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Engineered Material Systems
132 Johnson Dr.
Delaware, OH, 43015

Detailed Contact Information:
Conductive Adhesive suits die attach applications.   Return to story
Company Information:
Engineered Material Systems
132 Johnson Dr.
Delaware , OH  43015   USA
Phone: 740-362-4444
FAX: 740-362-4433
http://www.emsadhesives.com
Sales:
Mark Francis Global Sales and Marketing Manager
USA
Phone: 740-203-2950
Send email  E-mail this person
 
 
Latest New Product News from Engineered Material Systems
Products or services this company supplies:
 
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Dry Film Negative Photoresist produces hydrophobic surfaces.

Dry Film Negative Photoresist produces hydrophobic surfaces.

Engineered Material Systems    Delaware, OH 43015
May 14, 2014 Optimized for hot roll lamination and processing on micro-electromechanical systems (MEMS) and IC wafers, DF-4017 produces hydrophobic (>90° contact angle) film surfaces. Cured chemistry withstands harsh environments, including those subject to moisture and corrosive chemicals, while glass transition temperature of 145°C and moderate modulus of 4.5 GPa at 25°C lend to toughness. Product is compatible with and can be used in contact with EMS spin coating photoresist.
UV Cure Adhesive suits microelectronic assembly applications.

UV Cure Adhesive suits microelectronic assembly applications.

Engineered Material Systems    Delaware, OH 43015
Apr 08, 2014 Formulated to cure rapidly when exposed to high-intensity UV light, 535-10M-49 is suited for disk drive assemblies, lens bonding in camera modules, chip encapsulation in smart cards, and general bonding applications in photonics assembly. Epoxy adhesive contains secondary thermal cure initiator that cures as low as 110°C for shadowed areas. Non-conductive, low outgassing, and ionically clean, 535-10M-49 exhibits low shrinkage, is extremely flexible, and does not contain antimony.
Conductive Adhesive targets die-attach applications.

Conductive Adhesive targets die-attach applications.

Engineered Material Systems    Delaware, OH 43015
Feb 19, 2014 Able to cure in 30 minutes at 80°C or in seconds at 200°C, CA-180 Low Temperature Cure/Snap Cure Conductive Adhesive has optimized rheology for needle dispensing by time-pressure, auger, or positive displacement. After curing for 30 minutes at 80°C, electrical conductivity is 0.00006 Ω-cm. Product is suited for die-attach applications in smart cards, circuit assembly, photonics, and camera modules.
Epoxy Adhesive suits microelectronic assembly applications.

Epoxy Adhesive suits microelectronic assembly applications.

Engineered Material Systems    Delaware, OH 43015
Jan 14, 2014 Designed to cure rapidly when exposed to high-intensity UV light, 535-10M-45 Epoxy Adhesive contains secondary thermal cure initiator that cures as low as 90°C for shadowed areas. Low outgassing, non-conductive, ionically clean product does not contain antimony and has low glass transition temperature. Material is suited for disk drive assemblies, lens bonding in camera modules, chip encapsulation in smart cards, and general bonding applications in photonics assembly.
Conductive Adhesive suits die attach applications.

Conductive Adhesive suits die attach applications.

Engineered Material Systems    Delaware, OH 43015
Jan 10, 2014 Designed for lead-frame die attach applications in semiconductors, circuit assembly, photonics, or camera modules, CA-175 Snap Cure Conductive Adhesive has moderate glass transition temperature (Tg) and modulus. Rheology is optimized for needle dispensing by time-pressure, auger, or positive displacement. Able to achieve full cure in 8 sec at 200°C, adhesive is modified to provide conductivity stability during damp heat testing on tin, silver, and copper surfaces.
Dry Film Negative Photoresist targets MEMS applications.

Dry Film Negative Photoresist targets MEMS applications.

Engineered Material Systems    Delaware, OH 43015
Nov 06, 2013 Optimized for hot roll lamination and processing on MEMS and IC wafers, DF-3020 Antimony-free Photoresist is available for sampling in 20 µm thickness, ±1 µm and can be manufactured from 5–25 µm thick. Film features glass transition temperature of 165°C and moderate modulus of 4 GPa at 25°C. Hydrophobic in nature, cured chemistry can withstand harsh environments including extreme moisture conditions and corrosive chemicals.

Conductive Adhesive is intended for solar cell applications.

Engineered Material Systems    Delaware, OH 43015
Sep 16, 2013 Intended for back contact applications in crystalline silicon solar modules, DB-1588-3 is stress absorbing to withstand thermal cycling effects and features conductive stability to back contact metallizations during damp heat exposure. Adhesive specifically makes contact from vias or other conductors on solar cells to back contact sheet and is designed to cure through encapsulant lamination and cure process.

LED Die Attach Adhesive exhibits high thermal conductivity.

Engineered Material Systems    Delaware, OH 43015
Sep 12, 2013 Used for attaching LED and other small semiconductor die to silver and copper lead frames, CA-195 has dispense open time of >24 hr (measured as 25% increase in viscosity) while maintaining optimized rheology for pin transfer or needle dispensing. Electrically conductive solution features glass transition temperature (Tg) that facilitates wire bonding small die, low extractable ionics as well as adhesion to silver and copper lead frames.
Jettable Conductive Adhesive is suited for PV stringing, bussing.

Jettable Conductive Adhesive is suited for PV stringing, bussing.

Engineered Material Systems    Delaware, OH 43015
Jul 02, 2013 Intended for ribbon stringing and bussing in photovoltaic (PV) applications, CA-148 Jettable Electrically Conductive Adhesive features moderate glass transition temperature (Tg) and modulus. Formula has optimized rheology for jet dispensing and is modified to provide conductivity stability during damp heat testing on tin, silver, and copper surfaces.
Negative I-Line Photoresist has hydrophobic cured chemistry.

Negative I-Line Photoresist has hydrophobic cured chemistry.

Engineered Material Systems    Delaware, OH 43015
Jun 25, 2013 With formulation optimized for spin coating and processing on micro-electromechanical systems (MEMS) and IC wafers, NR-2500 Liquid Negative Photoresist has cured chemistry that provides resistance to moisture and corrosive chemicals. Product is compatible with EMS dry-film photoresists and features glass transition temperature of 165°C and moderate modulus of 4.5 GPa at 25°C. NR series comes in solids/viscosities that achieve 2–40 µm thickness in single layer.


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Apr 01, 2014

Engineered Material Systems Introduces Highly Stretchable/Durable /Creasable Conductive Silver Ink for Wearable Electronics






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