Latest New Product News from Engineered Materials Systems Inc.
Conductive Adhesive suits die attach applications.Engineered Materials Systems Inc. Delaware, OH 43015
Oct 29, 2013 Designed for chip-on-board or general die attach applications in circuit assembly, photonics, or camera modules, CA-165 is modified to provide conductivity stability during damp heat testing on tin, silver, and copper surfaces. Rheology is optimized for needle dispensing by time-pressure, auger, or positive displacement, and conductive adhesive features both moderate glass transition temperature (Tg) and modulus.
Dry Film Negative Photoresists withstand harsh environments.Engineered Materials Systems Inc. Delaware, OH 43015
Oct 15, 2013 Optimized for hot roll lamination and processing on MEMS and IC wafers, DF-2000 Series is available in thickness formats from 5–50 µm ±5%. Films feature glass transition temperature of 145°C and moderate modulus of 4.5 GPa at 25°C. Hydrophobic in nature, cured chemistry can withstand harsh environments, including extreme moisture conditions and corrosive chemicals. Films are compatible with and can be used in contact with EMS line of spin coatable photoresists.
Conductive Adhesive bonds components to circuit boards.Engineered Materials Systems Inc. Delaware, OH 43015
Oct 01, 2013 Suited for solder replacement applications, CA-102 electrically conductive adhesive has moderate glass transition temperature (Tg) and modulus, exhibits optimized rheology for screen printing, and can be needle dispensed by time-pressure, auger, or positive displacement. Modified to provide conductivity stability during damp heat testing on tin, silver, and copper surfaces, product suits applications requiring lower stress, lower temperature processing, or elimination of Pb in solder.
Encapsulant/Adhesive suits printer head, circuit assembly jobs.Engineered Materials Systems Inc. Delaware, OH 43015
Jun 20, 2013 Exhibiting fracture toughness as well as chemical resistance to inks, 357-284 Wire Bond Encapsulant and Flexible Circuit Bonding Adhesive is designed to protect wire bonds and reduce stresses associated with thermal cycling. Product adheres to flexible circuits, FR4, and metal substrates and meets circuit assembly and semiconductor standards for ionic cleanliness (extractable ions) to prevent corrosion in high temperature and humidity environments.
Conductive Die Attach Adhesive supports small die and LEDs.Engineered Materials Systems Inc. Delaware, OH 43015
May 08, 2013 Featuring high glass transition temperature to facilitate wire bonding, CA-105 Die Attach Adhesive is suitable for attaching LEDs and other small semiconductor die to silver and copper lead frames. Product has dispensing open time greater than 24 hours, measured as 25% increase in viscosity, while maintaining optimized rheology for pin transfer or needle dispensing.
Die Attach Adhesive suits temperature-sensitive applications.Engineered Materials Systems Inc. Delaware, OH 43015
Jan 24, 2013 Designed for attaching semiconductor die in temperature-sensitive devices, 561-50 Low Temperature Cure Adhesive is suited for smart cards, camera modules, and flex circuits. Electrically conductive product is more than 90% cured after 30 min at 80°C, but has dispensing work life greater than 48 hr, while maintaining optimized rheology for dispensing, damp heat resistance, and conductivity stability. Also, flexible material can be fast cured in 1 min at 180°C.
UV Cure Adhesive suits electronics assembly applications.Engineered Materials Systems Inc. Delaware, OH 43015
Jun 21, 2012 Non-conductive 535-10M-1 is flexible epoxy adhesive that suits disk drive, camera module, optoelectronic, and circuit assembly applications. Product is designed to eliminate any crowning (warpage) of sliders in head gimbal assemblies and can be used in other bonding applications in head stack assembly. Also, this antimony-free adhesive can be used for lens bonding in camera modules, chip encapsulation in smart cards, and general bonding applications in photonics assembly.
Wire Bond Encapsulant acts as flexible circuit bonding adhesive.Engineered Materials Systems Inc. Delaware, OH 43015
Apr 11, 2012 Intended for printer head and circuit assembly applications, 357-348 Wire Bond Encapsulant and Flexible Circuit Bonding Adhesive imparts protection while reducing stresses associated with thermal cycling. Product exhibits chemical resistance to inks and adheres to flexible circuits, FR4, and metal substrates. Properties meet circuit assembly and semiconductor standards for ionic cleanliness (extractable ions) to prevent corrosion in high-temperature and -humidity environments.
Other Company News From Engineered Materials Systems Inc.
Mar 01, 2012
Engineered Material Systems Debuts New 535-10M UV Cure Adhesive for Disk Drive Applications
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