Wafer Analysis System quickly diagnoses root cause of defects.

FEI Company    Hillsboro, OR 97124
Jun 13, 2013 With automated front opening universal pod, Helios NanoLab™ 1200AT DualBeam™ System can be located inside semiconductor wafer lab, where SEM imaging and focused ion beam milling are used to extract ultrathin samples of targeted structures for examination in TEM. System can create site-specific TEM samples thin enough to capture single transistor at 10 nm node, from wafers up to 300 mm in diameter. By moving 1200AT close to wafer process line, process development and ramp are accelerated.

Particulate Analyzer monitors automotive part cleanliness.

FEI Company    Hillsboro, OR 97124
Apr 02, 2013 Combining scanning electron microscope and X-ray spectrometer, ASPEX CleanCHK™ Analyzer monitors automotive part cleanliness by providing particulate data within minutes. Advanced software routines automatically detect and count particles and analyze particle size, shape, and composition. Designed for use on production floor, analyzer offers automated sample set-up, calibration, and analysis; menu-based operation; and ability to report results in several industry standard formats.

Transmission Electron Microscope aids structural biology research.

FEI Company    Hillsboro, OR 97124
Feb 05, 2013 Part of integrated workflow, Tecnai Arctica™ incorporates automation, pioneered on FEI’s flagship Titan Krios™ TEM, to elucidate 3D structure of biological macromolecules and molecular complexes. Cryo-sample autoloader, combined automated target identification, and low dose imaging enable unattended acquisition of large SPA data sets. UI and automation of routine operations and set up procedures lower threshold of operator expertise.

Dual Beam System provides semiconductor failure analysis.

FEI Company    Hillsboro, OR 97124
Nov 26, 2012 Combining scanning electron microscope for imaging and focused ion beam for milling and deposition, Helios NanoLab™ 450 F1 DualBeam™ System provides semiconductor manufacturers with optimal images of device architectures. STEM detector delivers material contrast, while FlipStage™ 3 flips sample between thinning and STEM viewing positions, and rotation axis permits viewing from either side. To support automated lift-out, EasyLift™ nanomanipulator provides precise motorized sample manipulation.

Automated Mineralogy Analyzer offers turn-key operation.

FEI Company    Hillsboro, OR 97124
Nov 19, 2012 Extending mineral liberation analysis, MLA EXpress™ provides graphic, mineralogical, and textural information from ore needed to make decisions in diverse mining operations. Bench-top unit. Automated mineralogy involves scanning electron microscope (SEM) and X-ray spectrometer, used to obtain microscopic view of structure and composition of ore. There are multiple analytical modes available, and detector and pulse counting technologies maximize count rates.

Surface Inspection System offer analytical and imaging modes.

FEI Company    Hillsboro, OR 97124
Oct 02, 2012 Versa 3D™ DualBeam™ is available with UniColore (UC) monochromated electron source, which improves fine surface detail imaging capabilities at low accelerating voltages without compromising analytical performance at high voltages and beam currents. By decreasing energy spread among beam electrons, UC source reduces chromatic aberration and permits beam to be focused into smaller spot. Analytical mode offers beam currents up to 100 nA, and imaging mode offers resolution of 1.4 nm at 1 kV.

FIB/SEM Systems support TEM sample preparation.

FEI Company    Hillsboro, OR 97124
Aug 31, 2012 Respectively accommodating up to 100 mm samples and full 300 mm wafers, Helios NanoLab(TM) 450HP and 1200HP DualBeam(TM) systems meet requirements for semiconductor process development at 28 nm device geometry node and below. Systems can prepare 15 nm thick samples with less than 2 nm damage layer in 90 min. QuickFlip grid holders facilitate inverted sample preparation, and iFast(TM) automation software optimizes usability while ensuring consistency among multiple operators and systems.

Scanning Electron Microscope offers sub-nanometer resolution.

FEI Company    Hillsboro, OR 97124
Aug 08, 2012 Verios(TM) XHR SEM provides resolution and contrast needed for precise measurements on beam-sensitive materials in semiconductor manufacturing and materials science applications. When combined with IC3D(TM) software, instrument can provide measurements needed to control processes at 22 nm technology node and below. User can switch between operating conditions, maintain sample cleanliness, and obtain sub-nanometer resolution at any accelerating voltage from 1-30 kV.

Electron Microscope images dynamic processes at atomic scale.

FEI Company    Hillsboro, OR 97124
Jul 31, 2012 Titan(TM) ETEM G2 enables time-resolved, in-situ studies of processes and materials exposed to reactive gases and elevated temperatures. With this environmental transmission electron microscope (ETEM), developers of energy and environmental products can study relationships between structure and performance by observing atomic scale processes and gas-solid interactions under conditions that mimic operational environment. UI accelerates switching between ETEM and high vacuum modes.

Workflow Imaging Software analyzes shale gas reservoirs.

FEI Company    Hillsboro, OR 97124
Jan 13, 2012 Core-to-pore petrography workflow includes automated, large-scale, high resolution imaging method for viewing and analyzing petrographic data sets with length scales from centimeters to nanometers. Used for core analysis of unconventional gas reservoirs, solution acquires grid of electron microscope images covering entire sample surface and stitches them together in coherent and correlated image data set. Image datasets can be augmented with additional information.