactured with standard type 3 powder in Sn63, Sn62, and Indalloy100, Indium6.4 minimizes voiding under QFN and BGA assemblies. Whereas typical water-soluble paste has approximately 15–30% voiding, Indium 6.4 consistently yields less than 5%. Additional features include optimized response-to-pause printing, cleanability, and reflow properties as well as extended stencil life and slump resistance.

No-Clean Solder Paste suits PoP applications.

Indium Corporation    Clinton, NY 13323
Mar 20, 2013 Designed for use in package-on-package applications 0.3 mm and larger, Indium9.91 can be used with SAC305 and Sn63/Pb37 alloys. Product's rheology optimizes both dipping and package retention. Featuring typical viscosity of 150 kcps, typical tack strength of 40 g, and working life of 8 hours at room temperature, solder paste eliminates defects due to package warping.

Thermal Interface Material is optimized for IGBT modules.

Indium Corporation    Clinton, NY 13323
Sep 16, 2009 Heat-Spring® metallic thermal interface material is soft metal alloy developed as compressible metallic shim suitable for IGBT mounting applications. Material's Heat-Springs are compressible soft metal performs that adapt to irregularities in mounting surface and are conductive both thermally and electrically. No special mounting apparatus is required. Heat-Springs are made of 100% recyclable and reclaimable metal and are considered green interface material.

Cored Wire Solder is designed for use with Pb-free alloys.

Indium Corporation    Clinton, NY 13323
Nov 05, 2008 Colophony/rosin free, no-clean, cored wire solder, CW-501 comes in variety of alloys and wire diameters. Compatible with wave fluxes and Indium8.9, it provides wetting and solder spread with minimal smoking and low odor.

Solder Flux targets Pb-free wave soldering.

Indium Corporation    Clinton, NY 13323
Jul 13, 2005 Suited for soldering surface-mount, mixed-technology, and through-hole electronics assemblies, 1075-EXR is water-based and non-flammable, eliminating special storage requirements and minimizing VOC emissions. Product provides surface wetting, eliminates cleaning, and minimizes solder balling. It can also be used for Sn/Pb assemblies.

Water-Soluble Solder Paste is lead-free.

Indium Corporation    Clinton, NY 13323
Oct 25, 2004 Suited for fine-pitch applications, Indium3.1 exhibits beneficial wetting under air and nitrogen reflow atmosphere. Low-voiding, low-foaming product exhibits slump resistance and results in shiny and smooth solder joints. Stencil life virtually eliminates solder paste waste, and any residue is cleaned with water. Product comes in 500 g jars and 700 g cartridges.

Wave Solder Flux suits Pb-free applications.

Indium Corporation    Clinton, NY 13323
Sep 30, 2004 No-clean, halide-free 3592-35 provides heat stability for high temperatures required in Pb-free wave soldering of mixed-technology and through-hole electronic assemblies. Solvent-based formulation offers wide process window and minimizes solder balling. It can be used with tin/copper, tin/silver/copper, and tin/lead alloys.

Interconnect Flux is water-soluble.

Indium Corporation    Clinton, NY 13323
Jul 29, 2004 Designed for use in BGA bumping and board level attachment, WS-364 water-soluble paste-flux can be applied by pin-transfer or stencil printing. It can be cleaned using room-temperature water and offers high yield in BGA bumping process. Available in syringes or cartridges, halide-free product is suitable for Sn/Pb and Pb-free applications.

Solder Wire is comprised of high-purity materials.

Indium Corporation    Clinton, NY 13323
Jul 23, 2004 Die Attach Solder Wire is manufactured from minimum of 99.9% pure materials with controlled oxide levels to facilitate wetting. It can be made to specific process or piece of equipment using advanced processes to hold to crucial diameters and tolerances for proper volume deposits. Standard packaging is available in 30-40 m spools; however custom spooling is available.