Quad-Core Application Processor exceeds 1.4 GHz per core.

Samsung Electronics Co., Ltd.    Seoul, 100-742
May 24, 2012 Built on 32 nm High-k Metal Gate process technology, Exynos 4 Quad is suited for heavy-load applications such as video editing and calculation-intensive simulation. Hot-plug functionality supports on-off switching for each core, while per-core DVFS minimizes power consumption by adapting different levels of voltage and frequency when changing workloads. Measuring 12 x 12 x 1.37 mm, processor incorporates full HD 30 fps video hardware codec engine for 1080p video recording and play-back.

Multifunction Wireless Printer is optimized for SOHO integration.

Samsung Electronics Co., Ltd.    Seoul, 100-742
Jul 19, 2010 Intended for SOHO applications, SCX-4263FW incorporates one-touch Wi-Fi Protected Set-Up (WPS) to facilitate installation and AnyWeb Print software for selective information printing. Energy Star®-compliant unit, measuring 12.6 x 16.4 x 16.1 in., has 250-page, enclosed paper cassette tray and prints at speed up to 23 ppm. Blue navigational compass guides users through several functions and features for printing, scanning, faxing, and copying needs.

Dual Inline Memory Module suits server applications.

Samsung Electronics Co., Ltd.    Seoul, 100-742
Jul 16, 2010 Using 40 nm class DDR3 chips, 32 GB Load-Reduced Dual-Inline Memory Module operates at 1.35 or 1.5 V and supports next generation servers designed for virtualization, cloud computing, and other high-capacity applications. LRDIMM consists of 72 4 Gb DDR3 chips and additional memory buffer chip to help minimize load on memory subsystem. Servers equipped with LRDIMMs can process data at 1,333 Mbps, and by using 32 GB LRDIMMs, memory capacity can rise up to 384 GB per CPU.

Single-Head HDD suits high-performance computing.

Samsung Electronics Co., Ltd.    Seoul, 100-742
Jul 16, 2010 Operating at 7,200 rpm and providing up to 320 GB storage capacity, Spinpoint F4 offers SATA 3.0 Gbps interface and delivers performance and reliability for high-end PC/Mac workstations and server applications. RoHS-compliant 3.5 in. drive does not have any halogen compound or brominated flame retardant in PCBA. Dynamic balancing technology contributes to overall stability and reliability, while SilentSeek(TM) and NoiseGuard(TM) technologies lend to quiet operation.

High-Speed 512 GB SSD uses toggle-mode DDR NAND memory.

Samsung Electronics Co., Ltd.    Seoul, 100-742
Jul 16, 2010 Providing electronic data processing application designers with performance and reliability for notebooks, 512 GB SSD employs 30 nm, 32 Gb chip. Toggle-mode DDR structure, together with SATA 3.0 Gbps interface, generates max sequential read and write speeds of 250 and 220 MBps, respectively. Along with reinforced 256-bit AES encryption, other features include streamlined boot time and application access, intelligent operation management function, and intelligent power management.

NAND Memory has 8 gigabit capacity.

Samsung Electronics Co., Ltd.    Seoul, 100-742
Jun 10, 2010 Based on single-level-cell (SLC) NAND flash design, OneNAND(TM) chip addresses code data storage demands in smartphones that have large amounts of application and multimedia software. Unit's low-voltage design also suits it for handling code data used in touchscreens and other high-resolution applications. Able to read data at 70 MB/sec, chip also has NOR Flash interface that allows use as buffer memory for writes as well as buffer for high-performing read operations.

CMOS Imagers for Webcams capture HD images in real-time.

Samsung Electronics Co., Ltd.    Seoul, 100-742
Jun 10, 2010 Intended for use in notebook computers and other devices requiring video capture, 1.3 MP S5K6A1 and 2.1 MP S5K5B3 image sensors utilize 1.75 µm pixel technology to optimize low-light sensitivity and reach 70 Lux. Both support multiple platforms architectures and controllers with both parallel and MIPI interfaces. S5K5B3 supports camera modules with full 1080p HD at 30 fps in z-height less than 4.5, while S5K6A1 supports camera modules with 720p HD at 30 fps in z-height less than 3.5 mm.

CMOS Image Sensors bring HD to smartphones, mobile handsets.

Samsung Electronics Co., Ltd.    Seoul, 100-742
May 07, 2010 Designed to fit into 6.5 x 6.5 x 4.5 mm module, S5K4E2 is ¼ in., 1.4 micron, 5 megapixel chip with extended depth of field IP for crisp, sharp images. It supports barcode and business card scanning as well as capture of clear video images at up to 15 fps at full resolution. For 6.5 x 6.5 mm fixed focus camera modules, S5K5CA is 1/5 in., 1.4 micron, 3 MP imager that combines image signal processor (ISP) with CMOS image sensor into one SoC. It also offers 720p HD video capabilities.

Multi-Die Memory Package measures 0.6 mm in height.

Samsung Electronics Co., Ltd.    Seoul, 100-742
Dec 22, 2009 Intended for high-density multimedia handsets and mobile devices, Multi-Die Package consists of 8 identical dies and uses 30 nm class, 32 Gb NAND flash chips, each measuring 15 µm to deliver 32 GB NAND solution. Package technology can be adapted to other existing MCPs, and configured as system in packages or package on packages.

Application Processors target mobile devices.

Samsung Electronics Co., Ltd.    Seoul, 100-742
Dec 21, 2009 Based on 1 GHz ARM® CORTEX(TM)A8 processor, Model S5PC110 is targeted for SFF connected devices such as multimedia intensive smartphones, while Model S5PV210 is aimed at portable computing devices such as netbooks. Each comes with 32 KB data and 32 KB instruction caches as well as 512 KB L2 cache. POWERVR SGX 3D graphics engine supports 3D UI, while 1080p HD codec engine supports 30 fps full HD video playback and recording, and HDMI 1.3 interface allows output of multimedia content.