Latest New Product News from Electronic Interconnect Corp.
Printed Circuit Board suits thermal management applications.Electronic Interconnect Corp. Elk Grove Village, IL 60007
Jul 23, 2012 Intended for electronic assemblies where thermal management/heat dissipation capabilities are desired, Powerlink PLPCB combines low-power circuits with high-power bus bars using 2 or more copper weights on same external layer. Multiple layers are possible, with high and low current-carrying capacity on same trace. Outer layer copper weights up to 50 oz/ft² are usable. With high surface area to cross-sectional area ratio, bus bars allow heat to efficiently dissipate.
Other Company News From Electronic Interconnect Corp.
Jan 25, 2011
Electronic Interconnect (EI) Appoints Adapt Electronics Rep in Pacific NW
Jan 20, 2011
Electronic Interconnect (EI) Appoints Hughes Cain & Associates Rep
Aug 24, 2010
Electronic Interconnect (EI) Exhibits PCB Fab Capabilities at Upcoming Design-2-Part Show in Huntsville AL
Jul 12, 2010
EI's DFM Service Catches PCB Design Problems up Front
Jul 01, 2010
EI's Pratish Patel Earns IPC Trainer Certification
May 04, 2010
Electronic Interconnect (EI) Launches New, Interactive PCB Resource at www.Eiconnect.com
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