Latest New Product News from Epoxies Etc.
Casting Resin is suitable for cable and harness assemblies.Epoxies Etc. Cranston, RI 02921-3407
Mar 12, 2013 Offering alternative to injection molds when encapsulating electronics, 20-2180 Polyurethane Potting and Encapsulating Resin can be poured into metal or silicone mold to create assembly with firm seal around jacketed wires. Rubber-like texture makes it suited for outdoor applications. Resistant to moisture and chemicals, stable and vibration-resistant product has 2:1 mix ratio, self-levels around components, and will not crack. Base is natural oil polyol.
Silicone Compound helps make strong, durable molds.Epoxies Etc. Cranston, RI 02921-3407
Dec 26, 2012 Formulated without solvents or other toxic materials, 70-1300 RTV Silicone Elastomer does not shrink during cure, is resistant to chemicals, and cannot be regulated or considered hazardous for transportation. Clear color helps user increase mold production precision, while strength and chemical resistance lend to molds that allow for increased number of pours.
Silicone Elastomer suits potting and encapsulating.Epoxies Etc. Cranston, RI 02921-3407
Nov 26, 2012 Providing protection in extreme environmental conditions, 2-component 20-1634 is suitable for potting electronic assemblies and other industrial applications requiring low weight, flexibility, heat resistance, and optimized electrical insulation properties. Product cures in deep sections, eliminating need for multiple pours. Formulated without solvents or other toxic materials, compound is safe to handle and not hazardous for transportation.
Thermally Conductive Silicone protects electronics.Epoxies Etc. Cranston, RI 02921-3407
Oct 18, 2012 With 1:1 mix ratio, flexible 50-1952 cushions electronics from vibration and impact, and is specially formulated for quick thermal transfer away from heat generating electronic devices. Non-corrosive silicone potting and encapsulating compound is made without use of harsh solvents or other toxic materials and is not hazardous to ship. Operating from -65 to +235°C, low-exotherm product eliminates need for multiple pours.
Silicone Compound is designed for potting and encapsulating.Epoxies Etc. Cranston, RI 02921-3407
Sep 28, 2012 Free of any flammable or toxic solvents, 2-part 50-1225 has -65 to +210°C service temperature, will cure in deep sections, and will not support or promote flame. Compound is designed for electronic packages that require flow around components, thermal conductivity, and ability to sustain environmental extremes. While material flexibility will cushion electronics through aging and thermal cycling, shrinkage rate during cure will not stress components.
Potting Compound is quick, convenient and easy to use.Epoxies Etc. Cranston, RI 02921-3407
Aug 22, 2012 Used for potting and encapsulating, 20-2028 lightweight (11 lb/ft³) closed cell liquid urethane foaming resin system has 1:1 mix ratio and 10 min demolding time. This potting foam does not utilize MOCA or TDI, promoting safe use, while low density facilitates repairs if mistakes are made first time around. Resistant to chemical solvents, moisture, thermal shock, and impact, product is formulated for accelerated curing and exhibits electrical insulation properties.
One-Component Epoxy maintains properties over temperature range.Epoxies Etc. Cranston, RI 02921-3407
Aug 14, 2012 Able to withstand stretching, impact, and heating/cooling, 50-3122 is formulated to maintain optimal peel and shear strength over -60 to +205°C range. This 100% solids system, in addition to offering electrical insulation, is resistant to vibration, stress fatigue cracking, and chemicals. Product does not require any mixing and cures in 5 min to 2 hr depending on cure temperature. Areas of use include electronic, electrical, aerospace, automotive, and industrial applications.
Epoxy Adhesive withstands exposure to UV rays.Epoxies Etc. Cranston, RI 02921-3407
Mar 30, 2012 Virtually invisible, type 10-3713, 2-component epoxy adhesive dries clear so excess material is barely noticeable. Formulated with agents that guard against UV rays, non-yellowing epoxy has low viscosity that allows for good coverage of all surfaces, and bonds to most substrates. It penetrates substrates to form bonds at room temperature or with mild heat.
Low-Viscosity Epoxy Adhesives offer fast set times.Epoxies Etc. Cranston, RI 02921-3407
Mar 01, 2012 Setting in 5, 20, and 46 min, respectively, Quick-Set Trio (10-3005, 10-3020, and 10-3046) cure at room temperature. Clear and solvent-free products are suited for bonding plated metals, pewter, glass, wood, ceramic, felt, cement, gem stones, rubbers, plastics, and more. Offered in TriggerBond dual barrel cartridge system or bulk packaging, products meet UL94 HB requirements; resist effects of water, chemicals, impact, and thermal shock; and have 1:1 mix ratio.
Flame Retardant Potting Compound stays flexible in cold temps.Epoxies Etc. Cranston, RI 02921-3407
Jan 02, 2012 Designed to meet UL 94 V-0 flammability standard, 20-2362 FR remains soft in very low temperatures down to -72°C. Polyurethane potting and encapsulating compound is suited for cushioning and protecting sensitive electronic components since it provides vibration resistance and does not stress components. Compliant with REACH and RoHS, product is also moisture-resistant and will not damage components during cure.
Click below for more Product News from Epoxies Etc.
Other Company News From Epoxies Etc.
May 13, 2013
High Quality Potting Compound Meets Special Criteria
Feb 06, 2013
Epoxies, Etc. Launches New Website February 2013
Jan 25, 2012
Epoxies, Etc. Unveils New Video for the TriggerBond® Product Line
Nov 22, 2011
When Electronic Assemblies Need to Perform at Low Temperatures and Self-Extinguish... Rely on 50-2185 FR
Nov 04, 2011
Does Weight Matter?
Sep 26, 2011
Epoxies, Etc. Unveils New Product Video for Thermally Conductive Potting Compound 50-3150 FR
Dec 01, 2009
Epoxies, Etc Builds New R&D Laboratory
Dec 01, 2009
Epoxies, Etc... Announces a Revision of Its Corporate Brand
Jun 24, 2008
Epoxies, Etc Announces New IllumaBond(TM) Brand
Jun 01, 2008
Epoxies, Etc... Announces New IllumaBond(TM) Brand
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