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DEK International GmbH
Geroldstrasse 28
Zurich, Switzerland

Detailed Contact Information:
Electronics Printing Platform increases ouput capacity.   Return to story
Company Information:
DEK International GmbH
Geroldstrasse 28
Zurich  Ch-8005   Switzerland
Phone: +41 1 274 80 20
FAX: +41 1 274 80 22
http://www.dek.com
Public Relations:
Laura Sims
USA
Phone: 770-829-4757
Send email  E-mail this person
General Information:
Tracey Khoo
- select one -
Phone: 65-9837-0338
Send email  E-mail this person
 
Latest New Product News from DEK International GmbH
Products or services this company supplies:
 
Click links to find other companies which supply the same products or services.

Electronics Printing Platform increases ouput capacity.

DEK International GmbH    Zurich, Ch-8005
Apr 23, 2014 Based on Horizon iX series, Gemini enables high-volume electronics manufacturers to increase output while ensuring accuracy, quality, and yield. This back-to-back (B2B) printing system, delivering modular processing on-demand, features GUI for usability, can manage 508 x 508 mm print area in industry standard frame, and produces as many as 300 boards/hr. Independent functionality allows one printer to continue running while managing product changeover on other.
Stencil Solution meets ultra fine-pitch printing demands.

Stencil Solution meets ultra fine-pitch printing demands.

DEK International GmbH    Zurich, Ch-8005
Mar 12, 2009 Micro-engineered to meet challenges of fine-pitch printing, VectorGuard® Platinum provides semiconductor manufacturers with platform suited for applications such as wafer level packaging, direct chip attach, flip chip, and ball grid arrays. It delivers aperture accuracies of less than 3 µm and positional tolerances of better than 20 µm at pitches down to 50 µm. Also, optimal process efficiency is ensured by generating accurate paste transfer and consistent paste volume repeatability.
Dual Lane PCB Conveyor boosts throughput and flexibility.

Dual Lane PCB Conveyor boosts throughput and flexibility.

DEK International GmbH    Zurich, Ch-8005
Nov 03, 2008 Utilizing core cycle time of 4 sec, Europa Dual Lane RTC (Rapid Transit Conveyor) lets manufacturers double their throughput with parallel processing on 2 lanes. It combines dual lane and board transport technologies with mass imaging platform to promote true continuous printing and ongoing productivity. Having dual lane machines configured for front printing or rear pass-through facilitates line-out, eliminates ancillary handling equipment, and maximizes floor utilization.
Reel-to-Reel Printer aids continuous substrate manufacture.

Reel-to-Reel Printer aids continuous substrate manufacture.

DEK International GmbH    Zurich, Ch-8005
Oct 23, 2007 Dedicated R2R (Reel-to-Reel) solution enables precision printing on continuous substrates up to 150 m long and 500 mm wide, such as flexible printed circuits and advanced synthetic materials. Precision screen printing enables manufacturers to deposit advanced materials onto flexible substrates directly from reel. Printer offers repeatable motion-control and substrate-clamping techniques that enable step-and-repeat sequences for optimal control and minimal waste.

Automated Tooling System handles high-density boards.

DEK International GmbH    Zurich, Ch-8005
Sep 11, 2007 Able to support entire PCB assembly, HD Grid-Lok® requires minimal intervention from line operator and eliminates delay associated with dedicated tooling fixture configuration. Tooling fixture is activated via one button, and 12 mm pin pitch can be set-up in seconds to provide complete, flexible board support. Based on a modular foundation concept, solution will conform to any given board profile and can be reset in seconds for all subsequent boards.

Panel Carrier facilitates substrate centering and transport.

DEK International GmbH    Zurich, Ch-8005
Jul 23, 2007 Consisting of base carrier with consumable foil, Virtual Panel Carrier enables multiple component support and alignment during screen printing and all subsequent assembly processes. Substrates are held in carrier via 4-sided tensioning mechanism and then aligned within carrier using centering system. Parts are referenced using two global fiducials, enabling transfer of VPC throughout all assembly processes.

Imaging System manages materials for packaging applications.

DEK International GmbH    Zurich, Ch-8005
Jul 23, 2007 Comprised of scalable materials management cartridges, ProFlow(TM) enclosed head deposition system, and Europa printing platform, M3i offers programmable ratio mix control and imaging of variety of materials. System can be used for underfill and encapsulation as well as solar cell and fuel cell imaging. Since M3i operates in real-time and is fully automated and programmable, errors introduced by operator intervention are eliminated.

Mass Imager performs singulated substrate processing.

DEK International GmbH    Zurich, Ch-8005
Aug 31, 2006 SinguLign(TM) enables mass imaging of multiple materials such as solder paste, solder spheres, flux, and adhesive onto singulated substrates or components directly from carrier. Through use of printing platform, specialized tooling, carrier, and miniaturized print or ball placement head, precise deposits can be applied to individual parts down to 20 mm. Tooling and parts handling mechanisms enable processing times of 20 sec and less for individual parts, depending on process.

PCB Inspection System features four-second cycle time.

DEK International GmbH    Zurich, Ch-8005
Jan 31, 2006 RTC(TM) (Rapid Transit Conveyor) system incorporates HawkEye(TM) technology, which utilizes inspection philosophy that isolates faults through good/bad verification and can verify 100% of printed boards within line beat rate by analyzing streamed images. System grips board, adapts to its dimensions, and transports it into printing position, resulting in 4 sec core cycle time. To isolate bad boards, system records pass/fail per board against preset thresholds.
Backside Wafer Coating is enabled by mass imaging platform.

