Dry Etch Tool targets via reveal applications.

SPTS Technologies Limited    Newport,
Sep 07, 2012 Allowing flexible multiple mode operation with dual source design, Pegasus Rapier Module offers uniformities of ±2.5% on 300 mm bonded Through Silicon Via wafers. In its principal mode, optimum etch depth uniformity is achieved to edge exclusion of 3 mm, preserving total thickness variation of good incoming wafers. Available on Pegasus Rapier, ReVia(TM) end-point system detects point at which TSV chips are revealed, enabling consistent reveal height from one wafer to next.