Hall Effect Thickness Gauge measures from 0.0001 in. to 1 in.

Olympus    Waltham, MA 02453
Dec 06, 2012 Utilizing magnetic method, Magna-Mike® 8600 makes thickness measurements on glass, composites, and non-ferrous metals such as aluminum, brass, copper, and titanium. Gauge offers straight and angled magnetic probes with replaceable wear caps, color LCD with full VGA resolution, and USB/RS-232/VGA outputs. Internal data logger stores more than 475,000 thickness readings in various file formats, while Micro SD card slot provides additional storage and data transfer.

Bright, Wide Angle Lens work in challenging situations.

Olympus    Waltham, MA 02453
Nov 29, 2012 Able to capture subjects in low-light environments, Micro Four Thirds® M.ZUIKO® DIGITAL 17 mm f1.8 lens has 9 lens elements in 6 groups to deliver sharp images of subjects. Optical system features 3 aspherical lenses, including Dual Super Aspherical element to correct aberrations and High Refractive index lens to correct high spherical aberrations. At 1.4 in. long, lens also features MSC autofocusing mechanism and Snapshot Focus mechanism for pan focusing with distance indicator.

Flaw Detector provides numerous TOFD capabilities.

Olympus    Waltham, MA 02453
Nov 20, 2012 OmniScan MX2 supports 2-channel conventional ultrasound module (UT2), which can be used for TOFD (Time-of-Flight Diffraction) inspections, and onboard software featuring TOFD-specific capabilities/features. In addition to pulser voltages (340 V), PRF capabilities, and SNR, features include TOFD wizard, PCS calibration tool, multiple TOFD screen layouts, Lateral Wave straightening function, and B-scans that facilitate setups as well as improve acquisition displays and defect sizing.

Flaw Detector utilizes phased array and ultrasound modules.

Olympus    Waltham, MA 02453
Nov 06, 2012 For expanded capabilities, OmniScan MX2 Flaw Detector is available with PA2 Phased Array module with UT channel, and UT2 two-channel conventional ultrasound module that can be used for Time-of-Flight Diffraction. NDT SetupBuilder software can create inspection setups based on configuration of component or part to be inspected, while OmniPC software revision provides comprehensive data analysis capabilities for inspection data acquired with flaw detector.

Linear PCM Recorders capture pure sound up to 130 dB SPL.

Olympus    Waltham, MA 02453
Oct 17, 2012 Designed to capture and playback sound exactly how users experience it, LS-12 features two 90° directional stereo condenser microphones with frequency response of 60 Hz to 20 kHz, while LS-14 compliments microphones with third omnidirectional center TRESMIC, increasing frequency response to 20 Hz to 20 kHz. Mode Select Dial, located on bottom right-hand corner, can be set to Tuner, Manual, Quick, and Smart modes. Files are recorded in PCM or MP3 modes and saved to internal memory or SD/SDHC card.

Ultrasonic Thickness Gage offers multiple measurement options.

Olympus    Waltham, MA 02453
Oct 03, 2012 Compatible with dual- and single-element transducers, handheld 45MG achieves instant readings from one side of material and delivers repeatable measurements. Functionality is enhanced via optional Thru-Coat® and Echo-to-Echo technology and time-based B-scan. When used with code-activated single element transducer option, unit can make accurate thickness measurements, with resolution of 0.0001 in., on diverse materials. Optional single-element High Penetration feature is also available.

Data Analysis Software supports phased array flaw detectors.

Olympus    Waltham, MA 02453
May 07, 2012 OmniPC is computer-based software program that provides analysis capabilities for inspection data acquired with OmniScan flaw detector. It offers capabilities such as data, reference, and measurement cursors for defect sizing and reporting. OmniPC features readings database for trigonometry, flaw statistics on axes, volumetric position information, and code-based acceptance criteria. Data acquisition and analysis can be conducted concurrently and keyboard shortcuts are provided for file analysis.

IR Metrology System measures bond parameters of 3DS-ICs.

Olympus    Waltham, MA 02453
Jul 18, 2011 Utilizing confocal IR laser scanning microscope technology, 3DIR Metrology and Defect Review System measures post bond parameters of 3D stacked integrated circuits, such as overlay alignment accuracy, bonding interface thickness variations, and bonding interface quality. System measures alignment points at selected die of bonded wafers, stores images and data, and summarizes results. Correlation of overlay alignment offset data to electrical yield provides early indication of bonded wafer yield.

Imaging Microscopes leverage feature-enhancing software.

Olympus    Waltham, MA 02453
May 19, 2011 FluoView FV1000 confocal laser scanning microscopes and FV1000MPE multiphoton excitation systems are available with FV10-ASW v3.0 software, which incorporates high dynamic range imaging and minimizes signal to noise ratios to produce clear, highly resolved images. Other functionality includes partial stitching with multi area time lapse imaging to allow analysis of specific regions of interest. Channel un-mixing feature, usedwith FV1000MPE, allows spectral un-mixing of multi-color samples.

Phased Array Flaw Detector features 10.4 in. touchscreen.

Olympus    Waltham, MA 02453
May 06, 2011 With optimized data storage capacity and transfer rate, OmniScan MX2 provides inspection capabilities for manual and automated phased array applications. Integral 10.4 in. LCD touchscreen facilitates navigation, text input, and parameter setup, while SD card and USB interfaces provide connectivity. Fully compatible with phased array modules already in field, modular instrument comes with all software options, including multigroup, time-of-flight diffraction, and weld overlay wizard.