High-Throughput Metrology System utilizes TSV technology.

Nova Measuring Instruments Inc.    Sunnyvale, CA 94085
Jul 19, 2012 By allowing accurate measurement of critical TSV features such as side-wall angle, bottom diameter, and bottom curvature, Nova V2600(TM) helps accelerate development and improve production yield of multi-chip integrations that rely on TSVs (Through Silicon Vias). Process control solution delivers complete TSV dimensional metrology in production-ready system for industry's transition to 3D integration in production. Spectral method can be extended to future TSVs with diameters below 5 microns.

Metrology Software Engine supports advanced 3D designs.

Nova Measuring Instruments Inc.    Sunnyvale, CA 94085
Jul 19, 2011 Designed to address transition to novel chip design concepts such as 3D gates, NovaMARS® 5.0 can combine data from multiple optical channels directly on tool during measurement. Detailed reproduction of complex 3D structures is possible by extraction of fine shape parameters, enabling process control of advanced devices such as FinFET non-planar transistors. NovaMARS StackMaker designer for scatterometry models allows drag-and-drop design and visualization of complex 3D device geometries.

Optical Critical Dimension System enhances 3D profile metrology.

Nova Measuring Instruments Inc.    Sunnyvale, CA 94085
Jul 14, 2011 Used to non-destructively measure and control vertical processes, Nova T600® is intended for process control of complex vertical structures for 22 nm technology node and beyond. Multi-channel oblique incidence spectroscopic reflectometry, combined with normal-incidence reflectometer, optimizes sensitivity on small features. Extracted SNR promote performance on full range of profile metrology applications, and concurrent optimization of information from multiple sources is fully supported.

Software Development Tools help build optical CD applications.

Nova Measuring Instruments Inc.    Sunnyvale, CA 94085
Jul 22, 2010 NovaMARS v4.0 accommodates semiconductor manufacturers, developing advanced technology of 22 nm and below, who are faced with need to visualize complex 3D structures by non-destructive metrology. Providing all details of 3D structure, software features compact library design that enables measurement of parameters of complex structure. Interpretation algorithms boost sensitivity, while calculation engine reduces real-time regression and library generation time.

Metrology Software optimizes optical CD measurement quality.

Nova Measuring Instruments Inc.    Sunnyvale, CA 94085
Jul 10, 2009 Available as option to NovaMARS Applications Development Software, MatMaker(TM) Product-Driven Materials Characterization Package utilizes Scatterometry targets on product wafer to determine optical properties of various constituent materials together with geometrical profile parameters. All process-induced changes to materials' optical properties can be accurately captured inside Scatterometry model.

Optical CD Platform offers 250 WPH throughput (13 sites).

Nova Measuring Instruments Inc.    Sunnyvale, CA 94085
Jul 25, 2008 Featuring optics based on Normal Incidence Spectral Reflectometry, stand-alone Nova T500(TM) offers flexible platform that allows up to 3 measurement units to be installed on same tool. Combined with NovaMARS(TM) application development software, it can measure fine profile parameters on complex 3D test structures as well as in device. Solution can measure complex 3D profile parameters on test structures as well as in device and incorporates GUI conforming to SEMI standard E-95.

Metrology System meets requirements of IC manufacturing.

Nova Measuring Instruments Inc.    Sunnyvale, CA 94085
Dec 18, 2006 Identifying changes and irregularities in film microstructure, Crystalx II(TM) wide angle X-ray diffraction metrology system provides quick quantitative full wafer measurements of crystallographic texture, phase, and relative grain size. Suitable for process development and production, monitoring tool uses 2D area detector for collection of multiple diffraction peaks at multiple angles simultaneously, resulting in rapid microstructure data collection.