On-Board Transceiver delivers 25 Gbps per channel.

FCI    Versailles Cedex,
Apr 05, 2013 Featuring 12 transmit and 12 receive channels, On-board Optical Transceiver minimizes amount of PCB real estate required. Connectivity to-and-from transceiver is realized by high-density front panel optical cabling system that features SFF optical adapters and multi-fiber cable assemblies, which can deliver port-to-port density of 12.5 mm and 12–48 optical fibers per port. Pluggable optical interface and lens-based coupling element facilitate mating and removal of optical cables.

QSFP+ Active Optical Cable Assemblies comply with Infiniband FDR.

FCI    Versailles Cedex,
Sep 06, 2012 Available in direct attach copper and active optical variants, XLerate-4X QSFP+ FDR cables increase linear PCB board port signal density to meet aggregate bandwidth requirements of 56 Gbps. These QSFP+ (quad small form-factor pluggable)-based active optical cable assemblies, fully compliant to Infiniband® FDR (Fourteen Data Rate - 14 Gb/s per channel) specification, have SMT 38-position edge card connector, PCB-mounted EMI metal cage, and diecast heat sink with mounting clip.

High Power Connectors suit electric/hybrid-electric vehicles.

FCI    Versailles Cedex,
Jan 14, 2009 Apex® 950 connectors offer current capacity of up to 150 A, while RCS-800 terminals feature 8 mm round pin and high number of contact points for operation up to 250 A. Surface platings protect against damage caused by arcing, and 2-step mating process and 3 sec delay between power cutoff and release promotes safety. Terminals are encased in plastic protective grid that physically prevents them being touched, and interlock device ensures that there is no risk of unmating during load.

High-Speed I/O Links offer 10 Gbps per channel performance.

FCI    Versailles Cedex,
Jan 13, 2009 Meeting 10GBase-CX4 Ethernet and Infiniband® industry standards, DensiShield(TM) copper I/O solution has 4-channel capability and delivers 40 Gbps aggregate bandwidth. Its 10 Gbps per channel differential performance can be achieved at 6 m or less utilizing 30 AWG cable, at 8 m or less utilizing 28 AWG cable, and 10 m or less utilizing 26 AWG cable. Solution can accommodate card slot pitch as low as 15 mm and achieve port-to-port centerline of 12.5 mm along card edge.

Type C Headers feature pin-in-paste termination..

FCI    Versailles Cedex,
Feb 22, 2008 The 2 mm Millipacs® family consists of 5-row and 8-row versions suitable for solder-to-board, pin-in-paste applications. To incorporate into board assembly process, design features reflow temperature resistant resin, is packaged in tape, has pick-up cap for automatic pick-and-place by vacuum nozzle, and meets all requirements of IEC 61076-4-101.