Printed Circuit Board suits thermal management applications.
Electronic Interconnect Corp.
Elk Grove Village, IL 60007
Jul 23, 2012
Intended for electronic assemblies where thermal management/heat dissipation capabilities are desired, Powerlink PLPCB combines low-power circuits with high-power bus bars using 2 or more copper weights on same external layer. Multiple layers are possible, with high and low current-carrying capacity on same trace. Outer layer copper weights up to 50 oz/ft² are usable. With high surface area to cross-sectional area ratio, bus bars allow heat to efficiently dissipate.
