Stencil Solution meets ultra fine-pitch printing demands.

DEK International GmbH    Zurich, Ch-8005
Mar 12, 2009 Micro-engineered to meet challenges of fine-pitch printing, VectorGuard® Platinum provides semiconductor manufacturers with platform suited for applications such as wafer level packaging, direct chip attach, flip chip, and ball grid arrays. It delivers aperture accuracies of less than 3 µm and positional tolerances of better than 20 µm at pitches down to 50 µm. Also, optimal process efficiency is ensured by generating accurate paste transfer and consistent paste volume repeatability.

Dual Lane PCB Conveyor boosts throughput and flexibility.

DEK International GmbH    Zurich, Ch-8005
Nov 03, 2008 Utilizing core cycle time of 4 sec, Europa Dual Lane RTC (Rapid Transit Conveyor) lets manufacturers double their throughput with parallel processing on 2 lanes. It combines dual lane and board transport technologies with mass imaging platform to promote true continuous printing and ongoing productivity. Having dual lane machines configured for front printing or rear pass-through facilitates line-out, eliminates ancillary handling equipment, and maximizes floor utilization.

Reel-to-Reel Printer aids continuous substrate manufacture.

DEK International GmbH    Zurich, Ch-8005
Oct 23, 2007 Dedicated R2R (Reel-to-Reel) solution enables precision printing on continuous substrates up to 150 m long and 500 mm wide, such as flexible printed circuits and advanced synthetic materials. Precision screen printing enables manufacturers to deposit advanced materials onto flexible substrates directly from reel. Printer offers repeatable motion-control and substrate-clamping techniques that enable step-and-repeat sequences for optimal control and minimal waste.

Automated Tooling System handles high-density boards.

DEK International GmbH    Zurich, Ch-8005
Sep 11, 2007 Able to support entire PCB assembly, HD Grid-Lok® requires minimal intervention from line operator and eliminates delay associated with dedicated tooling fixture configuration. Tooling fixture is activated via one button, and 12 mm pin pitch can be set-up in seconds to provide complete, flexible board support. Based on a modular foundation concept, solution will conform to any given board profile and can be reset in seconds for all subsequent boards.

Panel Carrier facilitates substrate centering and transport.

DEK International GmbH    Zurich, Ch-8005
Jul 23, 2007 Consisting of base carrier with consumable foil, Virtual Panel Carrier enables multiple component support and alignment during screen printing and all subsequent assembly processes. Substrates are held in carrier via 4-sided tensioning mechanism and then aligned within carrier using centering system. Parts are referenced using two global fiducials, enabling transfer of VPC throughout all assembly processes.

Imaging System manages materials for packaging applications.

DEK International GmbH    Zurich, Ch-8005
Jul 23, 2007 Comprised of scalable materials management cartridges, ProFlow(TM) enclosed head deposition system, and Europa printing platform, M3i offers programmable ratio mix control and imaging of variety of materials. System can be used for underfill and encapsulation as well as solar cell and fuel cell imaging. Since M3i operates in real-time and is fully automated and programmable, errors introduced by operator intervention are eliminated.

Mass Imager performs singulated substrate processing.

DEK International GmbH    Zurich, Ch-8005
Aug 31, 2006 SinguLign(TM) enables mass imaging of multiple materials such as solder paste, solder spheres, flux, and adhesive onto singulated substrates or components directly from carrier. Through use of printing platform, specialized tooling, carrier, and miniaturized print or ball placement head, precise deposits can be applied to individual parts down to 20 mm. Tooling and parts handling mechanisms enable processing times of 20 sec and less for individual parts, depending on process.

PCB Inspection System features four-second cycle time.

DEK International GmbH    Zurich, Ch-8005
Jan 31, 2006 RTC(TM) (Rapid Transit Conveyor) system incorporates HawkEye(TM) technology, which utilizes inspection philosophy that isolates faults through good/bad verification and can verify 100% of printed boards within line beat rate by analyzing streamed images. System grips board, adapts to its dimensions, and transports it into printing position, resulting in 4 sec core cycle time. To isolate bad boards, system records pass/fail per board against preset thresholds.

Backside Wafer Coating is enabled by mass imaging platform.

DEK International GmbH    Zurich, Ch-8005
Aug 10, 2005 High-throughput backside wafer coating process is capable of exceeding the ±12.5 µm Total Thickness Variation (TTV) required by wafer processing specialists. Process, compatible with underfill or adhesive-type coatings normally applied to backside of semiconductor wafers prior to singulation, is also compatible with company's metal stencil and emulsion screen technologies.

Products and Services offer comprehensive lead-free solution.

DEK International GmbH    Zurich, Ch-8005
Jun 15, 2005 DEK Lead-Freeâ„¢ Branded products include stencils for lead-free solder paste, squeegees and cleaning materials, lead-free stencil storage, and lead-free Printer Caddy. Formalized approach to implementing lead-free pre-placement begins with focused process audit and Site Implementation Plan methodology. Tutored workshop sessions are provided with unlimited Q and A, allowing customers to gain hands-on experience with lead-free materials and processes.