Latest New Product News from Viscom USA
Conformal Coating Inspection System exposes potential defects.Viscom USA Atlanta, GA 30092
Oct 03, 2013 Featuring 8M camera technology with 4 orthogonal cameras and UV LEDs, S3088 Conformal Coating Inspection (CCI) system inspects transparent protective coatings with UV fluorescent indicators on electronics assemblies for such defects as cracks, bad spots, thin/thick layers, smearing, impurities, or splashes. Along with 11.7 or 23.5 µm/pixel resolution, features include flexible algorithms for adaptation to different conformal coating methods. Inspection programs can be created within minutes.
Optical and X-Ray Inspection Software reduces cycle time.Viscom USA Atlanta, GA 30092
Jun 26, 2013 SI v7.46 includes Library Manager, allowing inspection patterns to be assigned efficiently and for convenient use of local and global inspection libraries. With AOI Desktop system S2088-II, software allows live capture of defect image under different perspectives and in color. Product features SPI Closed Loop, for 3D solder paste inspection, supporting automatic correction of print stencil if print image is displaced. Automatic cleaning of paste printer can also be initiated.
AOI Camera System helps optimize throughput, inspection depth.Viscom USA Atlanta, GA 30092
Apr 05, 2013 Along with image capture rate of up to 1.8 gigapixel/sec, XM camera module offers switchable optical resolution of 16 or 8 µm. With 4-color illumination from all spatial directions, optimum contrast is achieved for all recognizable solder defects as well as such special effects as script, polarity marks, or colored components. Inspection speed, homogeneous illumination, and resolution allow inspection to be targeted to respective electronic assembly.
X-Ray Inspection System meets needs of electronics industry.Viscom USA Atlanta, GA 30092
Aug 01, 2012 Used for electronics assembly inspection, X8011 is available in basic, plus, and flex versions. Image quality, simplicity and speed of operation, and focused analyses are optimized to cover requirements of electronics assembly production. Functionality accommodates increasing use of BGA, QFP, and THT components as well as application fields such as inspection of surface-soldered connections.
Inspection Software targets electronics industry.Viscom USA Atlanta, GA 30092
May 08, 2012 SI Release 7.45 delivers features that facilitate and accelerate use of AOI/AXI inspection systems in electronics manufacturing. Algorithm for component body detection for SOTs results in reduced false alarm rates, and color ring inspection capability for resistor values uses analysis process based on color images from 8M camera technology. Additional features include solder ball inspection capabilities and TopOCR optical character recognition software.
Automated Optical Inspection Software offers image verification.Viscom USA Atlanta, GA 30092
Apr 17, 2012 AOI software, vVision, provides verification station (vVerify) that allows defect images and features to be displayed. Inspection results are verified, and conclusive good/bad evaluation is made. Inspection data can be also used for various evaluations, including statistical process control. With vVerify, configuration of displayed information with respect to selection and positioning of additional images can be completely individualized. Each operator can design unique classification station.
Intelligent AOI Software guides even inexperienced operators.Viscom USA Atlanta, GA 30092
Apr 16, 2012 Featuring component-oriented approach and arbitrary crosslinking of inspection objects, vVision offers modern, self-explanatory UI that reduces display to essentials, clear colors, and talking icons. Varying data formats can be used as input data, and inspection technology contains complete offering of Viscom algorithms and integration tools and provides component-oriented approach and arbitrary crosslinking of inspection objects.
Inspection System targets 3D MID electronics assemblies.Viscom USA Atlanta, GA 30092
Apr 11, 2012 Equipped with Viscom 8M camera technology, Model S6056 MID is suited for inspection after manufacture of 3-D MID carrier as well as inspection after manufacture of entire 3-D MID product. After entire MID product has been manufactured, components are checked for presence, polarity, correctness, and position. For wirebond applications, it is possible to apply wirebond camera technology with resolution from 2.5-5 µm/pixel. Angular inspection is used when objects are positioned on different levels.
Active X Software performs TIFF to PDF conversion.Viscom USA Atlanta, GA 30092
Sep 15, 2008 TIFF to PDF SDK ActiveX v4.54 can be used to convert PDF/PSD/BMP/GIF/JPG/PNG/ICO/TIF image files to true color PDF files as well as perform multipage TIFF to multipage true color PDF conversion. Along with support for various visual effects, software offers image resolution resizing/export capabilities as well as read/write capabilities for EXIF image information and binary data types. Additional features include image file loading/printing and multipage TIFF image creation/saving.
Software simplifies AOI programming and control.Viscom USA Atlanta, GA 30092
Apr 28, 2003 EasyPro user interface for circuit board inspection systems provides Inspection mode, Programming mode, and Service mode. All necessary programming tools are available continuously, without having to activate them separately. Interface integrates program optimization with parameter settings and editing of inspection pattern. File import from SPC software into programming software allows control of offline programming based on related evaluations of fault statistics.
Click below for more Product News from Viscom USA
Other Company News From Viscom USA
Sep 01, 2013
Inspecting in Three Dimensions
Sep 01, 2013
Total 3D - Viscom Presents AOI Module with 3D Technology
Sep 01, 2013
Viscom Brings S3088 AOI with Quality Uplink to SMTAI
Aug 01, 2013
Viscom to Premier New and Ultra-fast Budget AOI System S3088 QC at NEPCON South China 2013
Mar 01, 2013
Semikron Checks DCBs with Automatic Wirebond AOI from Viscom
Mar 01, 2013
Viscom Scores NPI Award for Its SPI-AOI Uplink Function
Jan 01, 2013
Viscom to Debut S6056 XM AOI with New 65 Megapixel Camera Head at the IPC APEX EXPO
Sep 01, 2012
Viscom to Exhibit AOI/AXI Capabilities and New Process Uplink at SMTA International 2012
Jul 01, 2012
Viscom to Exhibit AOI/AXI Capabilities and New Process Uplink at IPC Midwest 2012
May 01, 2012
Rehm Qualifies Void-Free Soldering Process with Viscom X-ray Inspection System
Apr 01, 2012
3-D Solder Paste Inspection with Process Uplink Function: More Than Just Defect Detection
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