Backside Wafer Coating is enabled by mass imaging platform.

DEK International GmbH    Zurich, Ch-8005
Aug 10, 2005 High-throughput backside wafer coating process is capable of exceeding the ±12.5 µm Total Thickness Variation (TTV) required by wafer processing specialists. Process, compatible with underfill or adhesive-type coatings normally applied to backside of semiconductor wafers prior to singulation, is also compatible with company's metal stencil and emulsion screen technologies.


Click below for more Product News from DEK International GmbH

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Other Company News From DEK International GmbH

Nov 21, 2013

Dethon EMS Partners with DEK for Comprehensive Printing Solutions and Support


Jan 14, 2013

DEK Says "Bring It" to APEX


Dec 22, 2011

Indium Corporation Snaps up DEK Horizon 01iX at Productronica 2011


Mar 10, 2008

Metallization Line "In A Box" Helps Solar Cell Start-Ups and Enables "Pay As You Grow" Flexibility


Feb 29, 2008

DEK Looks Forward to Amper 2008 - Hall 5, Stand 5D19


Feb 13, 2008

David Byrd Appointed Global Manager for Engineered Products


Feb 13, 2008

Kent Ang to Lead DEK's Electroform and Platinum Stencil Production in Asia


Sep 19, 2007

DEK Invites Visitors to 'Expect More' at Forum de l'Electronique 2007


Aug 31, 2007

New DEK Partnership Delivers Complete Solar Cell Manufacturing Solution


Aug 30, 2007

New Shenzhen Manufacturing Facility Enables DEK Customers to 'Expect More'


Jun 22, 2007

DEK Strengthens Presence in Asia with Key Appointments


Jun 08, 2007

DEK Celebrates On-Stand Success at Nepcon 2007


May 24, 2007

DEK Receives Intel's Preferred Quality Supplier Award


May 18, 2007

DEK Announces New Addition to VectorGuard® Stencil Range


May 16, 2007

DEK Expands VectorGuard(TM) Availability in Canada


Apr 04, 2007

DEK to Exhibit at Brazil's Upcoming Electronica Event


Mar 14, 2007

DEK Invites Visitors to "Expect More" at Nepcon 2007, Stand B40


Mar 14, 2007

Scanditron Named as Exclusive DEK Distributor for Baltic States


Mar 02, 2007

DEK Delivers on "Expect More" Message, Lands Innovation and Service Honors APEX


Dec 12, 2006

DEK's VectorGuard® Stencil System Wins Industry Honor


Nov 22, 2006

DEK CEO joins IPC SMEMA Council


Nov 15, 2006

DEK Reinforces Commitment to Alternative Energy Technologies


Oct 13, 2006

Global Technology Awards Honor DEK's Breakthrough Instinctiv(TM) Technology


Oct 04, 2006

Enhanced Horizon 02i Configuration Heralds Extra Value Throughout DEK Instinctiv(TM) Printer Family


Sep 22, 2006

New Global Marcom Director at DEK


Aug 18, 2006

DEK to Launch New Horizon APi and Showcase High-speed, High-performance Printer DEK Photon


Aug 16, 2006

3D Models Online Accelerate Spares and Upgrade Ordering for DEK Screen Printers


Aug 14, 2006

New CAD Platform Boosts Tooling Turnaround and Quality for DEK Customers


Aug 01, 2006

New Tools from DEK Enable 25 Micron Backside Wafer Coating at High-Speed


Jul 17, 2006

DEK Lands Advanced Packaging Awards Duo at Semicon West


Jul 12, 2006

Unrivalled Customer Support Gets the Green Light with DEK's ISCAN Health Check


Jul 07, 2006

DEK Revitalises Online Business Gateway


May 12, 2006

DEK's HawkEye(TM) Print Verification System Selected by Multi-Tech


Apr 26, 2006

Commitment to Customers and Constant Innovation Earns DEK International the 2006 Frost & Sullivan Award for Market Leadership


Apr 21, 2006

DEK France Appoints New Operations Manager


Apr 06, 2006

DEK's ProFlow® DirEKt Imaging Technology Wins Prestigious Industry Manufacturing Award


Mar 31, 2006

DEK Looks Forward to SMT Germany 2006


Mar 21, 2006

Dek International Wins Intel's Preferred Quality Supplier Award


Feb 15, 2006

DEK Sweeps Industry Awards


Feb 09, 2006

DEK manufacturing facility awarded ISO approval


Feb 08, 2006

DEK and Assembleon team up to showcase product innovation


Jan 26, 2006

Assemblers Require Radically New Technologies on Five-Yearly Basis, Says DEK


Dec 13, 2005

DEK celebrates success of Northern German Stencil Day


Dec 06, 2005

VectorGuard(TM) reaches 700 frames in service, with roadmap to serve ever-widening range of applications


Nov 18, 2005

Latest lead-free research highlights new stencil design rules


Nov 17, 2005

DEK Micron Class range exceeds expectations


Nov 15, 2005

DEK


Nov 04, 2005

DEK Announces New ProFlow® Supply Agreement


Oct 28, 2005

DEK and Universal celebrate success of Hungarian Technology Day


Oct 14, 2005

Flash Electronics Receives Combined Strength Award from DEK


Oct 12, 2005

DEK's Singulated Substrate Process Delivers Increased Throughput through Unique Tooling Solution






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