Resist Processing System supports micro- and nano-electronics.

EV Group Inc.    Tempe, AZ 85284
May 17, 2013 Featuring robot with dual arms for accelerated wafer swapping, EVG®120 Automated Resist Processing System supports coating and developing applications for MEMS systems, advanced packaging, and compound semiconductors. Two customizable wet processing bowls are complemented by 10 stacked modules for vapor prime, soft and hard bake, and chill processes. Accommodating wafers up to 200 mm in diameter, EVG120 includes CoverSpin™ rotating bowl cover for coating uniformity across substrate.

Automated Resist Processing System handles high-volume jobs.

EV Group Inc.    Tempe, AZ 85284
Sep 06, 2012 Accommodating wafers from 50-200 mm dia, EVG150 provides flexible, modular platform that addresses production needs for back-end lithography, conformal coating, and planarization of devices with complicated structures and topographies. Up to 4 wet process modules can be combined with 2 stacks of hot plates, chill plates, and vapor prime modules. Specific capabilities include spin coating, developing, spray coating, and lift off.

Mask Alignment System manufactures high-brightness LEDs.

EV Group Inc.    Tempe, AZ 85284
Feb 14, 2012 Equipped with high-intensity UV light source and optional filter fan unit, EVG620HBL Gen II provides wafer throughput up to 165 6-in. wafers/hr. Robotic handling layout with wafer mapping capability supports demand for wafer traceability, while microscope supports automated mask pattern search, minimizing mask setup and change time. With recipe-controlled microscopes, illumination spectrum can be varied to ensure best pattern contrast with various wafer and layer materials.

Wafer Handling System boosts high-volume manufacturing performance.

EV Group Inc.    Tempe, AZ 85284
Dec 08, 2011 Addressing high-volume manufacturing (HVM) requirements, XT Frame accommodates up to 9 process modules and delivers flexibility by accommodating various combinations on single tool platform. Features include equipment front-end module with speed-optimized handling system, enough module spaces for parallel processing of several wafers, as well as up to 4 FOUP (front opening unified pod) load ports. Additionally, local FOUP storage system allows efficient, continuous mode operation.

Wafer Bonding System offers throughput up to 20 wafers/hr.

EV Group Inc.    Tempe, AZ 85284
Sep 14, 2011 Designed for integrated and automated loading, alignment, bonding, and unloading of wafers up to 300 mm in diameter, GEMINI FB supports CMOS image sensors and 3D integration applications. Local material buffer enables 10 front opening unified pods on system for continuous mode operation. To accelerate wafer handling, system utilizes double-end effectors. Low temperature plasma activation enables wafer bonding and stress/damage-free annealing at less than 400°C.

Semiconductor Wafer Bonding System handles 300 and 450 mm sizes.

EV Group Inc.    Tempe, AZ 85284
Jul 14, 2011 Designed to support and facilitate industry transition to 450 mm wafers from 300 mm standard, EVG850SOI/450 mm provides fully automated tool for production-level fabrication of silicon-on-insulator (SOI) wafers. System can process both wafer sizes and consists of 2 process modules: one for cleaning and pre-conditioning of wafers before wafer bonding, and for SOI pre-bonding. Tool is equipped with 450 mm load ports and front opening unified pods.

Wafer Bonding System offers in-line metrology module.

EV Group Inc.    Tempe, AZ 85284
Jun 27, 2011 Available as option on EVG850TB and EVG850DB automated temporary bonding and debonding systems, In-Line Metrology Module can detect variety of thin-wafer process irregularities and defects, including total thickness variation of carrier wafer, adhesive layer, bonded stack, and thinned wafer; bow/warp of bonded stack; and voids in bond interface. Adding in-line metrology to thin wafer processing enables ramp-up of 3D-IC and TSV manufacturing from pilot-line to volume production.

Mask Alignment System offers high-throughput wafer processing.

EV Group Inc.    Tempe, AZ 85284
Feb 28, 2011 Model EVG620HBL automated mask alignment system delivers throughput of up to 165 six-inch wafers/hr for manufacturing high-brightness LEDs, compound semiconductors, and power electronics. System includes high-intensity UV light source and 5 cassette stations. Also included are recipe-controlled microscopes with illumination spectrum that optimizes pattern contrast with various wafer and layer materials, including sapphire, silicon carbide, aluminum nitride, metal, and ceramic.

Three-Chamber Wafer Bonding System suits MEMS applications.

EV Group Inc.    Tempe, AZ 85284
Oct 25, 2010 Model EVG520L3, 3-chamber wafer bonding system enables processing of up to 3 substrate stacks simultaneously. It utilizes pre- and post-bond process chambers, which separate baking and pumping, high-vacuum bonding, and post-bond cooling to speed bond process. Product's heater design supports 45°C/min heating and up to 100°C/min cooling ramps with silent wafer cooling. Various wafer sizes and materials with modular configurations for transfer of R&D processes to production are supported.

Soft UV Nanoimprint Lithography allows pattern features to 12.5 nm.

EV Group Inc.    Tempe, AZ 85284
Oct 15, 2010 Based on UV-NIL systems, Soft Molecular Scale Nanoimprint Lithography (SMS-NIL) technology enables ultra-high-resolution patterning of features down to 12.5 nm on large-area surfaces. Soft working stamp process allows full-area nanoimprints and optically aligned UV-NIL on existing EVG equipment. While stamp and imprinting can be processed on same tool without additional processing steps, soft polymeric working stamp's properties reduce mechanical damage to master templates.